Abstract: The systems, methods, and devices disclosed herein relate to a multi-layer structures arranged in a vertically orientation. In some embodiments, a computing assembly can include a first cooling system, a first electronics layer, a second cooling system, and a second electronics layer. The first cooling system can be disposed on top of and can be in thermal communication with the first electronics layer. The first electronics layer array includes an array of integrated circuit dies that are in electronic communication with each other in a plane that is orthogonal to power delivery. The first electronics layer can be disposed on top of and can be in thermal communication with the second cooling system, and the second cooling system can be disposed on top of and can be in thermal communication with the second electronics layer. The second electronics layer includes an array of power delivery modules. In some embodiments, at least one layer can use system on wafer packaging.

Abstract: The systems, methods, and devices disclosed herein relate to a multi-layer structures arranged in a vertically orientation. In some embodiments, a computing assembly can include a first cooling system, a first electronics layer, a second cooling system, and a second electronics layer. The first cooling system can be disposed on top of and can be in thermal communication with the first electronics layer. The first electronics layer array includes an array of integrated circuit dies that are in electronic communication with each other in a plane that is orthogonal to power delivery. The first electronics layer can be disposed on top of and can be in thermal communication with the second cooling system, and the second cooling system can be disposed on top of and can be in thermal communication with the second electronics layer. The second electronics layer includes an array of power delivery modules. In some embodiments, at least one layer can use system on wafer packaging.

Abstract: The present disclosure relates to a field of humidifiers and in particular to an atomization humidifier that increases an amount of vapor through a specially designed atomizing air channel. The atomization humidifier includes a main body and an atomizing chamber arranged in the main body. The atomizing chamber includes an atomizing generator. An atomizing air channel is arranged on the atomizing generator. A flow guide plate is obliquely arranged on a top end of the atomizing air channel. A water inlet is arranged on an upper end of the atomizing air channel. An opening of the water inlet is upward. A lower end of the atomizing air channel is an air guide tube with hollow vacancies. The atomization humidifier realizes water vapor concentration by setting the atomizing air channel arranged on the atomizing generator, which improves an atomizing efficiency of the atomization humidifier by optimized structure, and is low in cost and good in atomizing effect.

Abstract: The present disclosure relates to a field of humidifiers and in particular to an atomization humidifier that increases an amount of vapor through a specially designed atomizing air channel. The atomization humidifier includes a main body and an atomizing chamber arranged in the main body. The atomizing chamber includes an atomizing generator. An atomizing air channel is arranged on the atomizing generator. A flow guide plate is obliquely arranged on a top end of the atomizing air channel. A water inlet is arranged on an upper end of the atomizing air channel. An opening of the water inlet is upward. A lower end of the atomizing air channel is an air guide tube with hollow vacancies. The atomization humidifier realizes water vapor concentration by setting the atomizing air channel arranged on the atomizing generator, which improves an atomizing efficiency of the atomization humidifier by optimized structure, and is low in cost and good in atomizing effect.