Patents by Inventor Shaw-Wen Lao

Shaw-Wen Lao has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230068160
    Abstract: A package carrier including a multi-layer circuit substrate and a silicon wafer is provided. The multi-layer circuit substrate has a first opening and a second opening communicating with each other. A first diameter and a first depth of the first opening are respectively greater than a second diameter and a second depth of the second opening. The silicon wafer is embedded in the first opening of the multi-layer circuit substrate. The silicon wafer has an active surface and includes a connecting circuit layer. The connecting circuit layer is disposed on the active surface and electrically connected to the multi-layer circuit substrate. The second opening of the multi-layer circuit substrate exposes part of the connecting circuit layer.
    Type: Application
    Filed: May 12, 2022
    Publication date: March 2, 2023
    Applicant: Subtron Technology Co., Ltd.
    Inventors: Shaw-Wen Lao, Chih-Peng Fan, Ping-I Cheng
  • Patent number: 6201300
    Abstract: A printed circuit board thermal conductive structure comprises a thermal spreader layer having an embossed pattern formed on its surface, an adhesive glue layer formed over the thermal spreader, and a surface metallic layer attached to the thermal spreader and the glue layer. A portion of the surface metallic layer is in direct contact or almost direct contact with the thermal spreader. Furthermore, an additional external heat sink can be attached to thermal conductive structure to increase the efficiency of heat dissipation.
    Type: Grant
    Filed: August 24, 1998
    Date of Patent: March 13, 2001
    Assignee: World Wiser Electronics Inc.
    Inventors: Tzyy-Jang Tseng, David C. H. Cheng, Shaw-Wen Lao