Abstract: A circuit includes a voltage divider circuit configured to generate a feedback voltage according to an output voltage, an operational amplifier configured to output a driving signal according to the feedback voltage and a reference voltage and a pass gate circuit including multiple current paths. The current paths are controlled by the driving signal and connected in parallel between the voltage divider circuit and a power reference node.

Abstract: In some embodiments, digital logic components, such as those found in standard cells in integrated circuit devices, are used to synthesize signals with controllable waveforms that result in transmitted signals that meet certain requirements, such as above-threshold high openings and below-threshold over/under-shooting. In some embodiments, driving buffers with logic controls and delay chains are used to achieve controllable slew rates at rising and falling edges to minimize over/under shooting behavior in signals. In some embodiments, control logic and delay chains produce controllable rising/falling “stair-type” edges to obtain optimized damping waveform.

Abstract: A memory circuit includes a non-volatile memory cell, a comparator and a detection circuit. The comparator is coupled to the non-volatile memory cell, and configured to generate a first output signal. The comparator including a first input terminal and a first output terminal. The first input terminal is coupled to the non-volatile memory cell by a first node, and configured to receive a first voltage. The first output terminal is configured to output the first output signal. The detection circuit is coupled to the comparator and the non-volatile memory cell. The detection circuit is configured to latch the first output signal and disrupt a current path between at least the non-volatile memory cell and the comparator. The detection circuit includes a first inverter coupled to the first output terminal of the comparator and configured to generate an inverted first output signal.

Abstract: The present disclosure provides a crack detection unit (CDU), a semiconductor die, and a method of detecting a crack of a semiconductor die. The CDU comprises a switching circuit, a crack sensor, and a logic circuit. The switching circuit is configured to enable the crack sensor. The crack sensor is configured to be electrically connected to the switching circuit, the ground, and an operating voltage. The logic circuit is configured to be electrically connected to the switching circuit and the crack sensor, wherein the CDU is enabled based on an input of the logic circuit. The output of the logic circuit indicates whether the crack sensor contains a crack.

Abstract: A circuit structure is provided. The circuit structure may include a first die area including an output gate, a second die area including a circuit and an input gate and a die-to-die interconnect. The input gate may include a transistor. The circuit may be connected between the die-to-die interconnect and a gate region of the transistor. The circuit may include a MOS transistor. A first source/drain region of the MOS transistor may be connected to the die-to-die interconnect.

Abstract: A circuit structure is provided. The circuit structure may include a first die area including an output gate, a second die area including a circuit and an input gate and a die-to-die interconnect. The input gate may include a transistor. The circuit may be connected between the die-to-die interconnect and a gate region of the transistor. The circuit may include a PMOS transistor and an NMOS transistor. A first source/drain region of the PMOS transistor may be connected to a first source/drain region of the NMOS transistor and the die-to-die interconnect.

Abstract: A circuit includes a voltage divider circuit configured to generate a feedback voltage according to an output voltage, an operational amplifier configured to output a driving signal according to the feedback voltage and a reference voltage and a pass gate circuit including multiple current paths. The current paths are controlled by the driving signal and connected in parallel between the voltage divider circuit and a power reference node.

Abstract: In some embodiments, digital logic components, such as those found in standard cells in integrated circuit devices, are used to synthesize signals with controllable waveforms that result in transmitted signals that meet certain requirements, such as above-threshold high openings and below-threshold over/under-shooting. In some embodiments, driving buffers with logic controls and delay chains are used to achieve controllable slew rates at rising and falling edges to minimize over/under shooting behavior in signals. In some embodiments, control logic and delay chains produce controllable rising/falling “stair-type” edges to obtain optimized damping waveform.

Abstract: A circuit structure is provided. The circuit structure may include a first die area including an output gate, a second die area including a circuit and an input gate and a die-to-die interconnect. The input gate may include a transistor. The circuit may be connected between the die-to-die interconnect and a gate region of the transistor. The circuit may include a PMOS transistor and an NMOS transistor. A first source/drain region of the PMOS transistor may be connected to a first source/drain region of the NMOS transistor and the die-to-die interconnect.

Abstract: A stacked semiconductor arrangement is provided. The stacked semiconductor arrangement includes a dynamic pattern generator layer having an electrical component. The arrangement also includes a monitoring layer configured to evaluate electrical performance of the electrical component.

