Patents by Inventor Shaun Van Der Veen
Shaun Van Der Veen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11958164Abstract: A two part retaining ring is described. A rigid upper portion has an annular recess along its inner diameter. An annular wearable lower portion has an inner diameter, an annular extension defined by the inner diameter and a vertical wall that is perpendicular to a surface of the second portion and opposite to the inner diameter. The annular extension fits into the annular recess of the annular first portion. A bonding material is on the vertical wall of the annular second portion.Type: GrantFiled: August 6, 2018Date of Patent: April 16, 2024Assignee: Applied Materials, Inc.Inventors: Shaun Van Der Veen, Steven M. Zuniga
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Publication number: 20230352337Abstract: A wafer processing device may include a wafer exchanger including two or more blades, each of the two or more blades may be configured to receive a wafer, the two or more blades may be rotatable about an axis on a single horizontal plane, and the two or more blades may be movable between at least a load cup and a robot access location; wherein the load cup may include a wafer station that is vertically moveable relative a blade located in the load cup and may be configured to remove a wafer from a blade located in the load cup and place a wafer on a blade located in the load cup. Other devices, load cups and methods are also disclosed herein.Type: ApplicationFiled: July 6, 2023Publication date: November 2, 2023Inventors: Jagan Rangarajan, Edward Golubovsky, Shaun Van Der Veen, Justin Ho Kuen Wong, Steven M. Zuniga
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Patent number: 11749552Abstract: A wafer processing device may include a wafer exchanger including two or more blades, each of the two or more blades may be configured to receive a wafer, the two or more blades may be rotatable about an axis on a single horizontal plane, and the two or more blades may be movable between at least a load cup and a robot access location; wherein the load cup may include a wafer station that is vertically moveable relative a blade located in the load cup and may be configured to remove a wafer from a blade located in the load cup and place a wafer on a blade located in the load cup. Other devices, load cups and methods are also disclosed herein.Type: GrantFiled: January 9, 2020Date of Patent: September 5, 2023Assignee: Applied Materials, Inc.Inventors: Jagan Rangarajan, Edward Golubovsky, Shaun Van Der Veen, Justin Ho Kuen Wong, Steven M. Zuniga
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Publication number: 20200234995Abstract: A wafer processing device may include a wafer exchanger including two or more blades, each of the two or more blades may be configured to receive a wafer, the two or more blades may be rotatable about an axis on a single horizontal plane, and the two or more blades may be movable between at least a load cup and a robot access location; wherein the load cup may include a wafer station that is vertically moveable relative a blade located in the load cup and may be configured to remove a wafer from a blade located in the load cup and place a wafer on a blade located in the load cup. Other devices, load cups and methods are also disclosed herein.Type: ApplicationFiled: January 9, 2020Publication date: July 23, 2020Inventors: Jagan Rangarajan, Edward Golubovsky, Shaun Van Der Veen, Justin Ho Kuen Wong, Steven M. Zuniga
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Publication number: 20190030679Abstract: A two part retaining ring is described. A rigid upper portion has an annular recess along its inner diameter. An annular wearable lower portion has an inner diameter, an annular extension defined by the inner diameter and a vertical wall that is perpendicular to a surface of the second portion and opposite to the inner diameter. The annular extension fits into the annular recess of the annular first portion. A bonding material is on the vertical wall of the annular second portion.Type: ApplicationFiled: August 6, 2018Publication date: January 31, 2019Inventors: Shaun Van Der Veen, Steven M. Zuniga
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Patent number: 10040168Abstract: A two part retaining ring is described. A rigid upper portion has an annular recess along its inner diameter. An annular wearable lower portion has an inner diameter, an annular extension defined by the inner diameter and a vertical wall that is perpendicular to a surface of the second portion and opposite to the inner diameter. The annular extension fits into the annular recess of the annular first portion. A bonding material is on the vertical wall of the annular second portion.Type: GrantFiled: June 26, 2017Date of Patent: August 7, 2018Assignee: Applied Materials, Inc.Inventors: Shaun Van Der Veen, Steven M. Zuniga
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Publication number: 20170312882Abstract: A two part retaining ring is described. A rigid upper portion has an annular recess along its inner diameter. An annular wearable lower portion has an inner diameter, an annular extension defined by the inner diameter and a vertical wall that is perpendicular to a surface of the second portion and opposite to the inner diameter. The annular extension fits into the annular recess of the annular first portion. A bonding material is on the vertical wall of the annular second portion.Type: ApplicationFiled: June 26, 2017Publication date: November 2, 2017Applicant: Applied Materials, Inc.Inventors: Shaun Van Der Veen, Steven M. Zuniga
