Patents by Inventor Shaopeng Dong

Shaopeng Dong has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • INSULATION LAYER FOR A SEMICONDUCTOR PACKAGE
    Publication number: 20240413032
    Abstract: A semiconductor package includes an insulation layer provided between a molding compound and an electromagnetic interface (EMI) layer. The insulation layer covers an exposed portion of a bond wire that extends beyond a top surface of the molding compound due to a Z-height reduction of the molding compound. The insulation layer prevents a short from occurring between the bond wire and the EMI layer.
    Type: Application
    Filed: July 31, 2023
    Publication date: December 12, 2024
    Inventors: Shaopeng Dong, Fen Yu, Weng Khoon Mong
  • SEMICONDUCTOR DEVICE INCLUDING REINFORCING BLOCKS
    Publication number: 20230402361
    Abstract: A semiconductor device includes a substrate, semiconductor dies on the substrate, molding compound and reinforcing blocks on the substrate. The reinforcing blocks may be provided at positions on the substrate where mechanical stresses develop in the device during singulation, such as at curves and/or discontinuous points around the outline of the substrate, to add strength to the substrate.
    Type: Application
    Filed: June 14, 2022
    Publication date: December 14, 2023
    Applicant: WESTERN DIGITAL TECHNOLOGIES, INC.
    Inventors: Shenghua Huang, Binbin Zheng, Shaopeng Dong, Songtao Lu, Rui Guo, Yangming Liu, Bo Yang, Ning Ye
  • Semiconductor device including vertically integrated groups of semiconductor packages
    Patent number: 10236276
    Abstract: A semiconductor device is disclosed including at least first and second vertically stacked and interconnected groups of semiconductor packages. The first and second groups of semiconductor packages may differ from each other in the number of packages and functionality.
    Type: Grant
    Filed: June 12, 2017
    Date of Patent: March 19, 2019
    Assignee: SanDisk Information Technology (Shanghai) Co., Ltd.
    Inventors: Yangming Liu, Chin-Tien Chiu, Zhongli Ji, Shaopeng Dong, Zengyu Zhou
  • SEMICONDUCTOR DEVICE INCLUDING VERTICALLY INTEGRATED GROUPS OF SEMICONDUCTOR PACKAGES
    Publication number: 20180294251
    Abstract: A semiconductor device is disclosed including at least first and second vertically stacked and interconnected groups of semiconductor packages. The first and second groups of semiconductor packages may differ from each other in the number of packages and functionality.
    Type: Application
    Filed: June 12, 2017
    Publication date: October 11, 2018
    Applicant: SANDISK INFORMATION TECHNOLOGY (SHANGHAI) CO., LTD.
    Inventors: Yangming Liu, Chin-Tien Chiu, Zhongli Ji, Shaopeng Dong, Zengyu Zhou