Abstract: Systems and methods described herein are directed towards integrating a shield layer into a current sensor to shield a magnetic field sensing element and associated circuitry in the current sensor from electrical, voltage, or electrical transient noise. In an embodiment, a shield layer may be disposed along at least one surface of a die supporting a magnetic field sensing element. The shield layer may be disposed in various arrangements to shunt noise caused by a parasitic coupling between the magnetic field sensing element and the current carrying conductor away from the magnetic field sensing element.

Abstract: A current sensor integrated circuit includes a lead frame having a primary conductor and at least one secondary lead, a semiconductor die disposed adjacent to the primary conductor, an insulation structure disposed between the primary conductor and the semiconductor die, and a non-conductive insulative material enclosing the semiconductor die, the insulation structure, a first portion of the primary conductor, and a first portion of the at least one secondary lead to form a package. The first portion of the at least one secondary lead (between a first end proximal to the primary conductor and a second end proximal to the second, exposed portion of the at least one secondary lead) has a thickness that is less than a thickness of the second, exposed portion of the least one secondary lead. A distance between the second, exposed portion of the primary conductor and the second, exposed portion of the at least one secondary lead is at least 7.2 mm.

Abstract: Methods for providing a sensor integrated circuit package including employing a conductive leadframe and forming a non-conductive die paddle in relation to the leadframe. The method can further include placing a die on the non-conductive die paddle to form an assembly, forming at least one electrical connection between the die and the leadframe, and overmolding the assembly to form an integrated circuit package.

Abstract: A current sensor includes a ferromagnetic core having a substantially central opening for receiving a current conductor and at least two gaps portions, each of the gap portions having an associated gap spacing. A detector of the current sensor includes at least one first sensing element disposed in a first one of the gap portions and configured to generate a respective first magnetic field signal in response to a first magnetic field generated in the first gap portion in response to a current through the current conductor. The detector also includes at least one second sensing element disposed in a second one of the gap portions and configured to generate a respective second magnetic field signal in response to a second magnetic field generated in the second gap portion in response to the current through the conductor. A method of sensing a current through a current conductor is also provided.

Abstract: A current sensor includes a ferromagnetic core having a substantially central opening for receiving a current conductor and a gap. A detector of the current sensor includes at least one first magnetic field sensing element disposed in a first gap portion and configured to generate a respective first magnetic field signal in response to a first magnetic field having a first angle with respect to the at least one first magnetic field sensing element. The detector also includes at least one second magnetic field sensing element disposed in a second gap portion and configured to generate a respective second magnetic field signal in response to a second magnetic field having a second angle with respect to the at least one second magnetic field sensing element. The first and second magnetic fields are substantially equal in magnitude and the first and second angles are substantially opposite in polarity.

Abstract: Systems and methods described herein are directed towards differential current sensing a current sensor having two or more magnetic field sensing elements that are oriented to sense a magnetic field generated by a current through an external conductor in the same direction. The current sensor can be positioned such that at least one first magnetic field sensing element is vertically aligned with the external conductor and at least one second magnetic field sensing element is not vertically aligned with the external conductor. The magnetic field sensing elements may be spaced from each to measure a gradient field and can generate a magnetic field signal indicative of a distance between the respective magnetic field sensing element and the current carrying external conductor. A difference between the magnetic field signals can be determined that is indicative of the current through the external conductor.

Abstract: Methods and apparatus to provide an integrated circuit having a magnetic sensing element having differential first and second outputs and an input, the input to receive current and first and second switches coupled to a respective one of the differential first and second outputs. A first voltage source is coupled between the first and second switches, the first and second switches having a first state in which the first voltage source is coupled across the differential first and second outputs, and an IC output can output a voltage corresponding to the first voltage source when the first and second switches are in the first state for monitoring operation of a signal path from the magnetic sensing element to the IC output.

Abstract: Systems and methods are described herein for reducing the effects of magnetic field cross-coupling in a multi-conductor current sensor system. A current sensor system includes one or more current sensors, each positioned proximate to at least one conductor and spaced from at least one other conductor. Each conductor carries a current intended to be measured by a respective current sensor. The current sensors include one or more magnetic field sensing elements to generate a magnetic field signal indicative of a detected magnetic field. A characterization measurement is performed to determine the coupling between each current sensor and the respective current conductor and to determine the coupling between the current sensor and the other ones of the current conductors, by providing a reference current to each of the conductors and measuring the outputs at each of the current sensors. The characterization measurement can be used to generate a coupling matrix.

Abstract: Systems and methods described herein are directed towards integrating a shield layer into a current sensor to shield a magnetic field sensing element and associated circuitry in the current sensor from electrical, voltage, or electrical transient noise. In an embodiment, a shield layer may be disposed along at least one surface of a die supporting a magnetic field sensing element. The shield layer may be disposed in various arrangements to shunt noise caused by a parasitic coupling between the magnetic field sensing element and the current carrying conductor away from the magnetic field sensing element.

