Patents by Inventor Shao Kang Yang

Shao Kang Yang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240088023
    Abstract: An interconnect structure includes a dielectric layer, a first conductive feature, a hard mask layer, a conductive layer, and a capping layer. The first conductive feature is disposed in the dielectric layer. The hard mask layer is disposed on the first conductive feature. The conductive layer includes a first portion and a second portion, the first portion of the conductive layer is disposed over at least a first portion of the hard mask layer, and the second portion of the conductive layer is disposed over the dielectric layer. The hard mask layer and the conductive layer are formed by different materials. The capping layer is disposed on the dielectric layer and the conductive layer.
    Type: Application
    Filed: November 20, 2023
    Publication date: March 14, 2024
    Inventors: Shao-Kuan LEE, Kuang-Wei YANG, Cherng-Shiaw TSAI, Cheng-Chin LEE, Ting-Ya LO, Chi-Lin TENG, Hsin-Yen HUANG, Hsiao-Kang CHANG, Shau-Lin SHUE
  • Publication number: 20230151815
    Abstract: A portable power supply device for an electric tool comprises: a power supply receiving portion, provided in or on a housing and used to receive a power supply supplying power to the electric tool, and a control unit, comprising a controller that is provided in the housing and is used to control the electric energy supplied to the electric tool. The power supply receiving portion comprises a power supply compartment, which is at least partially defined by a cover which can move relative to the housing between an opened position and a closed position. The power supply device further comprises a positioning accessory detachably and replaceably attached to the housing and/or the power supply receiving portion.
    Type: Application
    Filed: November 17, 2022
    Publication date: May 18, 2023
    Inventors: Wai Chung LEE, Shao Kang Yang, Zheng Qian Pan, Gerardo Quintanilla Avila