Abstract: A planar sensor array, like an imaging sensor array, can be mounted to a ceramic circuit board to provide improved mechanical stability and heat dissipation. Embodiments herein provide improvements to such assemblies by providing two or more recesses in the ceramic circuit board opposite the sensor array. Electronic components can be placed in these recesses, reducing the overall size and moment of inertia of the sensor assembly relative to placement on the same side of the ceramic circuit board as the sensor array. Placing the electronics in the two or more recesses allows for simplified mounting of the assembly to heat sinks, flexible circuit boards, or other elements. The two or more recesses are separated by a stiffening cross-brace portion of the ceramic circuit board that enhances the mechanical strength of the ceramic circuit board.

Abstract: The present disclosure relates to optical systems, vehicles, and methods for providing improved mechanical performance of a camera and corresponding optical elements. An example optical system includes an outer housing and an inner support member. The optical system also includes an optical window coupled to the outer housing and the inner support member. The optical window is configured to be temperature-controllable. The optical system also includes a camera coupled to the inner support member. The camera is optically coupled to the optical window. Additionally, the outer housing, the optical window, and the camera are configured to be impact resistant.

Abstract: A system includes a chamber body defining a processing volume. The system further includes a substrate support pedestal positioned in the processing volume and operable to support a substrate, the substrate support pedestal including one or more channels, where a coolant medium flows through the one or more channels to facilitate heat transfer from the substrate to the coolant medium. The system further includes a coolant medium circulator to circulate the coolant medium through the one or more channels. The system further includes a substrate temperature sensor operatively coupled to the chamber body, where the substrate temperature sensor measures a temperature of the substrate. The system further includes a coolant medium circulation controller, coupled to the coolant medium circulator and the substrate temperature sensor, to control a rate at which the coolant medium is circulated through the one or more channels.

Abstract: Embodiments disclosed herein include a method of thermal treatment or radical species treatment of a photoresist a metal-oxide photoresist. In an embodiment, a method of patterning a metal-oxide photoresist, such as a Sn-based photoresist, includes depositing the metal-oxide photoresist over a substrate, exposing the metal-oxide photoresist with an extreme ultra-violet (EUV) exposure to form exposed regions and non-exposed regions, developing the exposed metal-oxide photoresist, and performing a thermal treatment and/or a radical species treatment of the metal-oxide photoresist.

Abstract: A camera includes a camera focus adjustment device, a lens, and an image sensor coupled to the camera focus adjustment device. The camera focus adjustment device includes a flexure structure. The flexure structure includes an outer framework of structural members continuously interconnected by flexure notch hinges. The flexure structure also includes two inner structural members oriented in parallel and extending from the outer framework of structural members. A gap is between the two inner structural members. The camera focus adjustment device also includes a piezoelectric material within the gap and a pair of wedges within the gap. The pair of wedges is affixed to the piezoelectric material and to one inner structural member of the two inner structural members. Based on temperature-based piezoelectric activity associated with the piezoelectric material, the camera focus adjustment device is operable to move the image sensor relative to the lens.

Abstract: Some embodiments include a camera voice coil motor (VCM) actuator that includes an additive coil structure for shifting a lens along one or multiple axes. The additive coil structure may include a base portion configured to couple with a lens carrier and at least partially surround a perimeter of the lens carrier. In various examples, the additive coil structure may include folded portions that individually include a respective coil that is located proximate a respective magnet. According to various embodiments, the additive coil structure may be formed using an additive process.

Abstract: In some embodiments, a camera includes a lens assembly in a lens carrier, an image sensor for capturing a digital representation of light transiting the lens, and a voice coil motor. In some embodiments, the voice coil motor includes a spring suspension assembly for moveably mounting the lens carrier to an actuator base, a plurality of permanent magnets mounted to the actuator base through a magnet holder assembly and a focusing coil fixedly mounted to the lens carrier and mounted to the actuator base through the suspension assembly. In some embodiments, the permanent magnets each generate a magnetic field of a respective permanent magnet field strength, and the magnet holder assembly generates a holder magnetic field of a holder magnetic field strength.

Abstract: Various embodiments include a camera with a folded optics arrangement and include a voice coil motor (VCM) actuator assembly to provide autofocus (AF) and/or optical image stabilization (OIS) movement. The camera with folded optics and the associated VCM actuator assembly have a first rotational normal mode of free vibration such that lenses of the camera rotate about an optical axis of the camera such that the rotational motion in the first rotational mode of free vibration is invisible from a perspective of an image sensor of the camera.

Abstract: A camera includes a camera focus adjustment device, a lens, and an image sensor coupled to the camera focus adjustment device. The camera focus adjustment device includes a flexure structure. The flexure structure includes an outer framework of structural members continuously interconnected by flexure notch hinges. The flexure structure also includes two inner structural members oriented in parallel and extending from the outer framework of structural members. A gap is between the two inner structural members. The camera focus adjustment device also includes a piezoelectric material within the gap and a pair of wedges within the gap. The pair of wedges is affixed to the piezoelectric material and to one inner structural member of the two inner structural members. Based on temperature-based piezoelectric activity associated with the piezoelectric material, the camera focus adjustment device is operable to move the image sensor relative to the lens.