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Patent number: 9694470Abstract: A two part retaining ring is described. A rigid upper portion has an annular recess along its inner diameter. An annular wearable lower portion has an inner diameter, an annular extension defined by the inner diameter and a vertical wall that is perpendicular to a surface of the second portion and opposite to the inner diameter. The annular extension fits into the annular recess of the annular first portion. A bonding material is on the vertical wall of the annular second portion.Type: GrantFiled: May 16, 2013Date of Patent: July 4, 2017Assignee: Applied Materials, Inc.Inventors: Shaun Van Der Veen, Steven M. Zuniga
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Publication number: 20130231031Abstract: A two part retaining ring is described. A rigid upper portion has an annular recess along its inner diameter. An annular wearable lower portion has an inner diameter, an annular extension defined by the inner diameter and a vertical wall that is perpendicular to a surface of the second portion and opposite to the inner diameter. The annular extension fits into the annular recess of the annular first portion. A bonding material is on the vertical wall of the annular second portion.Type: ApplicationFiled: May 16, 2013Publication date: September 5, 2013Inventors: Shaun Van Der Veen, Steven M. Zuniga
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Patent number: 8465345Abstract: A two part retaining ring is described. An rigid upper portion has an annular recess along its inner diameter. An annular wearable lower portion has an inner diameter, an annular extension defined by the inner diameter and a vertical wall that is perpendicular to a surface of the second portion and opposite to the inner diameter. The annular extension fits into the annular recess of the annular first portion. A bonding material is on the vertical wall of the annular second portion.Type: GrantFiled: August 5, 2010Date of Patent: June 18, 2013Assignee: Applied Materials, Inc.Inventors: Shaun Van Der Veen, Steven M. Zuniga
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Publication number: 20100303584Abstract: A two part retaining ring is described. An rigid upper portion has an annular recess along its inner diameter. An annular wearable lower portion has an inner diameter, an annular extension defined by the inner diameter and a vertical wall that is perpendicular to a surface of the second portion and opposite to the inner diameter. The annular extension fits into the annular recess of the annular first portion. A bonding material is on the vertical wall of the annular second portion.Type: ApplicationFiled: August 5, 2010Publication date: December 2, 2010Inventors: Shaun Van Der Veen, Steven M. Zuniga
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Patent number: 7789736Abstract: A two part retaining ring is described. An rigid upper portion has an annular recess along its inner diameter. An annular wearable lower portion has an inner diameter, an annular extension defined by the inner diameter and a vertical wall that is perpendicular to a surface of the second portion and opposite to the inner diameter. The annular extension fits into the annular recess of the annular first portion. A bonding material is on the vertical wall of the annular second portion.Type: GrantFiled: October 13, 2006Date of Patent: September 7, 2010Assignee: Applied Materials, Inc.Inventors: Shaun Van Der Veen, Steven M. Zuniga
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Publication number: 20080096467Abstract: A two part retaining ring is described. An rigid upper portion has an annular recess along its inner diameter. An annular wearable lower portion has an inner diameter, an annular extension defined by the inner diameter and a vertical wall that is perpendicular to a surface of the second portion and opposite to the inner diameter. The annular extension fits into the annular recess of the annular first portion. A bonding material is on the vertical wall of the annular second portion.Type: ApplicationFiled: October 13, 2006Publication date: April 24, 2008Inventors: Shaun Van Der Veen, Steven M. Zuniga
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Patent number: 7210991Abstract: The present invention relates to an apparatus and method for polishing semiconductor substrates with improved throughput. Embodiments of the present invention eliminate load cups from a polishing system, hence improve throughput by reducing system footprint and substrate hand off. One embodiment provides an apparatus for polishing a substrate. The apparatus comprises a platen having a polishing pad supported thereon, a carrier head configured to hold the substrate and press the substrate against the polishing pad, and a retaining ring adapted to be attached to and detached from the carrier head, wherein the retaining ring is configured to receive the substrate while positioned on the polishing pad and detached from the carrier head.Type: GrantFiled: April 3, 2006Date of Patent: May 1, 2007Assignee: Applied Materials, Inc.Inventors: Shaun Van Der Veen, Hung Chih Chen