Patents by Inventor Shaofeng Chen

Shaofeng Chen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10982242
    Abstract: The present invention relates to an optimized fermentation process of coenzyme Q10, particularly to a fermentation process of coenzyme Q10 via flow feeding based on cooperative control of changes of online oxygen consumption rate and conductivity. During the fermentation process of coenzyme Q10 production strains, the oxygen consumption rate is controlled between 30-150 mmol/L·h and the conductivity is maintained between 3.0-30.0 ms/cm via flow feeding, so as to facilitate strain growth and the start of coenzyme Q10 synthesis and accumulation. The present invention can substantially increase output of coenzyme Q10 and greatly reduce the production cost with simple process control and strong operability, thus being applicable to large-scale industrial production.
    Type: Grant
    Filed: October 21, 2016
    Date of Patent: April 20, 2021
    Assignees: SHANGYU NHU BIOLOGICAL CHEMICAL CO., LTD., ZHEJIANG UNIVERSITY, ZHEJIANG NHU COMPANY LTD.
    Inventors: Hongwei Yu, Yong Lv, Yong Li, Jianbo Chen, Shaofeng Chen, Weifeng Li, Hongmei Zhang, Yongqiang Zhu
  • Publication number: 20150380220
    Abstract: Implementations of the disclosure generally provide an improved pedestal heater for a processing chamber. The pedestal heater includes a temperature-controlled plate having a first surface and a second surface opposing the first surface. The temperature-controlled plate includes an inner zone comprising a first set of heating elements, an outer zone comprising a second set of heating elements, the outer zone surrounding the inner zone, and a continuous thermal choke disposed between the inner zone and the outer zone, and a substrate receiving plate having a first surface and a second surface opposing the first surface, the second surface of the substrate receiving plate is coupled to the first surface of the temperature-controlled plate. The continuous thermal choke enables a very small temperature gradient to be created and manipulated between the inner zone and the outer zone, allowing center-fast or edge-fast etching profile to achieve on a surface of the substrate.
    Type: Application
    Filed: June 23, 2015
    Publication date: December 31, 2015
    Inventors: Tien Fak TAN, Dmitry LUBOMIRSKY, Kirby H. FLOYD, Son T. NGUYEN, David PALAGASHVILI, Alexander TAM, Shaofeng CHEN
  • Patent number: 8339131
    Abstract: An electric field sensor comprising: a substrate having a hole; a shielding electrode and a sensing electrode, disposed in the hole of the substrate; a piezoelectric bar having one end connected to the center of the shielding electrode, the other end fixed on the substrate. Present invention provides several electric field sensors, which have the same feature of utilizing electrodes interleaving vibration to modulate external electric field. They have IC-compatible operation voltage and small volume.
    Type: Grant
    Filed: July 13, 2009
    Date of Patent: December 25, 2012
    Assignee: Institute of Electronics, Chinese Academy of Sciences
    Inventors: Shanhong Xia, Chao Ye, Chao Gong, Xianxiang Chen, Qiang Bai, Shaofeng Chen
  • Publication number: 20100071210
    Abstract: A method for manufacturing a faceplate of a semiconductor apparatus is provided. The method includes selecting a size of a tool in response to a predetermined specification of a predetermined gas parameter. The tool is used to form the holes within the faceplate. A first gas parameter of the holes of the faceplate is measured by an apparatus to determine if the measured first gas parameter of the holes of the faceplate is within the predetermined specification.
    Type: Application
    Filed: September 24, 2008
    Publication date: March 25, 2010
    Applicant: Applied Materials, Inc.
    Inventors: TIEN FAK TAN, Lun Tsuei, Shaofeng Chen, Felix Rabinovich, Dmitry Lubomirsky, Kimberly Hinckley
  • Publication number: 20090273337
    Abstract: An electric field sensor comprising: a substrate having a hole; a shielding electrode and a sensing electrode, disposed in the hole of the substrate; a piezoelectric bar having one end connected to the center of the shielding electrode, the other end fixed on the substrate. Present invention provides several electric field sensors, which have the same feature of utilizing electrodes interleaving vibration to modulate external electric field. They have IC-compatible operation voltage and small volume.
    Type: Application
    Filed: July 13, 2009
    Publication date: November 5, 2009
    Inventors: Shanhong XIA, Chao YE, Chao GONG, Xianxiang CHEN, Qiang BAI, Shaofeng CHEN
  • Publication number: 20060279271
    Abstract: An electric field sensor comprising: a substrate having a hole; a shielding electrode and a sensing electrode, disposed in the hole of the substrate; a piezoelectric bar having one end connected to the center of the shielding electrode, the other end fixed on the substrate. Present invention provides several electric field sensors, which have the same feature of utilizing electrodes interleaving vibration to modulate external electric field. They have IC-compatible operation voltage and small volume.
    Type: Application
    Filed: June 5, 2006
    Publication date: December 14, 2006
    Inventors: Shanhong Xia, Chao Ye, Chao Gong, Xianxiang Chen, Qiang Bai, Shaofeng Chen
  • Patent number: 6623605
    Abstract: A method and apparatus for fabricating a wafer spacing mask and a substrate support chuck. Such apparatus is a stencil containing a plurality of dual counterbored apertures that is positioned atop the substrate support chuck while material is deposited onto the stencil and through the apertures' openings onto the chuck. Upon completion of the deposition process, the stencil is removed from the workpiece support chuck leaving deposits of the material of various widths but the same heights to form the wafer spacing mask.
    Type: Grant
    Filed: December 6, 2001
    Date of Patent: September 23, 2003
    Assignee: Applied Materials, Inc.
    Inventors: Ruben Diaz, Shaofeng Chen
  • Publication number: 20030106196
    Abstract: A method and apparatus for fabricating a wafer spacing mask and a substrate support chuck. Such apparatus is a stencil containing a plurality of dual counterbored apertures that is positioned atop the substrate support chuck while material is deposited onto the stencil and through the apertures' openings onto the chuck. Upon completion of the deposition process, the stencil is removed from the workpiece support chuck leaving deposits of the material of various widths but the same heights to form the wafer spacing mask.
    Type: Application
    Filed: December 6, 2001
    Publication date: June 12, 2003
    Applicant: Applied Materials, Inc.
    Inventors: Ruben Diaz, Shaofeng Chen