Abstract: The carbon footprint of a supply and distribution chain is modeled as a carbon dioxide (CO2) cost that can be considered alongside monetary or dollar ($) costs in supply, manufacturing, and distribution operations. Databases on products and services, supply chain policies, and targets, costs, and/or greenhouse gas (GHG) emissions are used by a GHG calculator to output carbon footprint data and/or by a supply chain optimizer to output supply chain planning and policy data. Client computers obtain carbon footprint and/or supply chain planning and policy data by querying a server with access to a database storing calculated carbon footprint data. Input data to the GHG calculator is updated based on choices made by users of the system.

Abstract: Structures containing a dielectric material having a polymeric reactive ion etch barrier embedded therein. The preferred dielectric materials are polymers, preferably polyimide materials. The RIE etch barrier is a copolymer having an aromatic component having high thermal stability and having a cross-linking component selected from metallacyclobutane, metallabutene and vinyl groups. The etch barrier is deposited as a solvent free liquid which can fill gaps between the dielectric material and electrical conductors embedded therein. The liquid polymer is cured to a solid insoluble state. The structures with electrical conductors embedded therein are useful for electronic applications.

Abstract: A dry developable photoresist composition that contains in admixture a polymeric epoxide; a di- or polyfunctional organosilicon material; and an onium salt; and use thereof to produce an image.

Abstract: A process is disclosed for producing a metal-organic polymer combination by contacting the polymer with a plasma followed by an aqueous solution of a metal salt. In one embodiment a water or nitrous oxide plasma is used to treat a polyimide or a fluorinated polymer. The polymer is combined with a metal cation, the metal being a catalyst for a conventional electroless coating after which it is contacted with an electroless metal plating bath for the formation of electrical circuits and especially for plating high aspect ratio vias in microcircuits. Unlike the conventional electroless process, the cationic catalytic metal is not reduced to a zero valent metal catalyst prior to the application of the electroless metal coating solution.The process also improves the wettability of the polymer, especially the fluorinated polymer and is especially useful in improving the wettability of high aspect ratio vias.

Abstract: A composition containing novolak polymer, and/or poly(p-vinylphenol), an organometallic material, an amino polymer a cationic photocatalyst. The composition can also include a cosensitizer material which makes a composition sensitive to near U.V. radiation.

Abstract: A dry developable photoresist composition that contains in admixture a polymeric epoxide; a di- or polyfunctional organosilicon material; and an onium salt; and use thereof to produce an image.

Abstract: Structures containing a dielectric material having a polymeric reactive ion etch barrier embedded therein. The preferred dielectric materials are polymers, preferably polyimide materials. The RIE etch barrier is a copolymer having an aromatic component having high thermal stability and having a cross-linking component selected from metallacyclobutane, metallabutene and vinyl groups. The etch barrier is deposited as a solvent free liquid which can fill gaps between the dielectric material and electrical conductors embedded therein. The liquid polymer is cured to a solid insoluble state. The structures with electrical conductors embedded therein are useful for electronic applications.