Patents by Inventor Shapur Sahba

Shapur Sahba has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6914576
    Abstract: A group of Double-Sided High-Tc Superconducting (HTS) Magnetic-Dipole Micro-Antennas is provided. The multi-resonant double-sided HTS magnetic dipole micro-antenna are fabricated using thin-film (?YBCO?3000 ?) YBCO material (with Tc?92 K). The substrate is a single LaAlO3 crystal (with the loss-tangent of tan ??10?5, ?r?24) with the thickness of ?LAO?508 ?m. Each antenna is comprised of a combination of co-centric loop and spiral structures, patterned on both sides of the substrate without ground plane. Due to their geometric structures, each antenna demonstrates a multi-resonant characteristic. The comparison between the overall dimensions of the device (22×22 mm2) and variation of the wavelength at resonances indicate a typical ratio of D/??10?2 between the largest loop diameter and the longest wavelength.
    Type: Grant
    Filed: October 20, 2003
    Date of Patent: July 5, 2005
    Assignee: The United States of America as represented by the Secretary of the Army
    Inventor: Shapur Sahba
  • Patent number: 6403977
    Abstract: A double-sided high-temperature superconducting flux-flow transistor is provided by advantageously placing a control line assembly and a weak-link assembly on opposite sides of a dielectric substrate to form a double-sided assembly that controls line current on the input side of the substrate that causes generation of vortices on the weak link structure patterned on the substrate's output side. Placing the two assemblies on opposite sides of the same substrate provides the operator with significant modulating capability for applications such as an amplifier or a mixer. Each side of the substrate is patterned and chemically etched to provide a control-line assembly opposed by a weak-link assembly, with the control-line assembly being patterned on the thicker substrate side.
    Type: Grant
    Filed: June 13, 2001
    Date of Patent: June 11, 2002
    Assignee: The United States of America as represented by the Secretary of the Army
    Inventor: Shapur Sahba