Abstract: A display module includes a substrate, m rows and n columns of pad sets, m*n sets of light emitting chip sets and multiple pins. The substrate includes a first surface and a second surface disposed opposite to each other. Each set of pad sets among the m rows and n columns of pad sets includes three pairs of pads, and first pads in the each set of pad sets are electrically connected. In a same set of light emitting chips, each of first electrodes of the light emitting chips is connected to a respective one of first pads of one set of pad sets among the m rows and n columns of pad sets, and each of second electrodes of the light emitting chips is connected to a respective one of second pads of a same set of pad sets.

Abstract: A LED display unit group includes a substrate and an electronic device, where the substrate includes a pad layer, an ink layer and an identification structure, the pad layer is disposed on a first surface of a side of the substrate adjacent to the electronic device; the pad layer includes pad regions and a non-pad region, each of the pad regions includes multiple pads, and the non-pad region includes metal traces; and the ink layer is disposed above the pad layer; each of the multiple pads is configured to secure the electronic device and is electrically connected to the electronic device; the metal traces are configured to connect the multiple pads via the metal traces; and an orthographic projection of the identification structure on the substrate is partially overlapped or staggered with an orthographic projection of the pad regions on the substrate.

Abstract: Provided are a LED display unit group and a display panel. The LED display unit group includes a circuit board and pixel units. The circuit board includes N metal wiring layers stacked in sequence and an insulating plate disposed between adjacent metal wiring layers, and the N metal wiring layers are electrically connected through conductive vias on the insulating plate. The pixel units are arranged in an array of m rows and n columns and disposed on the circuit board. Each pixel unit includes at least two LED light-emitting chips with different emitted colors, each LED light-emitting chip is fixed on a first metal wiring layer. The first metal wiring layer includes m common A-electrode pads, A-electrode pads, and B-electrode pads. All the A-electrode pads corresponding to each row of pixel units are integrally formed with and electrically connected to one corresponding common A-electrode pad.

Abstract: The server disclosed in the present disclosure receives a feature identification transmitted by a feature acquisition device, acquires information of a client terminal corresponding to the feature identification according to the feature identification, and transmits the acquired information of the client terminal to the feature acquisition device. The present disclosure can apply feature identification techniques such as a fingerprint sensor to the social life, thus not only facilitating a client terminal (e.g., a user) to exchange personal information rapidly but also avoiding problems such as information loss or record error.