Patents by Inventor Shao Jian Chen

Shao Jian Chen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Solid electrolytic capacitor and method for manufacturing the same
    Patent number: 8848343
    Abstract: An improved capacitor is described. The capacitor has an anode with an anode lead wire extending from a first face of the anode. A dielectric layer is on the anode and a cathode is on the dielectric. An anode lead with an anode base and a cavernous anode protrusion extending from the base is provided wherein the anode lead wire is in electrical contact with the anode protrusion. A cathode lead with a cathode base is provided wherein the cathode base is in electrical contact with the cathode on a side face wherein the side face is adjacent the first face and the cathode base and said anode base are coplanar.
    Type: Grant
    Filed: October 12, 2012
    Date of Patent: September 30, 2014
    Assignee: Kemet Electronics Corporation
    Inventors: David Jacobs, Sheng Jie Xu, Shao Jian Chen, Xiao Juan Ye, Keith Lee Moore
  • SOLID ELECTROLYTIC CAPACITOR AND METHOD FOR MANUFACTURING THE SAME
    Publication number: 20140104756
    Abstract: An improved capacitor is described. The capacitor has an anode with an anode lead wire extending from a first face of the anode. A dielectric layer is on the anode and a cathode is on the dielectric. An anode lead with an anode base and a cavernous anode protrusion extending from the base is provided wherein the anode lead wire is in electrical contact with the anode protrusion. A cathode lead with a cathode base is provided wherein the cathode base is in electrical contact with the cathode on a side face wherein the side face is adjacent the first face and the cathode base and said anode base are coplanar.
    Type: Application
    Filed: October 12, 2012
    Publication date: April 17, 2014
    Inventors: David Jacobs, Sheng Jie Xu, Shao Jian Chen, Xiao Juan Ye, Keith Lee Moore
  • Integrated circuit package system for chip on lead
    Patent number: 7701042
    Abstract: An integrated circuit package system includes providing an integrated circuit die having planar dimensions; forming a lead extended across one of the planar dimensions of the integrated circuit die; and applying an adhesive layer over the lead of a side opposite the integrated circuit die.
    Type: Grant
    Filed: September 18, 2007
    Date of Patent: April 20, 2010
    Assignee: Stats Chippac Ltd.
    Inventors: Shao Jian Chen, Wei Qiang Jin, Bhoy Ching, Taw Ming Lau
  • INTEGRATED CIRCUIT PACKAGE SYSTEM FOR CHIP ON LEAD
    Publication number: 20080073781
    Abstract: An integrated circuit package system includes providing an integrated circuit die having planar dimensions; forming a lead extended across one of the planar dimensions of the integrated circuit die; and applying an adhesive layer over the lead of a side opposite the integrated circuit die.
    Type: Application
    Filed: September 18, 2007
    Publication date: March 27, 2008
    Inventors: Shao Jian Chen, Wei Jin, Bhoy Ching, Taw Ming Lau