Abstract: A rack power unit is configured to be inserted into a device rack of a data center. The rack power unit includes one or more power supplies and one or more battery packs. The one or more power supplies are each configured to receive power (e.g., AC power) when the apparatus is in the device rack, and convert the received power to a DC power. The one or more power supplies are further configured to output the DC power to a DC power bus of the device rack. The one or more battery packs are each configured to provide, in response to an interruption in the received power, DC power to the DC power bus of the device rack.

Abstract: Super capacitor supplemented server power is described. In embodiments, a power system manager is implemented to monitor the capability of one or more power supplies to provide power for a server system. The power system manager can determine that the capability of the power supplies to provide the power is deficient, and then engage one or more super capacitor power modules to provide supplemental power for the server system to mitigate the power deficiency.

Abstract: Resource-based adaptive server loading is described. In embodiments, a current load level can be determined for a resource that is utilized by an adaptive server system to process computer-executable instructions that are a dynamic computational demand on the adaptive server system. The current load level is compared with a target load level for the resource to establish a resource load level comparison. The adaptive server system can then be reconfigured, based on the resource load level comparison, to change the current load level on the resource for resource overload protection.

Abstract: One embodiment includes an electronic assembly having a first printed circuit board (PCB) and a second PCB. The second PCB has at least two processors and is coupled to and disposed on a first side of the first PCB. A thermal dissipation device dissipates heat away from the processors. First and second power modules are coupled to and disposed on a second side of the first PCB, the first and second power modules providing redundant power to the two processors on the second PCB.

Abstract: A subassembly of an apparatus, in one example, includes a first body member and a bias member. A fastener extending through the subassembly applies a compression force to the subassembly. A precompression member is engageable with the subassembly and the bias member so as to impart a precompression force to the bias member. In one example, the fastener is a screw engageable with a threaded plate and biased by a leaf spring which is precompressed to facilitate initial engagement of the screw and the threaded plate.

Abstract: Embodiments include apparatus, methods, and systems having a multi-chip module with a power system. An exemplary electronic module includes a printed circuit board (PCB) having a memory and plural processors. A power system couples to and is disposed vertically above the PCB. A thermal dissipation device is disposed between the power system and the PCB for dissipating heat, via a direct heat exchange, from both the power system and the plural processors.

Abstract: An apparatus comprises a plurality of logically independent processors, a system bus, and a cache control and bus bridge device in communication with the plurality of processors such that the cache control and bus bridge device is logically interposed between the processors and the system bus, and wherein the processors and cache control and bus bridge device are disposed in a module form factor such that the apparatus is a drop-in replacement for a standard single processor module.

Abstract: A memory assembly module including an on-board voltage regulator for converting an externally supplied voltage into appropriate local voltage levels for powering memory devices of the memory assembly module.

Abstract: A system comprises a converter to produce an output voltage from at least a first input voltage and a second input voltage, and a selector to select a first circuit path in the converter to produce the output voltage from the first input voltage, and to select a second circuit path in the converter to produce the output voltage from the second input voltage.

Abstract: A heat spreader with multiple stacked printed circuit boards (PCBS) includes top and side sections within which a first PCB is contained and bottom edges that extend to a second PCB. The heat spreader and second PCB substantially enclose the first PCB therein.

Abstract: Embodiments include apparatus, methods, and systems having a multi-chip module with a power system. An exemplary electronic module includes a printed circuit board (PCB) having a memory and plural processors. A power system couples to and is disposed vertically above the PCB. A thermal dissipation device is disposed between the power system and the PCB for dissipating heat, via a direct heat exchange, from both the power system and the plural processors.

Abstract: Embodiments include apparatus, methods, and systems of a processor module for a system board. An electronic module is removably connectable to a system board. The electronic module has first and second portions. The first portion is connected to the system board and includes a thermal dissipation device and a printed circuit board (PCB) with a processor connected to a first side of the PCB. The thermal dissipation device extends between the processor and the system board. The second portion connects on top of the first portion and has a power system board for providing power to the processor. The power system board extends adjacent and parallel to a second side of the PCB.

Abstract: An electronic processing system contains a power supply subsystem and a multi-processor module. Programmable control circuitry manages power consumption in the electronic system by allocating priority among a plurality of competing demands, such as total power consumption, power consumption at any one of the processors, and thermal measurements. Analog sense measurements of incoming power are transmitted to the control circuits, which are protected from noise through use of an isolation barrier established by a linear isolation amplifier.

Abstract: A system comprising a plurality of power supplies coupled to a power grid via multiple connections. The system also comprises a connector coupled to one of the connections via a backup connection. If the system receives power from no more than one power grid, the connector couples the backup connection to a backup power supply. If the system receives power from multiple power grids, the backup connection does not carry a substantial electrical current.

Abstract: Embodiments include apparatus, methods, and systems having a multi-chip module with a power system and pass-thru holes. An exemplary electronic module includes a first portion having a first printed circuit board (PCB) with a memory and plural processors. A second portion has a power system and a thermal dissipation device. The thermal dissipation device has plural extensions, and the power system has plural pass-thru holes. The first portion electrically couples to the second portion to form the electronic module when the plural extensions extend through the plural pass-thru holes of the power system and through plural pass-thru holes of a second PCB disposed between the first and second portions.

Abstract: One embodiment includes an electronic assembly having a first printed circuit board (PCB) and a second PCB having at least two processors. The second PCB is coupled to and disposed above the first PCB. A thermal dissipation device dissipates heat away from the processors. First and second power modules supply power to the second PCB and are separated and redundant power supplies such that upon failure of the first power module, the second power module can provide power for both power modules to the second PCB.

Abstract: One embodiment includes an electronic assembly having a first printed circuit board (PCB) coupled to a second PCB. The second PCB has at least two processors and is disposed above the first PCB. A thermal dissipation device is disposed above the second PCB, dissipates heat away from the two processors, and provides an airflow path. A power system is adjacent the thermal dissipation device and in a pathway of the airflow path.

Abstract: Embodiments include apparatus, methods, and systems of a processor module for a system board. In one embodiment, an electronic module, having first and second portions, is removably connectable to the system board. The first portion connects to the system board and includes a thermal dissipation device and a printed circuit board (PCB) with a processor connected to a first side of the PCB. The thermal dissipation device dissipates heat, via a heat exchange, from the processor. The second portion is disposed in a space created between the first portion and the system board. The second portion has a power system board for providing power to the processor. The power system board extends adjacent and parallel to a second side of the PCB.

Abstract: The present invention determines temperature and current from resistance measurements of a single magnetoresistive sensor. A dual-purpose sensor includes the magnetoresistive sensor having a single pair of terminals. The sensor is multiplexed under separate current conditions to produce both a temperature measurement and a current measurement in a vicinity of the sensor. A sensor system includes the dual-purpose sensor, a resistance sensing subsystem and a controller that controls the current conditions. A method of measuring temperature and current includes measuring a first resistance of the dual-purpose sensor while a first current is flowing in a conductor adjacent to the sensor, and measuring a second resistance of the sensor while a second current is flowing in the conductor. The first current has a known value while the second current has an unknown value. The temperature and current are determined respectively from the first and second resistance measurements.

Abstract: A first heat sink is built including two sets of fins with a gap between the two fin sets. The gap is configured to allow the placement of a second heat sink between the two fin sets of the first heat sink. The first heat sink also includes slotted mounting lugs to allow the second heat sink to be mounted to the first heat sink allowing for varying stack up tolerances of the heat generating devices cooled by the first and second heat sinks.