Abstract: A lithographic method of determining a sensitivity of a property of a pattern feature to change in optical aberrations of a lithographic apparatus used to provide that pattern feature. The method includes controlling a configuration of the lithographic apparatus to establish a first aberration state, forming a first image of the pattern feature with that lithographic apparatus when the lithographic apparatus is in that first aberration state, measuring a property of the image, controlling a configuration of the lithographic apparatus to establish a second, different, aberration state, forming an image of the same pattern feature with that lithographic apparatus when the lithographic apparatus is in that second aberration state, measuring a same property of the image, and using the measurements to determine the sensitivity of the property of the pattern feature to changes in the aberration state.

Abstract: A lithographic method of determining a sensitivity of a property of a pattern feature to change in optical aberrations of a lithographic apparatus used to provide that pattern feature. The method includes controlling a configuration of the lithographic apparatus to establish a first aberration state, forming a first image of the pattern feature with that lithographic apparatus when the lithographic apparatus is in that first aberration state, measuring a property of the image, controlling a configuration of the lithographic apparatus to establish a second, different, aberration state, forming an image of the same pattern feature with that lithographic apparatus when the lithographic apparatus is in that second aberration state, measuring a same property of the image, and using the measurements to determine the sensitivity of the property of the pattern feature to changes in the aberration state.

Abstract: The present invention discloses a process for electroless plating a metal on the surface of almost all the common nonconductive material substrates by brushing or spraying composite chemical solutions onto said surface. When practicing the present invention, metal can be quickly deposited on the surface and firmly bound with the substrate. In addition, the composite chemical solutions used in the invention can be prepared from raw chemicals which are nontoxic and do not cause environmental pollution. Since the process does not require immersing or dipping, it allows metal to be deposited either on the entire surface or on a portion of a surface of the substrate without any restriction of the dimensions of the substrate. In one embodiment, the substrates may be glass, silicates or ceramics and may be sensitized using a solution which comprises about 25-175 g/l SnCl.sub.2, about 35-110 g/l of about 36% HCl, and about 50-100 g/l of about 95% ethanol.