Patents by Inventor Shaoping Huang

Shaoping Huang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12610169
    Abstract: The present disclosure discloses a microphone module including at least two MEMS microphones, a printed circuit board, and a shell, each of the MEMS microphones is provided a sound inlet hole, a plurality of first sound pickup holes are provided on the printed circuit board, a plurality of second sound pickup holes are provided on the shell, each of the first sound pickup holes is communicating with the corresponding sound inlet hole and the corresponding second sound pickup hole, a diameter dimension of each of the first sound pickup holes is D1 mm, a distance between a center axes of adjacent sound inlet holes is greater than or equal to 25D1 mm and less than or equal to 43D1 mm. Compared with the related art, the microphone module disclosed by the present disclosure could have a better sound recognition effect.
    Type: Grant
    Filed: July 4, 2024
    Date of Patent: April 21, 2026
    Assignee: AAC ACOUSTIC TECHNOLOGIES (SHENZHEN) CO., LTD.
    Inventors: Dexing Wang, Jinyu Zhang, Yuanhua Tang, Shaoping Huang
  • Publication number: 20250227402
    Abstract: The present disclosure discloses a microphone module including at least two MEMS microphones, a printed circuit board, and a shell, each of the MEMS microphones is provided a sound inlet hole, a plurality of first sound pickup holes are provided on the printed circuit board, a plurality of second sound pickup holes are provided on the shell, each of the first sound pickup holes is communicating with the corresponding sound inlet hole and the corresponding second sound pickup hole, a diameter dimension of each of the first sound pickup holes is D1 mm, a distance between a center axes of adjacent sound inlet holes is greater than or equal to 25D1 mm and less than or equal to 43D1 mm. Compared with the related art, the microphone module disclosed by the present disclosure could have a better sound recognition effect.
    Type: Application
    Filed: July 4, 2024
    Publication date: July 10, 2025
    Inventors: Dexing Wang, Jinyu Zhang, Yuanhua Tang, Shaoping Huang
  • Publication number: 20250187906
    Abstract: An electronic device, and a shell module for packaging an electronic device, comprising a first shell and a second shell connected through an engagement-locking structure with a protruding inserting portion arranged on a first side of the first shell. The inserting portion is located between two engagement portions on the first side of the first shell, an inserting space is formed between two engagement portions that are on a third side of the second shell and nearest to the inserting portion, and a non-inserting space is formed between two locking portions that are on a fourth side of the second shell and nearest to the inserting portion. An orthographic projection of the inserting portion onto the inserting space completely falls within the inserting space, and an orthographic projection of the inserting portion onto the non-inserting space is at least partially located outside the non-inserting space, avoiding incorrect assembly.
    Type: Application
    Filed: August 5, 2024
    Publication date: June 12, 2025
    Inventors: Dexing Wang, Jinyu Zhang, Yuanhua Tang, Shaoping Huang