Abstract: A method for defect identification for an integrated circuit includes determining a defect ranking technique, applying at least two defect identification techniques and generating a defect report corresponding to each technique, comparing the defect reports and generating probable defect locations, prioritizing the probable defect locations according to the defect ranking technique; and generating a report of the prioritized probable defect locations.

Abstract: The present disclosure relates to a system and method for performing scan chain diagnosis of an electronic design. The method may include identifying, at a computing device, at least one failing scan chain associated with the electronic design. The method may also include selecting a plurality of defect locations associated with the at least one failing scan chain, wherein the plurality of defect locations corresponds to a number of parallel patterns that a simulator is configured to process. The method may further include selecting a sliced failing pattern set and generating a plurality of copies of a pattern associated with the sliced failing pattern set, wherein each of the plurality of copies corresponds to one of the plurality of defect locations. The method may also include simulating the plurality of copies of the pattern in parallel.

Abstract: Systems and methods disclosed herein provide for automatically diagnosing mis-compares detected during simulation of Automatic Test Pattern Generation (“ATPG”) generated test patterns. Embodiments of the systems and methods provide for determining the origin of a mis-compare based on an analysis of the generated test patterns with a structural simulator and a behavioral simulator.

Abstract: Embodiments for diagnosing failure locations in one or more electronic circuits. Embodiments may include generating a plurality of core instances of at least one core, for each electronic circuit, with one or more outputs and compressing the outputs of each instance into primary output pins based upon compression equations. Embodiments may include applying test patterns to the plurality of core instances and identifying failures based upon compressed test patterns received at the primary output pins. Embodiments may include performing fault selection on a single core instance for each failure associated with the plurality of core instances and performing fault simulations on the single core instance for each candidate faults associated with the plurality of core instances. Embodiments may include generating fault signatures for each detected fault based upon the instances associated with each detected fault and analyzing each fault signature to determine failure locations.

Abstract: In order to detect and locate defects, or faults, in a plurality of chips or other circuits sharing a common design, said chips are each tested for incorrect outputs, or failures, in response to inputs. The incorrect outputs are then collectively diagnosed in a single simulation by simulating a series of suspected fault candidates on a simulated chip of the chip design, and afterward comparing the incorrect outputs generated by each fault candidate to the incorrect outputs of the individual chips, to determine if a fault candidate generates all failures for a chip and no others. The test inputs and expected outputs may be predetermined through Automatic Test Pattern Generation. The fault candidates may be determined by use of a backtrace process such as back cone tracing. The failures may be recorded in association with a measure point, the input pattern that resulted in the failure, and the failure value.