Patents by Inventor Shaowei Qin

Shaowei Qin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11932793
    Abstract: The invention relates to a phosphor with garnet structure and a light-emitting device comprising the phosphor, wherein the phosphor includes the following components in percentage by weight: 38.47-45.19% of Y element, 9.49-22.09% of Al element, 2.06-24.31% of Ga element, 27.3-32.04% of O element, 0.43-1.46% of Ce element. In the phosphor particles, the shortest distance from the surface of one side of the particle to the surface of the opposite side through the centroid of the particle is defined as R, the longest distance is R1, and 5 ?m?R?40 ?m; any distance from the particle surface to the centroid is r, and 0<r<½R; and the space with the distance from the particle surface to the centroid direction being less than or equal to r is defined as rinner.
    Type: Grant
    Filed: May 19, 2022
    Date of Patent: March 19, 2024
    Assignees: GRIREM ADVANCED MATERIALS CO., LTD., Grirem Hi-Tech Co., Ltd, Rare Earth Functional Materials (Xiong'an) Innovation Center Co., Ltd.
    Inventors: Ronghui Liu, Shaowei Qin, Yuanhong Liu, Yanfeng Li, Xiaoxia Chen, Xiaole Ma, Yuan Xue
  • Patent number: 11889647
    Abstract: An electronic device includes a housing that defines an aperture, and a display assembly positioned in the aperture. The display assembly can include a display layer having a first portion, and a second portion bending at least partially below the first portion. The first portion and the second portion can define a bend volume, and a potting material can be disposed in the bend volume, such that the potting material contacts the first portion and the second portion. An internal enclosure can be contoured to the display assembly.
    Type: Grant
    Filed: August 19, 2020
    Date of Patent: January 30, 2024
    Assignee: APPLE INC.
    Inventors: Izhar Z. Ahmed, John J. Baker, Bulong Wu, Daniel W. Jarvis, Douglas G. Fournier, Eric W. Bates, Hao Dong, Isabel S Gueble, Jason C. Law, Jingjing Xu, Kikue S. Burnham, Paul U. Leutheuser, Sarah Trabia, Sawyer I. Cohen, Shaorui Yang, Shaowei Qin, Siddharth Avachat, Yaocheng Zhang, Ying-Chih Wang, Zhen Zhang, Benjamin R. Pope
  • Publication number: 20220411694
    Abstract: The invention relates to a phosphor with garnet structure and a light-emitting device comprising the phosphor, wherein the phosphor includes the following components in percentage by weight: 38.47-45.19% of Y element, 9.49-22.09% of Al element, 2.06-24.31% of Ga element, 27.3-32.04% of O element, 0.43-1.46% of Ce element. In the phosphor particles, the shortest distance from the surface of one side of the particle to the surface of the opposite side through the centroid of the particle is defined as R, the longest distance is R1, and 5 ?m?R?40 ?m; any distance from the particle surface to the centroid is r, and 0<r<½R; and the space with the distance from the particle surface to the centroid direction being less than or equal to r is defined as rinner.
    Type: Application
    Filed: May 19, 2022
    Publication date: December 29, 2022
    Inventors: Ronghui LIU, Shaowei QIN, Yuanhong LIU, Yanfeng LI, Xiaoxia CHEN, Xiaole MA, Yuan XUE
  • Publication number: 20220061179
    Abstract: An electronic device includes a housing that defines an aperture, and a display assembly positioned in the aperture. The display assembly can include a display layer having a first portion, and a second portion bending at least partially below the first portion. The first portion and the second portion can define a bend volume, and a potting material can be disposed in the bend volume, such that the potting material contacts the first portion and the second portion. An internal enclosure can be contoured to the display assembly.
