Patents by Inventor Shao-Wen Chen
Shao-Wen Chen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240185592Abstract: In one embodiment, an apparatus comprises a processor to: identify a workload comprising a plurality of tasks; generate a workload graph based on the workload, wherein the workload graph comprises information associated with the plurality of tasks; identify a device connectivity graph, wherein the device connectivity graph comprises device connectivity information associated with a plurality of processing devices; identify a privacy policy associated with the workload; identify privacy level information associated with the plurality of processing devices; identify a privacy constraint based on the privacy policy and the privacy level information; and determine a workload schedule, wherein the workload schedule comprises a mapping of the workload onto the plurality of processing devices, and wherein the workload schedule is determined based on the privacy constraint, the workload graph, and the device connectivity graph.Type: ApplicationFiled: October 27, 2023Publication date: June 6, 2024Applicant: Intel CorporationInventors: Shao-Wen Yang, Yen-Kuang Chen, Addicam V. Sanjay
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Patent number: 11969727Abstract: Present invention is related to a tumor microenvironment on chip or a biochip for cell therapy having a carrier, a first cell or tissue culture area and a second cell or tissue area imbedded within the carrier. The present invention provides a biochip successfully cooperating micro fluidic technology and cell culture achieving the goal for detecting or testing the function of cell therapy for cancer or tumor.Type: GrantFiled: October 22, 2021Date of Patent: April 30, 2024Assignees: China Medical University, China Medical University HospitalInventors: Yi-Wen Chen, Ming-You Shie, Der-Yang Cho, Shao-Chih Chiu, Kai-Wen Kan, Chien-Chang Chen
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Publication number: 20100229394Abstract: The invention provides a method for fabricating wick microstructures in heat pipes, comprising the following steps: providing a flat plate and a mold with several molding holes; filling a dry powder material in the several molding holes and putting the mold to cover the flat plate so as to form an object to be sintered; sintering the object; and removing the mold to form a flat plate with wick microstructures. The wick microstructures are arranged on the flat plate in a form of microgrooves, microcylinders or any combination of them. The flat plate with wick microstructures is further processed to form a heat pipe with a characteristic shape and having two kinds of wick microstructures such that the heat transferred by the heat pipe is increased and the occurrence of dry out of the heat pipe is delayed.Type: ApplicationFiled: May 24, 2010Publication date: September 16, 2010Applicant: Industrial Technology Research InstituteInventors: Ming-Jye Tsai, Jin-Cherng Shyu, Cheng-Tai Chou, Chia-Sheng Chiang, Lan-Kai Yeh, Shao-Wen Chen
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Patent number: 7730605Abstract: The present invention relates to a method for fabricating a heat dissipating apparatus. The method provides two highly heat conductive members having structure patterns. A highly heat conductive material is coated on the structured patterns for forming a micro-structure layer. The two highly heat conductive members are assembled to form a heat dissipating apparatus having micro-structure layer. The heat dissipating apparatus comprises a main body composed of the highly heat conductive members. The main body forms an accommodating cavity, and inner surfaces of the accommodating cavity form the micro-structure layer. A working fluid is filled into the accommodating cavity for transferring heat from a heat absorbing surface to a heat dissipating surface.Type: GrantFiled: April 17, 2007Date of Patent: June 8, 2010Assignee: Industrial Technology Research InstituteInventors: Lan-Kai Yeh, Che-Wei Lin, Ming-Jye Tsai, Shao-Wen Chen, Jin-Cherng Shyu
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Patent number: 7578338Abstract: A heat dissipating apparatus has a micro-structure layer. Two highly heat conductive members are provided, each having structured patterns. A highly heat conductive material is coated on the structured patterns by injection molding for forming a micro-structure layer. The two highly heat conductive members are assembled to form a heat dissipating apparatus having a micro-structure layer. The heat dissipating apparatus includes a main body composed of the highly heat conductive members. The main body forms an accommodating cavity, and inner surfaces of the accommodating cavity form the micro-structure layer. A working fluid is filled into the accommodating cavity for transferring heat from a heat absorbing surface to a heat dissipating surface.Type: GrantFiled: April 17, 2007Date of Patent: August 25, 2009Assignee: Industrial Technology Research InstituteInventors: Lan-Kai Yeh, Che-Wei Lin, Ming-Jye Tsai, Shao-Wen Chen, Jin-Cherng Shyu