Abstract: Vapor deposition precursor recovery systems and methods are provided. Methods and systems include a precursor container housing a precursor material and a carrier gas container housing a carrier gas. Systems and methods include a condenser assembly having a condenser in fluid connection with an exhaust line, a recycled precursor container, and a cooling circuit. Systems and methods include a vaporizer having one or more inlets in fluid connection with the precursor container and the carrier gas container, and an outlet in fluid connection with a gas distributor and the condenser assembly. Systems and methods include where the condenser is maintained at an internal temperature of greater than or about 10° C. below a boiling point of the precursor material and greater than or about 10° C. above a boiling point of the carrier gas.

Abstract: Example embodiments relate to enhanced depth of focus cameras using variable apertures and pixel binning. An example embodiment includes a device. The device includes an image sensor. The image sensor includes an array of light-sensitive pixels and a readout circuit. The device also includes a variable aperture. Additionally, the device includes a controller that is configured to cause: the variable aperture to adjust to a first aperture size when a high-light condition is present, the variable aperture to adjust to a second aperture size when a low-light condition is present, the readout circuit to perform a first level of pixel binning when the high-light condition is present, and the readout circuit to perform a second level of pixel binning when the low-light condition is present. The second aperture size is larger than the first aperture size. The second level of pixel binning is greater than the first level of pixel binning.

Abstract: Various embodiments include a camera voice coil motor (VCM) actuator configured to shift an image sensor along multiple axes. Some embodiments include a magnet and coil arrangement. Some embodiments include a position sensing arrangement. Some embodiments include a flexure arrangement. Some embodiments include a coil structure and coil carrier assembly.

Abstract: In some embodiments, a camera actuator includes an actuator base, an autofocus voice coil motor, and an optical image stabilization voice coil motor. In some embodiments, the autofocus voice coil motor includes a lens carrier mounting attachment moveably mounted to the actuator base, a plurality of shared magnets mounted to the base, and an autofocus coil fixedly mounted to the lens carrier mounting attachment for producing forces for moving a lens carrier in a direction of an optical axis of one or more lenses of the lens carrier. In some embodiments, the optical image stabilization voice coil motor includes an image sensor carrier moveably mounted to the actuator base, and optical image stabilization coils moveably mounted to the image sensor carrier within the magnetic fields of the shared magnets, for producing forces for moving the image sensor carrier in a plurality of directions orthogonal to the optical axis.

Abstract: A method of post-deposition processing includes performing a preheat process in a radical treatment chamber, the preheat process comprising exposing a substrate having a metal layer formed thereon to purge gas and purging the purge gas at a pressure of between 400 Torr and 535 Torr, and performing a radical treatment process in the radical treatment chamber, the radical treatment process comprising exposing the substrate to radical species.

Abstract: One example system comprises an active sensor that includes a transmitter and a receiver, a first camera that detects external light originating from one or more external light sources to generate first image data, a second camera that detects external light originating from one or more external light sources to generate second image data, and a controller. The controller is configured to perform operations comprising determining a first distance estimate to a first object based on a comparison of the first image data and the second image data, determining a second distance estimate to the first object based on active sensor data, comparing the first distance estimate and the second distance estimate, and determining a third distance estimate to a second object based on the first image data, the second image data, and the comparison of the first and second distance estimates.

Abstract: Exemplary substrate processing systems may include a lid plate. The systems may include a plurality of processing regions. The systems may include at least one splitter. Each splitter may include a top surface and side surfaces. Each splitter may define an inlet and a plurality of outlets. Each inlet and outlet may extend through a side surface. Each splitter may define an inlet lumen that extends from the fluid inlet to a hub. Each splitter may define a plurality of outlet lumens that each extend from the hub to one of the outlets. Each of the outlet lumens may have a same length. The systems may include a plurality of output manifolds. Each of the output manifolds may be coupled with a respective processing region. The systems may include a plurality of valves. At least one valve may be coupled between each outlet and an output manifold.

Abstract: Various embodiments include a camera with folded optics. Some embodiments include a voice coil motor (VCM) actuator module to provide autofocus (AF) and/or optical image stabilization (OIS) movement. Some embodiments include suspension arrangements. Some embodiments include flexure arrangements. In some embodiments the VCM actuator module includes an OIS actuator that tilts a prism.

Abstract: In some embodiments, a camera actuator includes an actuator base, an autofocus voice coil motor, and an optical image stabilization voice coil motor. In some embodiments, the autofocus voice coil motor includes a lens carrier mounting attachment moveably mounted to the actuator base, a plurality of shared magnets mounted to the base, and an autofocus coil fixedly mounted to the lens carrier mounting attachment for producing forces for moving a lens carrier in a direction of an optical axis of one or more lenses of the lens carrier. In some embodiments, the optical image stabilization voice coil motor includes an image sensor carrier moveably mounted to the actuator base, and optical image stabilization coils moveably mounted to the image sensor carrier within the magnetic fields of the shared magnets, for producing forces for moving the image sensor carrier in a plurality of directions orthogonal to the optical axis.

Abstract: Various embodiments include a camera voice coil motor (VCM) actuator configured to shift an image sensor along multiple axes. Some embodiments include a magnet and coil arrangement. Some embodiments include a position sensing arrangement. Some embodiments include a flexure arrangement. Some embodiments include a coil structure and coil carrier assembly.

Abstract: A method of forming an electrical contact in semiconductor structure includes performing a selective deposition process on a semiconductor structure having a semiconductor region and a dielectric layer having a trench therewithin, the selective deposition process comprising epitaxially forming a contact layer on the semiconductor region within the trench of the dielectric layer, and performing a microwave anneal process to activate dopants in the epitaxially formed contact layer.