Abstract: The present invention provides a fan-out packaging structure and a manufacturing method thereof. The packaging structure includes a redistribution layer, at least one plastic packaging layer, at least one first shielding layer, at least one chip, and at least one electrical connector. The redistribution layer includes a grounding line layer, and the chip and the electrical connector are disposed on a first face of the redistribution layer and are electrically connected to the redistribution layer; the plastic packaging layer encapsulates the electrical connector and the chip; the first shielding layer at least covers a side face of the plastic packaging layer; and the electrical connector is at least partially exposed to the side face of the plastic packaging layer and electrically connected to the first shielding layer.

Abstract: The present invention provides a packaging structure and a manufacturing method thereof. The packaging structure includes a lower package, an upper package and a first redistribution stack layer disposed between the lower package and the upper package, wherein the first redistribution stack layer is electrically connected to the lower package and the upper package; the lower package includes a prefabricated substrate and a first plastic packaging layer surrounding the periphery of the prefabricated substrate; and the minimum line width/line spacing of the first redistribution stack layer is less than the minimum line width/line spacing of the prefabricated substrate. The lower package includes the prefabricated substrate and the first redistribution stack layer is disposed above the prefabricated substrate and has the minimum line width/line spacing less than that of the prefabricated substrate, so that more chips and/or device packages are integrated in the packaging structure.

Abstract: The present invention provides a packaging structure and a manufacturing method thereof. The packaging structure includes: a lower package, an upper package disposed above the lower package, and a first redistribution stack layer that is disposed between the lower package and the upper package and is electrically connected to the lower package and the upper package. The lower package includes a first prefabricated redistribution stack layer and a first plastic packaging layer surrounding the first prefabricated redistribution stack layer. A minimum line width and line spacing of at least one first prefabricated conductive layer in the first prefabricated redistribution stack layer is less than a minimum line width and line spacing of at least one first conductive layer in the first redistribution stack layer.

Abstract: The present invention provides an SIP package structure. The SIP package structure comprises a first module, a second module and a shielding assembly, wherein the first module and the second module are horizontally distributed or vertically stacked; electromagnetic sensitive frequencies of the first module and the second module are different; the shielding assembly comprises a first shielding structure covering the first module and a second shielding structure covering the second module; and at least part of the first shielding structure and/or at least part of the second shielding structure are/is disposed between the first module and the second module.

Abstract: The present invention relates to a package structure and package method for a cavity device group. The package structure includes a substrate, the substrate including a first substrate surface and a second substrate surface which face each other, wherein a first cavity device group is provided on the first substrate surface. The package structure further includes: a first sealing layer encapsulating the first cavity device group; and a first plastic package layer encapsulating the first sealing layer, wherein the flowability of a sealing material of the first sealing layer is less than that of a plastic package material of the first plastic package layer. The problems of device damage and functional failure of a cavity device group in the existing package structure because it is likely affected by a mold flow pressure in the injection molding process can be solved, while the function and miniaturization of a module are maintained.

Abstract: The present invention relates to an integrated package structure. The integrated package structure includes a main substrate, a first module, a second module, a cavity element and a large-size device, wherein the main substrate includes a first surface of the main substrate and a second surface of the main substrate opposite to each other; the first module and the second module are stacked; the first module and the second module which are stacked, the cavity element and the large-size device are horizontally arranged on the first surface of the main substrate, and are respectively electrically connected to the main substrate. Owing to this arrangement, the demand of a current integrated package structure for a further high-density, miniaturized, multi-dimensional and multi-demand layout design can be met.