Abstract: A multiple layer printed circuit board (PCB) in which the cores (or core layers) are removed and replaced with prepreg layers, which provide structure integrity for the PCB. Such a multi-layer PCB may include signal layers, ground plane layers, inner signal layers, and a single core substrate layer. Each of the layers may be separated from the other layers by at least one prepreg substrate layer.

Abstract: An integrated heatsink and antenna structure that is suitable for inclusion in small and midsized computing devices. The integrated heatsink and antenna structure may include a plurality of fin components that dissipate thermal energy integrated into a heatsink base and a plurality of radio frequency antenna portions coupled to and surrounded by the fin components. The plurality of radio frequency antenna portions may form a monopole antenna. The heatsink base may operate as a ground reference for each of the plurality of the antenna portions and to improve an omnidirectional pattern of each of the plurality of the antenna portions.

Abstract: The embodiments include a stackable computing device that includes an integrated heatsink and antenna structure and a housing structure. The housing structure includes a housing casing that surrounds the integrated heatsink and antenna structure. The integrated heatsink and antenna structure includes a heatsink base and one or more radio frequency (RF) antenna portions. The heatsink base includes a connector port that provides an interface between components of the computing device and other computing or peripheral devices. For example, the heatsink base may include platform that is configured to have circuitry fixedly secured on a first side of the platform with a connector of the circuitry aligned with an aperture of the connector port such that a connection to the circuitry is accepted by circuitry of another computing device.

Abstract: Various embodiments include a connector head assembly for an electrical cable attached to one or more receptacle connectors. The connector head assembly may include an elongate overmold having a longitudinal extent that is longer than a height or width thereof. The elongate overmold may be configured to encase a terminal end of the electrical cable coupled to the one or more receptacle connectors inside the elongate overmold. The connector head assembly may also include a pull tab pivotally attached to the elongate overmold on an upper surface thereof. A pulling force applied to the pull tab may be configured to separate the receptacle connector from a receptacle in which the receptacle connector is configured to be held.

Abstract: An integrated heatsink and antenna structure that is suitable for inclusion in small and midsized computing devices. The integrated heatsink and antenna structure may include a plurality of fin components that dissipate thermal energy integrated into a heatsink base and a plurality of radio frequency antenna portions coupled to and surrounded by the fin components. The plurality of radio frequency antenna portions may form a monopole antenna. The heatsink base may operate as a ground reference for each of the plurality of the antenna portions and to improve an omnidirectional pattern of each of the plurality of the antenna portions.

Abstract: An integrated heatsink and antenna structure that is suitable for inclusion in small and midsized computing devices. The integrated heatsink and antenna structure may include heatsink portions and radio frequency antenna portions. The heatsink portions may provide a path for dissipating thermal energy or heat generated by the components in the device (e.g., printed circuit boards, processors, voltage amplifiers, etc.), and the radio frequency (RF) antenna portions may allow the device to send and receive wireless communications. The integrated heatsink and antenna structure may be formed so that radio frequency antenna portions operate to improve the thermal performance of the heatsink portions and/or so that the heatsink portions operate to improve the antenna properties (e.g., radiation patterns, radiation efficiency, bandwidth, input impedance, polarization, directivity, gain, beam-width, voltage standing wave ratio, etc.) of the radio frequency antenna portions.

Abstract: A multiple layer printed circuit board (PCB) in which the cores (or core layers) are removed and replaced with prepreg layers, which provide structure integrity for the PCB. Such a multi-layer PCB may include signal layers, ground plane layers, inner signal layers, and a single core substrate layer. Each of the layers may be separated from the other layers by at least one prepreg substrate layer.

Abstract: A multiple layer printed circuit board (PCB) in which the cores (or core layers) are removed and replaced with prepreg layers, which provide structure integrity for the PCB. Such a multi-layer PCB may include a plurality of layers that include a plurality of signal layers, a plurality of ground plane layers, a plurality of inner signal layers, and a single core substrate layer. Each layer in the plurality of layers may be separated from every other layer in the plurality of layers by at least one prepreg substrate layer.

Abstract: Various embodiments include a connector head assembly for an electrical cable attached to one or more receptacle connectors. The connector head assembly may include an elongate overmold having a longitudinal extent that is longer than a height or width thereof. The elongate overmold may be configured to encase a terminal end of the electrical cable coupled to the one or more receptacle connectors inside the elongate overmold. The connector head assembly may also include a pull tab pivotally attached to the elongate overmold on an upper surface thereof. A pulling force applied to the pull tab may be configured to separate the receptacle connector from a receptacle in which the receptacle connector is configured to be held.

Abstract: A multiple layer printed circuit board (PCB) in which the cores (or core layers) are removed and replaced with prepreg layers, which provide structure integrity for the PCB. Such a multi-layer PCB may include a plurality of layers that include a plurality of signal layers, a plurality of ground plane layers, a plurality of inner signal layers, and a single core substrate layer. Each layer in the plurality of layers may be separated from every other layer in the plurality of layers by at least one prepreg substrate layer.

Abstract: The embodiments include a stackable computing device that includes an integrated heatsink and antenna structure and a housing structure. The housing structure includes a housing casing that surrounds the integrated heatsink and antenna structure. The integrated heatsink and antenna structure includes a heatsink base and one or more radio frequency (RF) antenna portions. The heatsink base includes a connector port that provides an interface between components of the computing device and other computing or peripheral devices. For example, the heatsink base may include platform that is configured to have circuitry fixedly secured on a first side of the platform with a connector of the circuitry aligned with an aperture of the connector port such that a connection to the circuitry is accepted by circuitry of another computing device.

Abstract: An integrated heatsink and antenna structure that is suitable for inclusion in small and midsized computing devices. The integrated heatsink and antenna structure may include heatsink portions and radio frequency antenna portions. The heatsink portions may provide a path for dissipating thermal energy or heat generated by the components in the device (e.g., printed circuit boards, processors, voltage amplifiers, etc.), and the radio frequency (RF) antenna portions may allow the device to send and receive wireless communications. The integrated heatsink and antenna structure may be formed so that radio frequency antenna portions operate to improve the thermal performance of the heatsink portions and/or so that the heatsink portions operate to improve the antenna properties (e.g., radiation patterns, radiation efficiency, bandwidth, input impedance, polarization, directivity, gain, beam-width, voltage standing wave ratio, etc.) of the radio frequency antenna portions.

Abstract: A method and circuit are provided that solve the problem of prolonged signal fading in transceivers utilizing dual antenna match in a hybrid transmitter-receiver cancellation circuit, thereby enabling practically implementable full-duplex single channel, or duplexerless frequency division duplex (FDD), wireless communication systems. The method includes controlling dynamic change in signal's amplitude and phase at the receiver port of a hybrid Tx-Rx circuit by continuously varying radiation pattern parameters of at least one antenna, while maintaining nearly constant impedance at the hybrid's antenna interface ports and equalizing propagation delays between the hybrid circuit and both antennas, using a novel circuit design.