Patents by Inventor Shau-Fu Sanford Chu

Shau-Fu Sanford Chu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6140197
    Abstract: A new method of fabricating an inductor utilizing air as an underlying barrier in the manufacture of integrated circuits is described. A metal line is provided overlying a dielectric layer on a semiconductor substrate. An intermetal dielectric layer is deposited overlying the metal line and the dielectric layer. The intermetal dielectric layer is patterned whereby a plurality of openings are made through the intermetal dielectric layer to the semiconductor substrate. Thereafter, an oxide layer is deposited overlying the intermetal dielectric layer and capping the plurality of openings thereby forming air gaps within the intermetal dielectric layer. A metal plug is formed through the oxide layer and the intermetal dielectric layer to the metal line.
    Type: Grant
    Filed: August 30, 1999
    Date of Patent: October 31, 2000
    Assignees: Chartered Semiconductor Manufacturing Ltd., National University of Singapore
    Inventors: Shau-Fu Sanford Chu, Kok Wai Johnny Chew, Chee Tee Chua, Cher Liang Cha