Abstract: Methods and apparatus to provide an integrated circuit having a magnetic sensing element and fault detection module coupled to the sensing element, the fault detection module including circuitry to detect a fault condition and to self-test operation of the circuitry for detecting the fault condition. In illustrative embodiments, a fault pin indicates the fault condition.

Abstract: A current sensor includes a ferromagnetic core having a substantially central opening for receiving a current conductor and a gap. A detector of the current sensor includes at least one first magnetic field sensing element disposed in a first gap portion and configured to generate a respective first magnetic field signal in response to a first magnetic field having a first angle with respect to the at least one first magnetic field sensing element. The detector also includes at least one second magnetic field sensing element disposed in a second gap portion and configured to generate a respective second magnetic field signal in response to a second magnetic field having a second angle with respect to the at least one second magnetic field sensing element. The first and second magnetic fields are substantially equal in magnitude and the first and second angles are substantially opposite in polarity.

Abstract: A current sensor includes a ferromagnetic core having a substantially central opening for receiving a current conductor and at least two gaps portions, each of the gap portions having an associated gap spacing. A detector of the current sensor includes at least one first sensing element disposed in a first one of the gap portions and configured to generate a respective first magnetic field signal in response to a first magnetic field generated in the first gap portion in response to a current through the current conductor. The detector also includes at least one second sensing element disposed in a second one of the gap portions and configured to generate a respective second magnetic field signal in response to a second magnetic field generated in the second gap portion in response to the current through the conductor. A method of sensing a current through a current conductor is also provided.

Abstract: In one aspect, a method includes processing a metal substrate, performing a first etch on a first surface of the metal substrate to form, for an integrated circuit package, secondary leads and a curved component having two primary leads and performing a second etch, on a second surface of the substrate opposite the first surface, at locations on the secondary leads and locations on the curved component to provide a locking mechanism. Each primary lead located at a respective end of the curved component.

Abstract: A linear motion control device for use in a linear control system is presented. The linear motion control device includes a coil driver to drive a coil that, when driven, effects a linear movement by a motion device having a magnet. The linear motion control device also includes a magnetic field sensor to detect a magnetic field associated with the linear movement and an interface to connect an output of the magnetic field sensor and an input of the coil driver to an external controller. The interface includes a feedback loop to relate the magnetic field sensor output signal to the coil driver input.

Abstract: Methods for providing a sensor integrated circuit package including employing a conductive leadframe and forming a non-conductive die paddle in relation to the leadframe. The method can further include placing a die on the non-conductive die paddle to form an assembly, forming at least one electrical connection between the die and the leadframe, and overmolding the assembly to form an integrated circuit package.

Abstract: Methods and apparatus to provide a magnetic field sensor device including a magnetic sensor element, a die having wafer bumps, wherein the magnetic sensor element is positioned in relation to the die, and conductive leadfingers having respective portions electrically connected to the wafer bumps. In embodiments, the device includes a region about the magnetic sensor element that does not contain electrically conductive material for preventing eddy current flow.

Abstract: A current sensor integrated circuit includes a lead frame having a primary conductor and at least one secondary lead, a semiconductor die disposed adjacent to the primary conductor, an insulation structure disposed between the primary conductor and the semiconductor die, and a non-conductive insulative material enclosing the semiconductor die, the insulation structure, a first portion of the primary conductor, and a first portion of the at least one secondary lead to form a package. The first portion of the at least one secondary lead (between a first end proximal to the primary conductor and a second end proximal to the second, exposed portion of the at least one secondary lead) has a thickness that is less than a thickness of the second, exposed portion of the least one secondary lead. A distance between the second, exposed portion of the primary conductor and the second, exposed portion of the at least one secondary lead is at least 7.2 mm.

Abstract: Methods and apparatus for an integrated circuit having a magnetic sensing element, a fault detection module including circuitry to detect a fault condition and to self-test operation of the circuitry to detect the fault. The integrated circuit includes a fault pin to indicate the fault condition.

Abstract: Methods and apparatus to provide a magnetic field sensor device including a magnetic sensor element, a die having wafer bumps, wherein the magnetic sensor element is positioned in relation to the die, and conductive leadfingers having respective portions electrically connected to the wafer bumps. In embodiments, the device includes a region about the magnetic sensor element that does not contain electrically conductive material for preventing eddy current flow.

Abstract: Methods and apparatus to provide an integrated circuit package having a conductive leadframe, a non-conductive die paddle mechanically coupled to the leadframe, and a die disposed on the die paddle and electrically connected to the leadframe. With this arrangement, eddy currents are reduced near the magnetic field transducer to reduce interference with magnetic fields.