Patents by Inventor Shao Wei Li

Shao Wei Li has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Long and short-chain cycloaliphatic epoxy resin, cyanate ester and Lewis and Bronsted catalysts
    Patent number: 6844379
    Abstract: Compositions having high moisture resistance and flexibility comprise an organic component and a filler. The organic component comprises a long-chain cycloaliphatic epoxy resin, a short-chain cycloaliphatic epoxy resin, a cyanate ester, and a Lewis acid catalyst. Preferably the organic component further comprises a Bronsted acid co-catalyst and/or a flexibilizing modifier. The compositions are useful in various semiconductor applications, including as die attach adhesives, underfills, encapsulants, via fills, prepreg binders, polymer solder masks and polymer bumps on flip chip or BGA assemblies.
    Type: Grant
    Filed: November 19, 2002
    Date of Patent: January 18, 2005
    Assignee: Honeywell International Inc.
    Inventors: Xiao-Qi Zhou, Henry Wevick, Nancy Iwamoto, Shao Wei Li, Alan Grieve
  • Moisture resistant, flexible epoxy/cyanate ester formulation
    Publication number: 20030166746
    Abstract: Compositions having high moisture resistance and flexibility comprise an organic component and a filler. The organic component comprises a long-chain cycloaliphatic epoxy resin, a short-chain cycloaliphatic epoxy resin, a cyanate ester, and a lewis acid catalyst. Preferably the organic component further comprises a bronsted acid co-catalyst and/or a flexibilizing modifier. The compositions are useful in various semiconductor applications, including as die attach adhesives, underfills, encapsulants, via fills, prepreg binders, polymer solder masks and polymer bumps on flip chip or BGA assemblies.
    Type: Application
    Filed: November 19, 2002
    Publication date: September 4, 2003
    Inventors: Xiao-Qi Zhou, Henry Wevick, Nancy Iwamoto, Shao Wei Li, Alan Grieve
  • Long and short-chain cycloaliphatic epoxy resins with cyanate ester
    Patent number: 6489380
    Abstract: Compositions having high moisture resistance and flexibility comprise an organic component and a filler. The organic component comprises a long-chain cycloaliphatic epoxy resin, a short-chain cycloaliphatic epoxy resin, a cyanate ester, and a Lewis acid catalyst. Preferably the organic component further comprises a Bronsted acid co-catalyst and/or a flexibilizing modifier. The compositions are useful in various semiconductor applications, including as die attach adhesives, underfills, encapsulants, via fills, prepreg binders, polymer solder masks and polymer bumps on flip chip or BGA assemblies.
    Type: Grant
    Filed: April 27, 2000
    Date of Patent: December 3, 2002
    Assignee: Johnson Matthey Electronics, Inc.
    Inventors: Xiao-Qi Zhou, Henry Wevick, Nancy E. Iwamoto, Shao Wei Li, Alan Grieve
  • Method of applying a die attach adhesive
    Patent number: 6242513
    Abstract: Compositions having high moisture resistance and flexibility comprise an organic component and a filler. The organic component comprises a long-chain cycloaliphatic epoxy resin, a short-chain cycloaliphatic epoxy resin, a cyanate ester, and a Lewis acid catalyst. Preferably the organic component further comprises a Bronsted acid co-catalyst and/or a flexibilizing modifier. The compositions are useful in various semiconductor applications, including as die attach adhesives, underfills, encapsulants, via fills, prepreg binders, polymer solder masks and polymer bumps on flip chip or BGA assemblies.
    Type: Grant
    Filed: October 12, 1999
    Date of Patent: June 5, 2001
    Assignee: Johnson Matthey Electronics, Inc.
    Inventors: Xiao-Qi Zhou, Henry Wevick, Nancy E. Iwamoto, Shao Wei Li, Alan Grieve
  • Long and short-chain cycloaliphatic epoxy resins with cyanate ester
    Patent number: 6057402
    Abstract: Compositions having high moisture resistance and flexibility comprise an organic component and a filler. The organic component comprises a long-chain cycloaliphatic epoxy resin, a short-chain cycloaliphatic epoxy resin, a cyanate ester, and a Lewis acid catalyst. Preferably the organic component further comprises a Bronsted acid co-catalyst and/or a flexibilizing modifier. The compositions are useful in various semiconductor applications, including as die attach adhesives, underfills, encapsulants, via fills, prepreg binders, polymer solder masks and polymer bumps on flip chip or BGA assemblies.
    Type: Grant
    Filed: August 12, 1998
    Date of Patent: May 2, 2000
    Assignee: Johnson Matthey, Inc.
    Inventors: Xiao-Qi Zhou, Henry Wevick, Nancy E. Iwamoto, Shao Wei Li, Alan Grieve
  • Adhesive composition for bonding a semiconductor device
    Patent number: 5744533
    Abstract: Described is an adhesive composition suitable for bonding a semiconductor device to a substrate comprising about 60-90 wt. % particulate silver; about 10-40 wt. % of an adhesive material comprising at least one nonelectrically conductive organic compound; and a filler comprising at least one electrically conductive organic compound capable of forming a conductivity bridge between silver particles. The adhesive composition may additionally include at least one curing catalyst for the adhesive material, a flexibilizer to render the composition more flexible, a surfactant to facilitate contact with a substrate and/or a material to aid in adjusting the rheology of the composition.
    Type: Grant
    Filed: June 4, 1997
    Date of Patent: April 28, 1998
    Assignee: Johnson Matthey, Inc.
    Inventors: Nancy E. Iwamoto, Jesse L. Pedigo, Shao Wei Li, Alan Grieve