Abstract: Attaching a fitting having a conduit in a port of a container. A sleeve forming a conduit has a flange adjacent one end and has a groove in an exterior wall. A gasket and a pressure plate is slidably positioned on the sleeve. A securing plate has threaded bolts therein and is slidably positioned on the sleeve to position one end of the bolts to engage the pressure plate. A securing element is positioned in the groove and disposed in the securing plate to prevent the securing plate from sliding off of the sleeve when the bolts are tightened against the pressure plate.

Abstract: Built-in electrical test structures are measured for lead-to-lead shorting during the fabrication of MR elements on a wafer. The test structures are fabricated in the same fashion as the MR elements, however, the active sensor region or track width is omitted from the test structures. Thus, the left and right leads for each test structure are electrically isolated from each other in their “track width” region. If there is lead-to-lead shorting on a test structure, then the left and right leads are electrically connected in the track width region. A simple resistance measurement between the left and right leads determines the extent of any lead shorting by giving a quantitative resistance value.

Abstract: Presented herein are system(s), method(s), and apparatus for providing a channel recall with a plurality of channels. In one embodiment, there is presented a method for providing content. The method comprises selecting content from a first channel, until receiving a recall signal; receiving the recall signal; switching from selecting content from the first channel to selecting content from a second channel after receiving the recall signal; selecting content from the second channel until receiving another recall signal; receiving the another recall signal; and switching from selecting content from the second channel to selecting content from a third channel after receiving the recall signal.

Abstract: Built-in electrical test structures are measured for lead-to-lead shorting during the fabrication of MR elements on a wafer. The test structures are fabricated in the same fashion as the MR elements, however, the active sensor region or track width is omitted from the test structures. Thus, the left and right leads for each test structure are electrically isolated from each other in their “track width” region. If there is lead-to-lead shorting on a test structure, then the left and right leads are electrically connected in the track width region. A simple resistance measurement between the left and right leads determines the extent of any lead shorting by giving a quantitative resistance value.