Abstract: An integrated circuit package, and more particularly a surface mount device, is disclosed. The integrated circuit package includes at least a substrate (or wafer) and a light shield. The substrate has a substrate surface with an integrated circuit formed thereon. The integrated circuit includes light sensitive areas, which are adversely affected by ambient light. The light shield is disposed over the light sensitive portions to block ambient light from reaching the light sensitive portions of the circuit so that the electrical characteristics of the circuit are not significantly altered when the circuit is operated in ambient light. The integrated circuit package also includes a plurality of bond pads disposed on the substrate surface and a first passivation layer disposed between the bond pads and the light shield and between the substrate surface and the light shield. The light shield is arranged to extend over an edge of the bonding pad.