Patents by Inventor Shashank Shrikant AGASHE

Shashank Shrikant AGASHE has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230230266
    Abstract: Systems and methods for brightfield inspection of a circular rotating wafer are provided. A method includes: acquiring a plurality of images of a circular wafer, that is rotating, by using a plurality of line cameras; obtaining a plurality of synchronized images, based on the plurality of images, by synchronizing a motion of the circular wafer, that is rotating, with at least one line camera from among the plurality of line cameras; obtaining a single wafer map by integrating together the plurality of synchronized images; obtaining an in-focus image of the single wafer map while the circular wafer is moving; and performing brightfield inspection of the circular wafer based on the in-focus image of the single wafer map.
    Type: Application
    Filed: October 3, 2022
    Publication date: July 20, 2023
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Shashank Shrikant AGASHE, Gaurav KUMAR
  • Patent number: 11639906
    Abstract: Provided is a method for virtually executing an operation of an energy dispersive x-ray spectrometry (EDS) system in real time production line by analyzing a defect included in a material undergoing inspection based on computer vision, the method including receiving a scanning electron microscope (SEM) image of the material including the defect, extracting an image-feature from the SEM image of the material, classifying the extracted image-feature under a predetermined label, predicting, based on the classified image-feature, an element associated with the defect included in the material and a shape of the predicted element, and grading the defect included in the material based on comparing the predicted element with a predetermined criteria.
    Type: Grant
    Filed: February 25, 2021
    Date of Patent: May 2, 2023
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Shashank Shrikant Agashe, Gaurav Kumar, Priya Ranjan Sinha, Lakshmi Narayana Pedapudi, Avadhut Dipakrao Chaudhari, Dongwoo Lee, Taehyoung Lee
  • Patent number: 11529721
    Abstract: A wrench device includes a data receiving component configured to receive, from a transceiver associated with a piece of equipment, information related to a fastener included in the piece of equipment, and a torque value corresponding to the fastener. The wrench device further includes an image sensor configured to capture an image of the fastener, a processor, and a memory communicatively coupled to the processor. The memory stores processor-executable instructions, which, on execution, cause the processor to receive the image of the fastener from the image sensor, receive the information related to the fastener from the data receiving component, identify the fastener by correlating the received image with the information related to the fastener, extract the torque value corresponding to the fastener based on the information upon identification of the fastener, and adjust a torque of the fastener based on the extracted torque value.
    Type: Grant
    Filed: November 27, 2019
    Date of Patent: December 20, 2022
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Shashank Shrikant Agashe, Sameera Bharadwaja Hayavadana, Byeongeon Lee
  • Publication number: 20220344220
    Abstract: Example embodiments may provide methods for determining a quality of a film in spin coating process. The methods may include capturing images of portions of the film using an imaging device while coating the film on a substrate using a spinner. The imaging device may include SPCs and lens and/or SLMs. The methods may also include determining whether a characteristic of the film matches to a standard based on the images of the portions of the film. The method may further include performing detecting that the quality of the film is optimal in response to determining that the characteristic of the film matches to the standard or detecting that the quality of the film is not optimal in response to determining that the characteristic of the film does not match to the standard.
    Type: Application
    Filed: June 8, 2021
    Publication date: October 27, 2022
    Inventors: GAURAV KUMAR, LAKSHMI NARAYANA PEDAPUDI, SAMEERA BHARADWAJA HAYAVADANA, SATHYANARAYANAN KULASEKARAN, SHASHANK SHRIKANT AGASHE, WAN SUNG PARK, SUNG HA KIM
  • Publication number: 20220189806
    Abstract: The present disclosure relates to a method for estimating heights of defects in a wafer. The method comprises creating an un-calibrated 3D model of a defect in a wafer, determining one or more attributes associated with the un-calibrated 3D model, transforming the un-calibrated 3D model to a calibrated 3D model, and estimating a height of the defect using the calibrated 3D model. Creating an un-calibrated 3D model corresponds to a defect present in a wafer based on a plurality of Scanning Electron Microscope (SEM) images of the defect. Transforming the un-calibrated 3D model to a calibrated 3D model uses a scaling factor corresponding to the determined one or more attributes associated with the un-calibrated 3D model. A height of the defect is estimated based on the calibrated 3D model of the defect.
    Type: Application
    Filed: March 3, 2021
    Publication date: June 16, 2022
    Inventors: Shashank Shrikant Agashe, Gaurav Kumar, Sathyanarayanan Kulasekaran, Chanwoo Park, Yunje Cho
  • Publication number: 20220163467
    Abstract: Provided is a method for virtually executing an operation of an energy dispersive x-ray spectrometry (EDS) system in real time production line by analyzing a defect included in a material undergoing inspection based on computer vision, the method including receiving a scanning electron microscope (SEM) image of the material including the defect, extracting an image-feature from the SEM image of the material; classifying the extracted image-feature under a predetermined label, predicting, based on the classified image-feature, an element associated with the defect included in the material and a shape of the predicted element, and grading the defect included in the material based on comparing the predicted element with a predetermined criteria.