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Publication number: 20070193029Abstract: The present invention relates to a heat dissipating apparatus having micro-structure layer and method for fabricating the same. The method provides two highly heat conductive members having structure patterns. A highly heat conductive material is coated on the structured patterns by means of injection molding for forming a micro-structure layer. The two highly heat conductive members are assembled to form a heat dissipating apparatus having micro-structure layer. The heat dissipating apparatus comprises a main body composed of the highly heat conductive members. The main body forms an accommodating cavity, and inner surfaces of the accommodating cavity form the micro-structure layer. A working fluid is filled into the accommodating cavity for transferring heat from a heat absorbing surface to a heat dissipating surface.Type: ApplicationFiled: April 17, 2007Publication date: August 23, 2007Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTEInventors: Lan-Kai Yeh, Che-Wei Lin, Ming-Jye Tsai, Shao-Wen Chen, Jin-Cherng Shyu
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Publication number: 20070187074Abstract: The present invention relates to a heat dissipating apparatus having micro-structure layer and method for fabricating the same. The method provides two highly heat conductive members having structure patterns. A highly heat conductive material is coated on the structured patterns by means of injection molding for forming a micro-structure layer. The two highly heat conductive members are assembled to form a heat dissipating apparatus having micro-structure layer. The heat dissipating apparatus comprises a main body composed of the highly heat conductive members. The main body forms an accommodating cavity, and inner surfaces of the accommodating cavity form the micro-structure layer. A working fluid is filled into the accommodating cavity for transferring heat from a heat absorbing surface to a heat dissipating surface.Type: ApplicationFiled: April 17, 2007Publication date: August 16, 2007Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTEInventors: Lan-Kai Yeh, Che-Wei Lin, Ming-Jye Tsai, Shao-Wen Chen, Jin-Cherng Shyu
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Patent number: 7237337Abstract: The present invention relates to a heat dissipating apparatus having micro-structure layer and method for fabricating the same. The method provides two highly heat conductive members having structure patterns. A highly heat conductive material is coated on the structured patterns by means of injection molding for forming a micro-structure layer. The two highly heat conductive members are assembled to form a heat dissipating apparatus having micro-structure layer. The heat dissipating apparatus comprises a main body composed of the highly heat conductive members. The main body forms an accommodating cavity, and inner surfaces of the accommodating cavity form the micro-structure layer. A working fluid is filled into the accommodating cavity for transferring heat from a heat absorbing surface to a heat dissipating surface.Type: GrantFiled: November 24, 2004Date of Patent: July 3, 2007Assignee: Industrial Technology Research InstituteInventors: Lan-Kai Yeh, Che-Wei Lin, Ming-Jye Tsai, Shao-Wen Chen, Jin-Cherng Shyu
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Publication number: 20060143916Abstract: The invention provides a method for fabricating wick microstructures in heat pipes, comprising the following steps: providing a flat plate and a mold with several molding holes; filling a powder material in the several molding holes and putting the mold to cover the flat plate so as to form an object to be sintered; sintering the object; and removing the mold to form a flat plate with wick microstructures. The wick microstructures are arranged on the flat plate in a form of microgrooves, microcylinders or any combination of them. The flat plate with wick microstructures is further processed to form a heat pipe with a characteristic shape and having two kinds of wick microstructures such that the heat transferred by the heat pipe is increased and the occurrence of dry out of the heat pipe is delayed.Type: ApplicationFiled: May 19, 2005Publication date: July 6, 2006Inventors: Ming-Jye Tsai, Jin-Cherng Shyu, Cheng-Tai Chou, Chia-Sheng Chiang, Lan-Kai Yeh, Shao-Wen Chen
