Patents by Inventor Shashikant Dhondopant Patil

Shashikant Dhondopant Patil has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Devices and methods for cooling components on a PCB
    Patent number: 9398682
    Abstract: There is described an electronic assembly comprising a structure and a printed circuit board (PCB) connected to the structure to form a duct. The PCB has a first side arranged to receive one or more heat-generating components, and a second side. The PCB comprises one or more apertures formed therein. The electronic assembly further comprises airflow generating means arranged to generate an airflow along the duct and along the second side of the PCB such that air is forced through the one or more apertures. By forming a duct beneath a PCB and allowing air to be forced through apertures formed in the PCB, more efficient cooling of components on the PCB may be achieved. For example, the position of the apertures may be tailored such that specific components, or specific parts of components, may be exposed to airflow through the apertures.
    Type: Grant
    Filed: March 27, 2014
    Date of Patent: July 19, 2016
    Assignee: CONTROL TECHNIQUES LIMITED
    Inventors: Shashikant Dhondopant Patil, Vinayak Lata Kurkure, Jonathan Robert Holman-White
  • Devices And Methods For Cooling Components On A PCB
    Publication number: 20140355211
    Abstract: There is described an electronic assembly comprising a structure and a printed circuit board (PCB) connected to the structure to form a duct. The PCB has a first side arranged to receive one or more heat-generating components, and a second side. The PCB comprises one or more apertures formed therein. The electronic assembly further comprises airflow generating means arranged to generate an airflow along the duct and along the second side of the PCB such that air is forced through the one or more apertures. By forming a duct beneath a PCB and allowing air to be forced through apertures formed in the PCB, more efficient cooling of components on the PCB may be achieved. For example, the position of the apertures may be tailored such that specific components, or specific parts of components, may be exposed to airflow through the apertures.
    Type: Application
    Filed: March 27, 2014
    Publication date: December 4, 2014
    Applicant: Control Techniques Limited
    Inventors: Shashikant Dhondopant Patil, Vinayak Lata Kurkure, Jonathan Robert Holman-White