Abstract: A light-emitting diode package structure and a manufacturing method thereof are provided. The light-emitting diode package structure includes a first substrate, a second substrate, a light-emitting module, and a driving module. The first substrate includes a light-emitting region defined thereon and a load circuit configured in the light-emitting region. The second substrate includes a control region defined thereon and a driving circuit configured in the control region. The first substrate and the second substrate are spaced apart from each other. The light-emitting module is disposed on the first substrate and electrically connected to the load circuit. The driving module is disposed on the second substrate and electrically connected to the driving circuit. The driving module is electrically connected to the light-emitting module.

Abstract: An LED package structure with phosphor encapsulant layer includes an LED chip, a first encapsulant layer, and a second encapsulant layer; the first encapsulant layer covers the LED chip mixed with a first type phosphor having an excitation emission peak wavelength in a first wavelength range; the second encapsulant layer covers a first encapsulant layer mixed with a second type phosphor having an excitation emission peak wavelength in a second wavelength range. At least one of the first type phosphor and the second type phosphor is distributed in the corresponding first encapsulant layer or the corresponding second encapsulant layer in a state where the bottom concentration is higher than the top concentration.

Abstract: A light-emitting diode package structure and a manufacturing method thereof are provided. The light-emitting diode package structure includes a first substrate, a second substrate, a light-emitting module, and a driving module. The first substrate includes a light-emitting region defined thereon and a load circuit configured in the light-emitting region. The second substrate includes a control region defined thereon and a driving circuit configured in the control region. The first substrate and the second substrate are spaced apart from each other. The light-emitting module is disposed on the first substrate and electrically connected to the load circuit. The driving module is disposed on the second substrate and electrically connected to the driving circuit. The driving module is electrically connected to the light-emitting module.

Abstract: An LED package structure with phosphor encapsulant layer includes an LED chip, a first encapsulant layer, and a second encapsulant layer; the first encapsulant layer covers the LED chip mixed with a first type phosphor having an excitation emission peak wavelength in a first wavelength range; the second encapsulant layer covers a first encapsulant layer mixed with a second type phosphor having an excitation emission peak wavelength in a second wavelength range. At least one of the first type phosphor and the second type phosphor is distributed in the corresponding first encapsulant layer or the corresponding second encapsulant layer in a state where the bottom concentration is higher than the top concentration.

Abstract: A green diode laser includes a tubular laser casing, a heat sink sealedly mounted at the laser casing, a semiconductor chip supported by the heat sink, an optical resonant cavity supported within the laser casing, including a lasing medium and an intracavity frequency doubler, an IR blocking filter inclinedly and seadedly mounted at the laser casing to optically communicate with an output facet, and a photodiode supported within the laser casing at a position that when the laser beam exits the output facet, the IR blocking filter reflects a portion of the laser beam towards the photodiode such that the photodiode is adapted for detecting the laser beam from the IR blocking filter as a feedback for controlling a power output of the green laser chip.

Abstract: A green diode laser includes a tubular laser casing, a heat sink sealedly mounted at the laser casing, a semiconductor chip supported by the heat sink, an optical resonant cavity supported within the laser casing, including a lasing medium and an intracavity frequency doubler, an IR blocking filter inclinedly and seadedly mounted at the laser casing to optically communicate with an output facet, and a photodiode supported within the laser casing at a position that when the laser beam exits the output facet, the IR blocking filter reflects a portion of the laser beam towards the photodiode such that the photodiode is adapted for detecting the laser beam from the IR blocking filter as a feedback for controlling a power output of the green laser chip.

Abstract: A method of integrating a plurality of cables (12) used for interconnecting electrical devices. In a preferred embodiment, firstly, a precursor cable is prepared and cut into a plurality of cables as required for a particular application. Secondly, the cables are put into a sleeve (14). First ends (16) and opposite second ends (18) of the cables protrude out suitable predetermined distances from opposite ends of the sleeve respectively. Thirdly, the cables are fixed in the sleeve. Finally, the first and second ends are precision cut as required for the particular application, and respectively joined to corresponding connectors as required for the particular application. A cable module (10) is thus formed. An alternative embodiment of the method is also disclosed.