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Patent number: 7011145Abstract: A method for enhancing the mobility of a working fluid in a liquid/gas phase heat dissipating device improves the mobility of the working fluid therein, and further enhancing the heat dissipation capability of the heat dissipating device. The present invention coats a layer on the surface of a capillary structure inside the heat dissipating device to increase the material property on the surface and the coupling force between the working fluid and the capillary structure and decrease the contact angle between the working fluid and the capillary structure, and thus the working fluid has a higher mobility to solve the problem of the high heat flux density of the liquid/gas heat dissipating device and improve the heat dissipation effect. The present invention not only applies to the heat generating electronic components within a limited space, but also applies to other electronic components that require a constant temperature.Type: GrantFiled: July 12, 2004Date of Patent: March 14, 2006Assignee: Industrial Technology Research InstituteInventors: Lan-Kai Yeh, Che-Wei Lin, Shao-Wen Chen, Jin-Cherng Shyu, Ming-Jye Tsai
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Publication number: 20060005951Abstract: A method for enhancing the mobility of a working fluid in a liquid/gas phase heat dissipating device improves the mobility of the working fluid therein, and further enhancing the heat dissipation capability of the heat dissipating device. The present invention coats a layer on the surface of a capillary structure inside the heat dissipating device to increase the material property on the surface and the coupling force between the working fluid and the capillary structure and decrease the contact angle between the working fluid and the capillary structure, and thus the working fluid has a higher mobility to solve the problem of the high heat flux density of the liquid/gas heat dissipating device and improve the heat dissipation effect. The present invention not only applies to the heat generating electronic components within a limited space, but also applies to other electronic components that require a constant temperature.Type: ApplicationFiled: July 12, 2004Publication date: January 12, 2006Inventors: Lan-Kai Yeh, Che-Wei Lin, Shao-Wen Chen, Jin-Cherng Shyu, Ming-Jye Tsai
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Publication number: 20060005952Abstract: The present invention relates to a heat dissipating apparatus having micro-structure layer and method for fabricating the same. The method provides two highly heat conductive members having structure patterns. A highly heat conductive material is coated on the structured patterns by means of injection molding for forming a micro-structure layer. The two highly heat conductive members are assembled to form a heat dissipating apparatus having micro-structure layer. The heat dissipating apparatus comprises a main body composed of the highly heat conductive members. The main body forms an accommodating cavity, and inner surfaces of the accommodating cavity form the micro-structure layer. A working fluid is filled into the accommodating cavity for transferring heat from a heat absorbing surface to a heat dissipating surface.Type: ApplicationFiled: November 24, 2004Publication date: January 12, 2006Inventors: Lan-Kai Yeh, Che-Wei Lin, Ming-Jye Tsai, Shao-Wen Chen, Jin-Cherng Shyu
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Patent number: 6932150Abstract: A heat-dissipation device adopted for a safety helmet which includes a heat-transfer unit that functions as a heat pipe, a heat-dissipation unit connecting to the heat-transfer unit, a vent formed in a front of the heat-dissipation unit that can be closed and opened alternatively by a shutter unit in order to adjust the capacity of heat-dissipation thereof, and a covering unit made of insulative materials and spreading over the heat-dissipation unit. Whereby the heat-transfer unit provides a kind of two-phase flow that is capable of conducting heat rapidly, so as to remove heat gathered in the helmet and improve the comfort level for the wearer.Type: GrantFiled: September 10, 2004Date of Patent: August 23, 2005Assignee: Industrial Technology Research InstituteInventors: Lan-Kai Yeh, Ming-Jye Tsai, Che-Wei Lin, Shao-Wen Chen, Jin-Cherng Shyu
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Publication number: 20050120886Abstract: An infusion tea maker is disclosed to include a jug, a brewing basket, which is supported inside the hug and has a top brewing chamber, a bottom air chamber, and a center guide tube vertically downwardly extended from the top infusion chamber through the bottom air chamber to the outside of the brewing basket, a rotary knob for regulating flow rate of infused tea out of the center guide tube to the inside space of the jug, and a cover, which is covered on the jug and attracts the brewing basket by magnetic attraction.Type: ApplicationFiled: October 6, 2004Publication date: June 9, 2005Inventor: Shao-Wen Chen