Patents by Inventor Shaw Lee

Shaw Lee has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • ELECTRICAL DIE CONTACT STRUCTURE AND FABRICATION METHOD
    Publication number: 20080102604
    Abstract: A semiconductor device of the invention includes an integrated circuit formed on a semiconductor substrate having first and second surfaces and a notch region along the edges. The first surface includes electrical contact pads electrically connected with the integrated circuit. The first surface of the semiconductor substrate includes a top protective layer that has a surface portion extending beyond the edges of the semiconductor substrate. The second surface of the semiconductor substrate includes a bottom protective layer with electrical connectors. The surface portion of the top protective layer includes electrical contact pads that are electrically interconnected with electrical contact pad extensions. The electrical contact pad extensions are interconnected with electrical connectors via a backside electrical connector that overlaps the electrical contact pad extensions forming a lap connection. Methods for constructing such devices and connections are also disclosed.
    Type: Application
    Filed: January 4, 2008
    Publication date: May 1, 2008
    Applicant: NATIONAL SEMICONDUCTOR CORPORATION
    Inventors: Ashok Prabhu, Sadanand Patil, Shaw Lee, Alexander Owens