Patents by Inventor Shashibhushan Mishra

Shashibhushan Mishra has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11845243
    Abstract: A multilayer structure comprising a sealant layer which comprises (a) a blend comprising (i) from 80 to 95 percent by weight of at least one ethylene/?-olefin interpolymer composition which comprises a homogeneously branched linear ethylene polymer composition and a heterogeneously branched linear ethylene polymer composition and (ii) from 5 to 20 percent by weight of at least one high pressure ethylene polymer characterized as having a melt index, I2 less than 6.0 g/10 minutes, a density of at least 0.916 g/cc, a Mw/Mn ratio of at least 7.0, wherein the blend has a melt index, I2, of at least 1.0 g/10 minutes; and (b) a low density polyethylene composition which comprises at least two components selected from the group consisting of homogeneously and heterogeneously branched linear ethylene polymers, wherein the composition has density from 0.90 to 0.930 g/cc and an I2 of from 1 to 50 g/10 minutes is provided.
    Type: Grant
    Filed: November 19, 2021
    Date of Patent: December 19, 2023
    Assignee: Dow Global Technologies LLC
    Inventors: Shashibhushan Mishra, Prajwal Shah
  • Publication number: 20220072835
    Abstract: A multilayer structure comprising a sealant layer which comprises (a) a blend comprising (i) from 80 to 95 percent by weight of at least one ethylene/?-olefin interpolymer composition which comprises a homogeneously branched linear ethylene polymer composition and a heterogeneously branched linear ethylene polymer composition and (ii) from 5 to 20 percent by weight of at least one high pressure ethylene polymer characterized as having a melt index, I2 less than 6.0 g/10 minutes, a density of at least 0.916 g/cc, a Mw/Mn ratio of at least 7.0, wherein the blend has a melt index, I2, of at least 1.0 g/10 minutes; and (b) a low density polyethylene composition which comprises at least two components selected from the group consisting of homogeneously and heterogeneously branched linear ethylene polymers, wherein the composition has density from 0.90 to 0.930 g/cc and an I2 of from 1 to 50 g/10 minutes is provided.
    Type: Application
    Filed: November 19, 2021
    Publication date: March 10, 2022
    Applicant: Dow Global Technologies LLC
    Inventors: Shashibhushan Mishra, Prajwal Shah
  • Patent number: 11203193
    Abstract: Embodiments of a laminate structure for use in flexible packaging comprise a sealant film comprising ethylene-based polymer, and a multilayer polyethylene print film laminated to the sealant film. The print film comprises at least 3 layers and has an overall thickness from 15 to 30 ?m. The print film comprises a middle layer, an inner layer disposed between sealant film and the middle layer, and an outer layer, wherein the middle layer comprises at least 90% by weight high density polyethylene (HDPE) polymer having a density from 0.950 to 0.965 g/cc. The inner layer and the outer layer comprise linear low density polyethylene (LLDPE) having a density from 0.925 to 0.965 g/cc. The laminate structure yields desired optical and mechanical properties coupled with recyclability and improved printing efficiency, while maintaining these low thicknesses for the print film.
    Type: Grant
    Filed: April 4, 2018
    Date of Patent: December 21, 2021
    Assignee: Dow Global Technologies
    Inventors: Shashibhushan Mishra, Sachin Laddha
  • Patent number: 11179919
    Abstract: A multilayer structure comprising a sealant layer which comprises (a) a blend comprising (i) from 80 to 95 percent by weight of at least one ethylene/?-olefin interpolymer composition which comprises a homogeneously branched linear ethylene polymer composition and a heterogeneously branched linear ethylene polymer composition and (ii) from 5 to 20 percent by weight of at least one high pressure ethylene polymer characterized as having a melt index, I2 less than 6.0 g/10 minutes, a density of at least 0.916 g/cc, a Mw/Mn ratio of at least 7.0, wherein the blend has a melt index, I2, of at least 1.0 g/10 minutes; and (b) a low density polyethylene composition which comprises at least two components selected from the group consisting of homogeneously and heterogeneously branched linear ethylene polymers, wherein the composition has density from 0.90 to 0.930 g/cc and an I2 of from 1 to 50 g/10 minutes is provided.
    Type: Grant
    Filed: December 14, 2015
    Date of Patent: November 23, 2021
    Assignee: Dow Global Technologies LLC
    Inventors: Shashibhushan Mishra, Prajwal Shah
  • Publication number: 20210331845
    Abstract: Embodiments of laminate structures for flexible packaging comprise a print film comprising ethylene-based polymer, a sealant film laminated to the print film, wherein the sealant film comprising at least 3 layers and has an overall thickness from 15 to 30 ?m. The sealant film comprises a middle layer, an outer layer, and an inner layer disposed between the print film and the middle layer. The inner layer comprises an ethylene interpolymer having a density from 0.910 to 0.925 g/cc and a melt index (I2) from 0.5 to 5 g/10 min, and at least one of the inner layer, the middle layer, and the outer layer comprise a first composition comprising at least one ethylene based polymer, wherein the first composition comprises a Molecular Weighted Comonomer Distribution Index (MWCDI) value greater than 0.9, and a melt index ratio (I10/I2) that meets the equation: I10I2?7.0-log (I2).
    Type: Application
    Filed: June 27, 2018
    Publication date: October 28, 2021
    Applicant: Dow Global Technologies LLC
    Inventors: Sachin Laddha, Shashibhushan Mishra, Jian Wang
  • Publication number: 20200061984
    Abstract: Embodiments of a laminate structure for use in flexible packaging comprise a sealant film comprising ethylene-based polymer, and a multilayer polyethylene print film laminated to the sealant film. The print film comprises at least 3 layers and has an overall thickness from 15 to 30 ?m. The print film comprises a middle layer, an inner layer disposed between sealant film and the middle layer, and an outer layer, wherein the middle layer comprises at least 90% by weight high density polyethylene (HDPE) polymer having a density from 0.950 to 0.965 g/cc. The inner layer and the outer layer comprise linear low density polyethylene (LLDPE) having a density from 0.925 to 0.965 g/cc. The laminate structure yields desired optical and mechanical properties coupled with recyclability and improved printing efficiency, while maintaining these low thicknesses for the print film.
    Type: Application
    Filed: April 4, 2018
    Publication date: February 27, 2020
    Applicant: Dow Global Technologies LLC
    Inventors: Shashibhushan Mishra, Sachin Laddha
  • Publication number: 20170326847
    Abstract: A multilayer structure comprising a sealant layer which comprises (a) a blend comprising (i) from 80 to 95 percent by weight of at least one ethylene/?-olefin interpolymer composition which comprises a homogeneously branched linear ethylene polymer composition and a heterogeneously branched linear ethylene polymer composition and (ii) from 5 to 20 percent by weight of at least one high pressure ethylene polymer characterized as having a melt index, I2 less than 6.0 g/10 minutes, a density of at least 0.916 g/cc, a Mw/Mn ratio of at least 7.0, wherein the blend has a melt index, 12, of at least 1.0 g/10 minutes; and (b) a low density polyethylene composition which comprises at least two components selected from the group consisting of homogeneously and heterogeneously branched linear ethylene polymers, wherein the composition has density from 0.90 to 0.930 g/cc and an I2 of from 1 to 50 g/10 minutes is provided.
    Type: Application
    Filed: December 14, 2015
    Publication date: November 16, 2017
    Applicant: Dow Global Technologies LLC
    Inventors: Shashibhushan Mishra, Prajwal Shah