    Type: Application
    Filed: August 19, 2020
    Publication date: February 24, 2022
    Inventors: Izhar Z. Ahmed, John J. Baker, Bulong Wu, Daniel W. Jarvis, Douglas G. Fournier, Eric W. Bates, Hao Dong, Isabel S. Gueble, Jason C. Law, Jingjing Xu, Kikue S. Burnham, Paul U. Leutheuser, Sarah Trabia, Sawyer I. Cohen, Shaorui Yang, Shaowei Qin, Siddharth Avachat, Yaocheng Zhang, Ying-Chih Wang, Zhen Zhang, Benjamin R. Pope
  • Patent number: 11129284
    Abstract: A rigid flex printed circuit board (PCB), method of manufacture, and display system incorporating the same are described. In an embodiment, a rigid flex PCB includes a flexible area extending from an adjacent routing area that is thicker than the flexible area. A flexible inner core spans the flexible area and the adjacent routing area. Outer stack-up layers are on the flexible inner core in the adjacent routing area. A cavity is formed in the outer stack-up layers in the routing area and exposes the flexible inner core. In an embodiment, a display system including such a circuit board may include an electronic component mounted on the flexible inner core within the cavity, and a distal end of the flexible area is bonded to a display panel.
    Type: Grant
    Filed: June 25, 2020
    Date of Patent: September 21, 2021
    Assignee: Apple Inc.
    Inventors: Adam Adjiwibawa, Shaowei Qin, Victor H. Yin, Wenyong Zhu, Steven M. Scardato
  • Publication number: 20210084777
    Abstract: A rigid flex printed circuit board (PCB), method of manufacture, and display system incorporating the same are described. In an embodiment, a rigid flex PCB includes a flexible area extending from an adjacent routing area that is thicker than the flexible area. A flexible inner core spans the flexible area and the adjacent routing area. Outer stack-up layers are on the flexible inner core in the adjacent routing area. A cavity is formed in the outer stack-up layers in the routing area and exposes the flexible inner core. In an embodiment, a display system including such a circuit board may include an electronic component mounted on the flexible inner core within the cavity, and a distal end of the flexible area is bonded to a display panel.
    Type: Application
    Filed: June 25, 2020
    Publication date: March 18, 2021
    Inventors: Adam Adjiwibawa, Shaowei Qin, Victor H. Yin, Wenyong Zhu, Steven M. Scardato
  • Patent number: 10170711
    Abstract: A thin-film transistor layer, an organic light-emitting diode layer, and other layers may be used in forming an array of pixels on a substrate in a display. Vias may be formed through one or more layers of the display such as the substrate layer to form vertical signal paths. The vertical signal paths may convey signals between display driver circuitry underneath the display and the pixels. The vias may pass through a polymer layer and may contact pads formed within openings in the substrate. Vias may pass through a glass support layer. Metal traces may be formed in the thin-film transistor layer to create signal paths such as data lines and gate lines. Portions of the metal traces may form vias through a polymer layer such as a substrate layer or a polymer layer that has been formed on top of the substrate layer.
    Type: Grant
    Filed: April 5, 2016
    Date of Patent: January 1, 2019
    Assignee: Apple Inc.
    Inventors: Jason C. Sauers, Jean-Pierre S. Guillou, Peter J. Kardassakis, Shaowei Qin, Yi Tao
  • Publication number: 20160329386
    Abstract: A thin-film transistor layer, an organic light-emitting diode layer, and other layers may be used in forming an array of pixels on a substrate in a display. Vias may be formed through one or more layers of the display such as the substrate layer to form vertical signal paths. The vertical signal paths may convey signals between display driver circuitry underneath the display and the pixels. The vias may pass through a polymer layer and may contact pads formed within openings in the substrate. Vias may pass through a glass support layer. Metal traces may be formed in the thin-film transistor layer to create signal paths such as data lines and gate lines. Portions of the metal traces may form vias through a polymer layer such as a substrate layer or a polymer layer that has been formed on top of the substrate layer.
    Type: Application
    Filed: April 5, 2016
    Publication date: November 10, 2016
    Inventors: Jason C. Sauers, Jean-Pierre S. Guillou, Peter J. Kardassakis, Shaowei Qin, Yi Tao