Patents by Inventor Sharon Mui Ling Nai

Sharon Mui Ling Nai has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7115182
    Abstract: A method of bonding components comprising the following steps. At least a first ceramic component and a second ceramic component are provided. A first conductive layer is formed over the upper surface of the first ceramic component. An intermediate film is formed over the first conductive layer. A second conductive layer is formed over the lower surface of the second ceramic component. The second ceramic component is stacked over the first ceramic component wherein the second conductive layer on the second ceramic component opposes the intermediate film on the first component. The first and second ceramic components are anodically bonded together.
    Type: Grant
    Filed: June 15, 2004
    Date of Patent: October 3, 2006
    Assignee: Agency for Science, Technology and Research
    Inventors: Jun Wei, Stephen Chee Khuen Wong, Sharon Mui Ling Nai