Patents by Inventor Shariff Dzafir

Shariff Dzafir has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Integrated circuit packaging system with transparent encapsulation and method of manufacture thereof
    Patent number: 8399306
    Abstract: A method of manufacture of an integrated circuit packaging system includes: forming a substrate having a redistribution line thereon; mounting an integrated circuit to the substrate; and molding a transparent encapsulation over the substrate covering the integrated circuit and the redistribution line and the integrated circuit seen through the transparent encapsulation.
    Type: Grant
    Filed: March 25, 2011
    Date of Patent: March 19, 2013
    Assignee: Stats Chippac Ltd.
    Inventors: JunMo Koo, Pandi Chelvam Marimuthu, Jae Hun Ku, Jose Alvin Caparas, Shariff Dzafir
  • INTEGRATED CIRCUIT PACKAGING SYSTEM WITH TRANSPARENT ENCAPSULATION AND METHOD OF MANUFACTURE THEREOF
    Publication number: 20120241927
    Abstract: A method of manufacture of an integrated circuit packaging system includes: forming a substrate having a redistribution line thereon; mounting an integrated circuit to the substrate; and molding a transparent encapsulation over the substrate covering the integrated circuit and the redistribution line and the integrated circuit seen through the transparent encapsulation.
    Type: Application
    Filed: March 25, 2011
    Publication date: September 27, 2012
    Inventors: JunMo Koo, Pandi Chelvam Marimuthu, Jae Hun Ku, Jose Alvin Caparas, Shariff Dzafir