Abstract: A high-temperature decomposition reactor is provided. The reactor includes a reaction vessel, a furnace, and an insulation layer. The reaction vessel includes an inner volume configured to contain a quantity of carbonated medium while the quantity of carbonated medium transitions to a quantity of carbonation medium. The furnace is disposed around the reaction vessel and includes a furnace material. The furnace material is configured to simultaneously absorb heat and transmit heat. In some instances, the furnace material transmits heat to the inner volume to heat the carbonated medium. The insulation layer is disposed around the furnace and configured to prevent thermal losses from the reactor.

Abstract: Embodiments described herein relate to capturing and sequestering CO2 emissions from the cement production process with the potential to produce carbon-negative cement. Methods described herein can include contacting calcium oxide (CaO) with ambient air at a carbonation station to form a first stream of calcium carbonate, combining the first stream of calcium carbonate with a second stream of calcium carbonate in a calciner to form a combined stream of calcium carbonate, and applying heat to the calciner to decompose the combined stream of calcium carbonate into a stream of calcium oxide and a CO2 stream. The method further includes sequestering the CO2 stream, dividing the stream of calcium oxide into a first calcium oxide stream and a second calcium oxide stream, feeding the first stream of calcium oxide to the carbonation station, and feeding the second stream of calcium oxide to a kiln to produce a clinker.

Abstract: A spatial model of a printed circuit board assembly is generated based on an input file. The spatial model is used to determine a spatial feature not directly specified in the input file. A manufacturing parameter is determined based at least in part on the determined spatial feature. A proposal to manufacture the printed circuit board assembly is generated programmatically based at least in part on the determined manufacturing parameter.

Abstract: A spatial model of a printed circuit board assembly is generated based on an input file. The spatial model is used to determine a spatial feature not directly specified in the input file. A manufacturing parameter is determined based at least in part on the determined spatial feature. A proposal to manufacture the printed circuit board assembly is generated programmatically based at least in part on the determined manufacturing parameter.

Abstract: A spatial model of a printed circuit board assembly is generated based on an input file. The spatial model is used to determine a spatial feature not directly specified in the input file. A manufacturing parameter is determined based at least in part on the determined spatial feature. A proposal to manufacture the printed circuit board assembly is generated programmatically based at least in part on the determined manufacturing parameter.

Abstract: A spatial model of a printed circuit board assembly is generated based on an input file. The spatial model is used to determine a spatial feature not directly specified in the input file. A manufacturing parameter is determined based at least in part on the determined spatial feature. A proposal to manufacture the printed circuit board assembly is generated programmatically based at least in part on the determined manufacturing parameter.

Abstract: A spatial model of a printed circuit board assembly is generated based on an input file. The spatial model is used to determine a spatial feature not directly specified in the input file. A manufacturing parameter is determined based at least in part on the determined spatial feature. A proposal to manufacture the printed circuit board assembly is generated programmatically based at least in part on the determined manufacturing parameter.