Abstract: Devices and methods are provided for monitoring a transient time in a device under test. A circuit includes a transient edge clipper circuit electrically coupled to the device under test. The transient edge clipper circuit is configured to remove voltage levels of a voltage waveform of the device under test which exceed a threshold range to generate a clipped voltage waveform. The circuit also includes logic circuitry electrically coupled to the transient edge clipper circuit. The logic circuitry is configured to generate a time delayed pulse signal representation of the clipped voltage waveform by injecting a predetermined time delay. The circuit also includes a converter circuit electrically coupled to the logic circuitry. The converter circuit is configured to generate a current signal based on the pulse signal representations.

Abstract: Devices and methods are provided for monitoring a transient time in a device under test. A circuit includes a transient edge clipper circuit electrically coupled to the device under test. The transient edge clipper circuit is configured to remove voltage levels of a voltage waveform of the device under test which exceed a threshold range to generate a clipped voltage waveform. The circuit also includes logic circuitry electrically coupled to the transient edge clipper circuit. The logic circuitry is configured to generate a time delayed pulse signal representation of the clipped voltage waveform by injecting a predetermined time delay. The circuit also includes a converter circuit electrically coupled to the logic circuitry. The converter circuit is configured to generate a current signal based on the pulse signal representations.

Abstract: A de-serialization circuit includes a clock generation circuit, a first and a second latch circuit. The clock generation circuit is configured to generate a set of phase clock signals based on a first clock signal and a control signal. Each phase clock signal of the set of phase clock signals being offset from adjacent phase clock signals of the set of phase clock signals by a phase value. The first latch circuit is configured to generate a first set of data signals based on the set of phase clock signals and an input data signal. The second latch circuit is configured to generate a second set of data signals based on a first phase clock signal of the set of phase clock signals and the first set of data signals. Each signal of the second set of data signals being aligned with each other, wherein the first clock signal is non-continuous.

Abstract: The present disclosure provides a method for operating a dynamic pattern generator (DPG) having a mirror array. The method comprises receiving a clock signal, determining a time delay based on the period of the clock signal, determining a first clock signal for toggling a first group of mirror cells in the mirror array, determining a second clock signal, lagging behind the first clock signal by the time delay, for toggling a second group of mirror cells in the mirror array, toggling the first group of mirror cells in the mirror array in response to the first clock signal, and toggling the second group of the mirror cells in the mirror array in response to the second clock signal.

Abstract: A stacked semiconductor arrangement is provided. The stacked semiconductor arrangement includes a dynamic pattern generator layer having an electrical component. The arrangement also includes a monitoring layer configured to evaluate electrical performance of the electrical component.

Abstract: A stacked semiconductor arrangement is provided. The stacked semiconductor arrangement includes a dynamic pattern generator layer having an electrical component. The arrangement also includes a monitoring layer configured to evaluate electrical performance of the electrical component.

Abstract: An electronic device is provided. The electronic device includes a memory configured to store an application, a processor configured to execute the application and to control a editable state of at least one of contents related to the application, and a sensor configured to sense at least one gesture input related to editing contents in the editable state, and the processor performs a editing function corresponding to the gesture input.

Abstract: A pedelec power system and housing thereof, which comprises: a first receiving portion, a plurality of connecting structures, a plurality of second receiving portions and a plurality of thermally conductive elements. The plurality of connecting structures and second receiving portions interlaced arranged surrounding the first receiving portion; at least one thermally conductive element is disposed in each connecting structure. A motor is arranged in the first receiving portion, a reduction device and a power electronic unit is arranged in the housing, and the reduction device and power electronic unit is coupled to the motor. At least one battery is arranged in each the second receiving portion.

Abstract: A circuit includes a signal generator, a delay pulse generator and a time-to-current converter. The signal generator is configured to generate a first signal including information on a rise delay and a second signal including information on a fall delay. A delay difference exists between the rise delay and the fall delay. The delay pulse generator is configured to provide an additional delay to one of the first and second signals. The time-to-current converter is configured to extract the delay difference.

Abstract: The present disclosure provides a method for operating a dynamic pattern generator (DPG) having a mirror array. The method comprises receiving a clock signal, determining a time delay based on the period of the clock signal, determining a first clock signal for toggling a first group of mirror cells in the mirror array, determining a second clock signal, lagging behind the first clock signal by the time delay, for toggling a second group of mirror cells in the mirror array, toggling the first group of mirror cells in the mirror array in response to the first clock signal, and toggling the second group of the mirror cells in the mirror array in response to the second clock signal.