Abstract: An electroplated wire layout for package sawing comprises a substrate with a plurality of chip arrays disposed thereon. A kerf having two scribe lines is disposed between every two chip arrays. Several solder ball pads corresponding to the chip arrays are disposed on a back surface of the substrate. Each solder ball pad has a solder ball electroplated wire extended into a kerf. There is also a kerf electroplated wire disposed in each kerf and above the scribe lines of the kerf in a zigzag way. The kerf electroplated wire is connected with the solder ball pad electroplated wires to achieve electric connection. By changing the shape of the kerf electroplated wire, the kerf electroplated wire can be easily cut off to enhance the yield and reliability and also lower the cost.

Abstract: An improved finger structure applied to a packaging stack structure. The packaging stack structure is composed of several layers of chips, each chip is formed several leading wires and several finger sets are connected to the leading wire. Several finger units are formed on a finger set. The shape of these finger units is a strip structure with a bending angle, and the shape of these finger units is along an obverse direction of these leading wires to the finger unit and is changed corresponding to the obverse direction of the finger unit. The present invention can simplify the process and improve the reliability by changing the finger structure and continuously using the obverse bonding process to avoid the striking strength of the reverse bonding process.

Abstract: An electroplated wire layout for package sawing comprises a substrate with a plurality of chip arrays disposed thereon. A kerf having two scribe lines is disposed between every two chip arrays. Several solder ball pads corresponding to the chip arrays are disposed on a back surface of the substrate. Each solder ball pad has a solder ball electroplated wire extended into a kerf. There is also a kerf electroplated wire disposed in each kerf and above the scribe lines of the kerf in a zigzag way. The kerf electroplated wire is connected with the solder ball pad electroplated wires to achieve electric connection. By changing the shape of the kerf electroplated wire, the kerf electroplated wire can be easily cut off to enhance the yield and reliability and also lower the cost.

Abstract: An improved finger structure applied to a packaging stack structure. The packaging stack structure is composed of several layers of chips, each chip is formed several leading wires and several finger sets are connected to the leading wire. Several finger units are formed on a finger set. The shape of these finger units is a strip structure with a bending angle, and the shape of these finger units is along an obverse direction of these leading wires to the finger unit and is changed corresponding to the obverse direction of the finger unit. The present invention can simplify the process and improve the reliability by changing the finger structure and continuously using the obverse bonding process to avoid the striking strength of the reverse bonding process.