Abstract: A hermetic ground pin assembly for making an electrical connection between a hermetically sealed enclosure and an external circuit. A case has an aperture and a plug located within the aperture. A low temperature braze alloy is located between the plug and the case to attach the plug within the aperture. Two different pins are attached to opposite sides of the plug. A high temperature braze alloy attaches one of the pins to the plug and the low temperature braze alloy attaches the other pin to the plug.

Abstract: A detachable fiber optic connector has an improved nose block (800) which enhances cooling of power dissipating components, simplifies assembly, improves yield and reduces cost. The improved nose block (800) includes an upper tray (802) and lower tray (804) which slidingly receive an improved aluminum nitride optical subassembly (700). The subassembly (700) and nose block (800) are held together, properly aligned, and then fixated. The nose block (800) also has symmetrical protrusions (850) which allow the nose block (800) to be placed easily and precisely into mating protrusions (230, 240) in a seal ring (200). The nose block (800) provides a direct thermal pathway between power dissipating components, such as an opto-electronic component (750) and optical driver IC (730), and an aluminum package base (400). Various alternative nose blocks (810, 820, 830) are illustrated, and an alternative base (410) is also shown.

Abstract: A high power, hermetic, low cost, high reliability package for electrical devices is described. The package includes in the preferred embodiment an aluminum nitride substrate, copper thick film ink screen printed and fired upon the substrate, a Kovar ring brazed to the copper thick film ink, a thermally dissipating device mounted, the device bonded to electrical feed-throughs that pass through the Kovar ring, and a cover bonded to said Kovar ring to form an additional part of the hermetic seal.

Abstract: In a multi-layer ceramic package, a plurality of ceramic lamina each has a conductive pattern, and there is an internal cavity of the package within which is bonded a chip or a plurality of chips interconnected to form a chip array. The chip or chip array is connected through short wire bonds at varying lamina levels to metalized conductive patterns thereon, each lamina level having a particular conductive pattern. The conductive patterns on the respective lamina layers are interconnected either by tunneled through openings filled with metalized material, or by edge formed metalizations so that the conductive patterns ultimately connect to a number of pads at the undersurface of the ceramic package mounted onto a metalized board. There is achieved a high component density; but because connecting wire leads are "staggered" or connected at alternating points with wholly different package levels, it is possible to maintain a 10 mil spacing and 10 mil size of the wire bond lands.