Patents by Inventor Shashank Ravindra Kulkarni

Shashank Ravindra Kulkarni has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8622017
    Abstract: An electroless plating system includes a plating solution, and controlling reducing agents in the plating solution for deposition over outlier features smaller than about five hundred nanometers and isolated by about one thousand nanometers.
    Type: Grant
    Filed: May 19, 2011
    Date of Patent: January 7, 2014
    Assignee: Lam Research Corporation
    Inventors: Igor Ivanov, Robert D. Tas, Shashank Ravindra Kulkarni, Ron Rulkens
  • Publication number: 20110214608
    Abstract: An electroless plating system includes a plating solution, and controlling reducing agents in the plating solution for deposition over outlier features smaller than about five hundred nanometers and isolated by about one thousand nanometers.
    Type: Application
    Filed: May 19, 2011
    Publication date: September 8, 2011
    Inventors: Igor Ivanov, Robert D. Tas, Shashank Ravindra Kulkarni, Ron Rulkens
  • Patent number: 7972652
    Abstract: An electroless plating system includes a plating solution, and controlling reducing agents in the plating solution for deposition over outlier features smaller than about five hundred nanometers and isolated by about one thousand nanometers.
    Type: Grant
    Filed: October 14, 2006
    Date of Patent: July 5, 2011
    Assignee: Lam Research Corporation
    Inventors: Igor Ivanov, Robert D. Tas, Shashank Ravindra Kulkarni, Ron Rulkens
  • Publication number: 20110135824
    Abstract: An electroless deposition method includes providing a deposition solution, and saturating the deposition solution with an oxygen concentration in a range from about two thousand parts per million to about twenty thousand parts per million, and replenishing deionized water in the deposition solution.
    Type: Application
    Filed: February 16, 2011
    Publication date: June 9, 2011
    Inventors: Ron Rulkens, Robert D. Tas, Shashank Ravindra Kulkarni, Artur Kolics, Nancy E. Gilbert
  • Patent number: 7913644
    Abstract: An electroless deposition system includes a deposition solution, and saturating the deposition solution with an oxygen concentration in a range from about two thousand parts per million to about twenty thousand parts per million.
    Type: Grant
    Filed: September 30, 2006
    Date of Patent: March 29, 2011
    Assignee: Lam Research Corporation
    Inventors: Ron Rulkens, Robert D. Tas, Shashank Ravindra Kulkarni, Artur Kolics, Nancy E. Gilbert
  • Publication number: 20090288593
    Abstract: An electroless deposition system includes a deposition solution, and saturating the deposition solution with an oxygen concentration in a range from about two thousand parts per million to about twenty thousand parts per million.
    Type: Application
    Filed: September 30, 2006
    Publication date: November 26, 2009
    Applicant: BLUE 29, LLC
    Inventors: Ron Rulkens, Robert D. Tas, Shashank Ravindra Kulkarni, Artur Kolics, Nancy E. Gilbert
  • Publication number: 20090253262
    Abstract: An electroless plating system includes a plating solution, and controlling reducing agents in the plating solution for deposition over outlier features smaller than about five hundred nanometers and isolated by about one thousand nanometers.
    Type: Application
    Filed: October 14, 2006
    Publication date: October 8, 2009
    Applicant: Blue29, LLC
    Inventors: Igor Ivanov, Robert D. Tas, Shashank Ravindra Kulkarni, Ron Rulkens