Abstract: The present invention relates to a semiconductor chemical mechanical polishing sludge recycling device, which includes a roasting device, a soaking and stirring device, a first centrifugal dehydration device, a cleaning device and a second centrifugal dehydration device arranged thereon. The roasting device heat-treats the semiconductor chemical mechanical polishing sludge to remove the impurities. The soaking and stirring device is connected with the roasting device. The roasted semiconductor chemical mechanical polishing sludge is placed in the soaking and stirring device. The first centrifugal dehydration device is connected with the soaking and stirring device. A product obtained by the soaking and stirring device is solidified and concentrated through the first centrifugal dehydration device. The cleaning device is connected with the first centrifugal dehydration device. The second centrifugal dehydration device is connected with the cleaning device.

Abstract: The present invention relates to a semiconductor chemical mechanical polishing sludge recycling method, which comprises the following steps: (1) drying out the CMP sludge into a condition of solid; (2) putting the solid sludge obtained in step (1) into a high-temperature furnace for roasting; (3) putting the solid sludge obtained in step (2) into a reaction tank and adding a impregnating liquid for soaking, (4) performing a solid-liquid separation in step (3) to obtain a solid and a liquid, (5) performing a concentration reaction on the liquid separated in step (4) to obtain a copper sulfate aqueous solution by-product; (6) taking out the solid sludge obtained in step (4) and adding water for washing; (7) dehydrating a product obtained in step (6); (8) obtaining the solid dehydrated is the goods, and a sum of silicon dioxide and aluminum oxide on a dry basis is greater than 94%.

Abstract: A bag of a notebook computer for containing the notebook computer is provided. The bag includes an upper cover, a lower cover, and a carrying handle. The lower cover is pivotally connected with the upper cover. The upper cover is capable of being closed to the lower cover to form a containing space for containing the notebook computer, and it is capable of being opened from the lower cover to expose the notebook computer. The carrying handle is connected with the upper cover and the lower cover, respectively, and it is disposed across a connecting place of the upper cover and the lower cover. When the lower cover is disposed at a supporting surface and the upper cover is opened, the carrying handle lifts the lower cover so that an angle is formed between the lower cover and the supporting surface.

Abstract: A fan module including a fan and a light source set is provided. The fan includes a frame and a blade set. The frame has a accommodating space, an air inlet and an air outlet, and the air inlet and the air outlet are communicated with each other. The blade set is provided at the accommodating space. The light source set is provided at the frame as an independent module and has a circuit board and a plurality of light-emitting elements provided at the circuit board. Another fan module including a blade set base, a light source set, and a support is provided, wherein the light source set is provided at the blade set base. The light source set includes a circuit board and at least one light-emitting elements provided at the circuit board, and the circuit board is disposed between the blade set base and the support.