    Type: Application
    Filed: February 25, 2021
    Publication date: May 26, 2022
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Shashank Shrikant AGASHE, Gaurav KUMAR, Priya Ranjan SINHA, Lakshmi Narayana PEDAPUDI, Avadhut Dipakrao CHAUDHARI, Dongwoo LEE, Taehyoung LEE
  • Patent number: 11144702
    Abstract: A method is disclosed of generating a die tensor of a wafer from a Computer-Aided Design (CAD) file. According to the method, a segmentation engine segments a wireframe image obtained from the CAD file into a plurality of entities. An image transformation engine performs a transform on each of the plurality of entities based on at least one of the wireframe image, metrology, a design specification, process information, and optical information. The transform is performed iteratively based on the optical information. A stitch engine generates a die tensor, having a predefined number of slices, by combining each of the transformed plurality of entities.
    Type: Grant
    Filed: July 26, 2019
    Date of Patent: October 12, 2021
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Mintu Dutta, Sameera Bharadwaja Hayavadana, Shashank Shrikant Agashe, Rathish Balagangadhar, Anmol Varma, Heon Ju Shin
  • Publication number: 20210078147
    Abstract: A wrench device includes a data receiving component configured to receive, from a transceiver associated with a piece of equipment, information related to a fastener included in the piece of equipment, and a torque value corresponding to the fastener. The wrench device further includes an image sensor configured to capture an image of the fastener, a processor, and a memory communicatively coupled to the processor. The memory stores processor-executable instructions, which, on execution, cause the processor to receive the image of the fastener from the image sensor, receive the information related to the fastener from the data receiving component, identify the fastener by correlating the received image with the information related to the fastener, extract the torque value corresponding to the fastener based on the information upon identification of the fastener, and adjust a torque of the fastener based on the extracted torque value.
    Type: Application
    Filed: November 27, 2019
    Publication date: March 18, 2021
    Inventors: Shashank Shrikant Agashe, Sameera Bharadwaja Hayavadana, Byeongeon Lee
  • Publication number: 20200081422
    Abstract: The embodiments herein disclose methods and systems for predicting health of products in a manufacturing process. A method includes determining at least one of a dynamic data and a static data of at least one product from a manufacturing process steps. Further, the method includes determining and filtering at least one of a gradual change, an abrupt change and a similar data present in the at least one of the dynamic data and the static data. Further, the method includes converting the filtered at least one of the dynamic data and the static data of the at least one product into a common data format. The common data format can be stored in a common hyperspace. Further, the method includes predicting a health of the at least one product based on the common data format and the at least one product historical health information received from an apriori computer.
    Type: Application
    Filed: January 18, 2019
    Publication date: March 12, 2020
    Inventors: SHASHANK SHRIKANT AGASHE, Sameera Bharadwaja Hayavadana, Byeong Eon Lee, Harshit Pande, Yune Tech Han
  • Publication number: 20200034511
    Abstract: A method is disclosed of generating a die tensor of a wafer from a Computer-Aided Design (CAD) file. According to the method, a segmentation engine segments a wireframe image obtained from the CAD file into a plurality of entities. An image transformation engine performs a transform on each of the plurality of entities based on at least one of the wireframe image, metrology, a design specification, process information, and optical information. The transform is performed iteratively based on the optical information. A stitch engine generates a die tensor, having a predefined number of slices, by combining each of the transformed plurality of entities.
    Type: Application
    Filed: July 26, 2019
    Publication date: January 30, 2020
    Inventors: MINTU DUTTA, SAMEERA BHARADWAJA HAYAVADANA, SHASHANK SHRIKANT AGASHE, RATHISH BALAGANGADHAR, ANMOL VARM, HEON JU SHIN
  • Patent number: 10521695
    Abstract: The present inventive concepts discloses methods, apparatuses, and/or systems for enabling spatially varying auto focusing of one or more objects using an image capturing system. The methods, apparatuses, and/or systems may include focusing objects in a region of interest using lenses, enabling spatially varying auto focusing of objects in the region of interest using a spatial light modulators (SLM), which are out of focus in the region of interest, and capturing the focused and the auto focused objects in the region of interest using a camera sensor.
    Type: Grant
    Filed: March 23, 2016
    Date of Patent: December 31, 2019
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Shashank Shrikant Agashe, Gaurav Kumar
  • Publication number: 20170061603
    Abstract: The present inventive concepts discloses methods, apparatuses, and/or systems for enabling spatially varying auto focusing of one or more objects using an image capturing system. The methods, apparatuses, and/or systems may include focusing objects in a region of interest using lenses, enabling spatially varying auto focusing of objects in the region of interest using a spatial light modulators (SLM), which are out of focus in the region of interest, and capturing the focused and the auto focused objects in the region of interest using a camera sensor.
    Type: Application
    Filed: March 23, 2016
    Publication date: March 2, 2017
    Inventors: Shashank Shrikant AGASHE, Gaurav KUMAR