Patents by Inventor Shatki S. Chauhan

Shatki S. Chauhan has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Substrate-less integrated components
    Patent number: 10991659
    Abstract: Packages including substrate-less integrated components and methods of fabrication are described are described. In an embodiment, a packaging method includes attaching a ground structure to a carrier and a plurality of components face down to the carrier and laterally adjacent to the ground structure. The plurality of components are encapsulated within a molding compound, and the carrier is removed exposing a plurality of component terminals and a plurality of ground structure terminals. A plurality of packages are singulated.
    Type: Grant
    Filed: December 5, 2019
    Date of Patent: April 27, 2021
    Assignee: Apple Inc.
    Inventors: Flynn P. Carson, Jun Chung Hsu, Meng Chi Lee, Shatki S. Chauhan
  • SUBSTRATE-LESS INTEGRATED COMPONENTS
    Publication number: 20200144142
    Abstract: Packages including substrate-less integrated components and methods of fabrication are described are described. In an embodiment, a packaging method includes attaching a ground structure to a carrier and a plurality of components face down to the carrier and laterally adjacent to the ground structure. The plurality of components are encapsulated within a molding compound, and the carrier is removed exposing a plurality of component terminals and a plurality of ground structure terminals. A plurality of packages are singulated.
    Type: Application
    Filed: December 5, 2019
    Publication date: May 7, 2020
    Inventors: Flynn P. Carson, Jun Chung Hsu, Meng Chi Lee, Shatki S. Chauhan