Patents by Inventor Sharon X. Ling

Sharon X. Ling has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6967103
    Abstract: An explosive detector that utilizes an array of molecularly imprinted polymer (MIP) coated, bifurcated fiber optic cables to form an image of a target molecule source. Individual sensor fiber assemblies, each with a calibrated airflow, are used to expose the fibers to the target molecule. The detector energizes a dedicated excitation light source for each fiber, while simultaneously reading and processing the intensity of the resulting fluorescence that is indicative of the concentration of the target molecule. Processing electronics precisely controls the excitation current, and measures the detected signal from each narrow band pass filter and photodiode. A computer with display processes the data to form an image of the target molecule source that can be used to identify the source even when low level contamination of the same molecule is present. The detector can be used to detect multiple and/or non-explosive targets by varying the MIP coating.
    Type: Grant
    Filed: May 3, 2001
    Date of Patent: November 22, 2005
    Assignee: The Johns Hopkins University
    Inventors: Paul D. Schwartz, George M. Murray, O. Manuel Uy, Binh Q. Le, David D. Scott, Ark L. Lew, Sharon X. Ling, Joseph J. Suter
  • Patent number: 6881593
    Abstract: A semiconductor die adapter assembly includes a semiconductor die cut from a wafer, the die having an active surface including bond pads. A die adapter, also having bond pads, is bonded to the semiconductor die. Die-to-adapter connectors electrically connect the die bond pads to the adapter bond pads. Finally, adapter-to-substrate connectors electrically connect the adapter bond pads to a device substrate. Having bond pads on the die adapter eliminates the need to break and remake the electrical connections to the original bond pads on the die during burn-in testing of the die.
    Type: Grant
    Filed: May 31, 2002
    Date of Patent: April 19, 2005
    Assignee: The Johns Hopkins University
    Inventors: Binh Q. Le, Ark L. Lew, Harry K. Charles, Jr., Paul D. Schwartz, Seppo J. Lehtonen, Sharon X. Ling
  • Publication number: 20030143119
    Abstract: An explosive detector that utilizes an array of molecularly imprinted polymer (MIP) coated, bifurcated fiber optic cables to form an image of a target molecule source. Individual sensor fiber assemblies, each with a calibrated airflow, are used to expose the fibers to the target molecule. The detector energizes a dedicated excitation light source for each fiber, while simultaneously reading and processing the intensity of the resulting fluorescence that is indicative of the concentration of the target molecule. Processing electronics precisely controls the excitation current, and measures the detected signal from each narrow band pass filter and photodiode. A computer with display processes the data to form an image of the target molecule source that can be used to identify the source even when low level contamination of the same molecule is present. The detector can be used to detect multiple and/or non-explosive targets by varying the MIP coating.
    Type: Application
    Filed: January 21, 2003
    Publication date: July 31, 2003
    Inventors: Paul D. Schwartz, George M. Murray, O. Manuel Uy, Binh Q. Le, David D. Stott, Ark L. Lew, Sharon X. Ling, Joseph J. Suter
  • Publication number: 20030011060
    Abstract: A semiconductor die adapter assembly includes a semiconductor die cut from a wafer, the die having an active surface including bond pads. A die adapter, also having bond pads, is bonded to the semiconductor die. Die-to-adapter connectors electrically connect the die bond pads to the adapter bond pads. Finally, adapter-to-substrate connectors electrically connect the adapter bond pads to a device substrate. Having bond pads on the die adapter eliminates the need to break and remake the electrical connections to the original bond pads on the die during burn-in testing of the die.
    Type: Application
    Filed: May 31, 2002
    Publication date: January 16, 2003
    Inventors: Binh Q. Le, Ark L. Lew, Harry K. Charles,, Paul D. Schwartz, Seppo J. Lehtonen, Sharon X. Ling
  • Patent number: 6255799
    Abstract: The invention comprises a means for generating energy while walking or running for storage in a rechargeable battery. One embodiment uses lever arm movement in the heel of a shoe resulting from normal walking or running to generate energy from a built-in generator. The linear or rotational motion of the lever arm engages the circular gear assembly and turns the generator/motor/turbine, thus generating power. The second embodiment uses fluid reservoirs embedded in the shoes. Pressure changes resulting from normal walking or running moves the fluid through a narrow channel connecting two reservoirs, thus generating power by rotating a flywheel and an attached motor/generator/turbine in the middle of the channel. Secondary (rechargeable) batteries are incorporated into the invention either in an integrated form or as an add-on design.
    Type: Grant
    Filed: December 29, 1999
    Date of Patent: July 3, 2001
    Assignee: The Johns Hopkins University
    Inventors: Binh Q. Le, Ark L. Lew, Paul D. Schwartz, Albert C. Sadilek, Joseph J. Suter, Jason E. Jenkins, Sharon X. Ling