Patents by Inventor Shawn D. Davis
Shawn D. Davis has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 6937005Abstract: A method for inspecting semiconductor wafers. Specifically, an arm which is constructed to hold a wafer, is mounted on a rotational device to provide a user with the means of inspecting a wafer in any position without having to physically touch the wafer or move the wafer to another inspection station. The arm provides rotation about an axis parallel to the surface of the wafer, as well as rotation about an axis run which is perpendicular to the surface of the wafer and extends through the axial center of the wafer.Type: GrantFiled: August 31, 2004Date of Patent: August 30, 2005Assignee: Micron Technology, Inc.Inventors: Willard L. Hofer, Shawn D. Davis, Joe L. Phillips
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Patent number: 6909276Abstract: A method for fabricating semiconductor wafers. Specifically, an arm which is constructed to hold a wafer, is mounted on a rotational device to provide a user with the means of inspecting a wafer in any position without having to physically touch the wafer or move the wafer to another inspection station. The arm provides rotation about an axis parallel to the surface of the wafer, as well as rotation about an axis run which is perpendicular to the surface of the wafer and extends through the axial center of the wafer.Type: GrantFiled: August 31, 2004Date of Patent: June 21, 2005Assignee: Micron Technology, Inc.Inventors: Willard L. Hofer, Shawn D. Davis, Joe L. Phillips
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Patent number: 6828772Abstract: A method and apparatus for inspecting semiconductor wafers. Specifically, an arm which is constructed to hold a wafer, is mounted on a rotational device to provide a user with the means of inspecting a wafer in any position without having to physically touch the wafer or move the wafer to another inspection station. The arm provides rotation about an axis parallel to the surface of the wafer, as well as rotation about an axis run which is perpendicular to the surface of the wafer and extends through the axial center of the wafer.Type: GrantFiled: June 14, 2000Date of Patent: December 7, 2004Assignee: Micron Technology, Inc.Inventors: Willard L. Hofer, Shawn D. Davis, Joe L. Phillips
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Patent number: 6599571Abstract: An apparatus and methods for use in spin coating a coating material onto a wafer. The apparatus includes a rotatable chuck capable of supporting the wafer and a bowl having a bottom and a side defining an interior region, the bottom containing an opening through which said rotatable chuck is movable and separable from the bowl. In a preferred embodiment the bottom has a raised cylindrical portion containing the opening and, the rotatable chuck is positioned within the opening so that the wafer is in close proximity to the raised portion of the bowl so as to prevent solvent vapors form escaping the bowl through the opening.Type: GrantFiled: April 16, 2002Date of Patent: July 29, 2003Assignee: Micron Technology, Inc.Inventor: Shawn D. Davis
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Patent number: 6511540Abstract: An apparatus and methods for use in spin coating a coating material onto a wafer. The apparatus includes a rotatable chuck capable of supporting the wafer and a bowl having a bottom and a side defining an interior region, the bottom containing an opening through which said rotatable chuck is movable and separable from the bowl. In a preferred embodiment the bottom has a raised cylindrical portion containing the opening and, the rotatable chuck is positioned within the opening so that the wafer is in close proximity to the raised portion of the bowl so as to prevent solvent vapors from escaping the bowl through the opening.Type: GrantFiled: November 15, 1999Date of Patent: January 28, 2003Assignee: Micron Technology, Inc.Inventor: Shawn D. Davis
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Patent number: 6477440Abstract: A method for coating a surface of a substrate material, such as a semiconductor wafer. The method includes providing a host controller, providing a self-controlled treatment module, connecting the self-controlled treatment module to the host controller, issuing treatment instructions from the host controller to the self-controlled treatment module, receiving the treatment instruction from the host controller at the self-controlled treatment module, and controlling the treatment of the material with the self-controlled treatment module to maintain compliance with the treatment instruction.Type: GrantFiled: May 1, 2000Date of Patent: November 5, 2002Assignee: Micron Technology, Inc.Inventor: Shawn D. Davis
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Publication number: 20020108561Abstract: An apparatus and methods for use in spin coating a coating material onto a wafer. The apparatus includes a rotatable chuck capable of supporting the wafer and a bowl having a bottom and a side defining an interior region, the bottom containing an opening through which said rotatable chuck is movable and separable from the bowl. In a preferred embodiment the bottom has a raised cylindrical portion containing the opening and, the rotatable chuck is positioned within the opening so that the wafer is in close proximity to the raised portion of the bowl so as to prevent solvent vapors form escaping the bowl through the opening.Type: ApplicationFiled: April 16, 2002Publication date: August 15, 2002Inventor: Shawn D. Davis
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Patent number: 6417117Abstract: An apparatus and methods for use in spin coating a coating material onto a wafer. The apparatus includes a rotatable chuck capable of supporting the wafer and a bowl having a bottom and a side defining an interior region, the bottom containing an opening through which said rotatable chuck is movable and separable from the bowl. In a preferred embodiment the bottom has a raised cylindrical portion containing the opening and, the rotatable chuck is positioned within the opening so that the wafer is in close proximity to the raised portion of the bowl so as to prevent solvent vapors from escaping the bowl through the opening.Type: GrantFiled: November 16, 2000Date of Patent: July 9, 2002Assignee: Micron Technology, Inc.Inventor: Shawn D. Davis
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Patent number: 6403933Abstract: A support including a plate having a top surface and a receiving hole, a lift element having a contacting end disposed through the receiving hole, a sensor disposed in a bore in the contacting end of the lift element, and a support member adjacent the top surface.Type: GrantFiled: October 12, 2000Date of Patent: June 11, 2002Assignee: Micron Technology, Inc.Inventors: Timothy A. Strodtbeck, John S. Molebash, Bruce L. Hayes, Rex A. Smith, Shawn D. Davis
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Patent number: 6221157Abstract: An apparatus for exhausting coating materials used in the process of spin coating a top surface of a wafer, the wafer having an edge and a bottom surface that is supported and rotated by a rotatable chuck attached by a shaft to a spin motor. The apparatus includes a bowl having an exhausted drain configured to receive excess liquid and vapor from the spin coating and an assembly configured to maintain the drain at a negative pressure differential relative to the bowl. In a preferred embodiment, a baffle is attached to the bottom to limit the flow of the liquid and vapor into the drain to a predetermined direction.Type: GrantFiled: June 22, 1998Date of Patent: April 24, 2001Assignee: Micron Technology, Inc.Inventors: Shawn D. Davis, John S. Molebash, Bruce L. Hayes, John T. Davlin
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Patent number: 6171402Abstract: A method of disposing a wafer on a support member protruding from a surface. The method includes supporting the wafer in a first position defined by a lift extending through the surface and manipulating the surface to place the wafer on the support member.Type: GrantFiled: February 12, 1999Date of Patent: January 9, 2001Assignee: Micron Technology, Inc.Inventors: Timothy A. Strodtbeck, John S. Molebash, Bruce L. Hayes, Rex A. Smith, Shawn D. Davis
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Patent number: 6162295Abstract: An apparatus and methods for use in spin coating a coating material onto a wafer. The apparatus includes a rotatable chuck capable of supporting the wafer and a bowl having a bottom and a side defining an interior region, the bottom containing an opening through which said rotatable chuck is movable and separable from the bowl. In a preferred embodiment the bottom has a raised cylindrical portion containing the opening and, the rotatable chuck is positioned within the opening so that the wafer is in close proximity to the raised portion of the bowl so as to prevent solvent vapors from escaping the bowl through the opening.Type: GrantFiled: October 4, 1999Date of Patent: December 19, 2000Assignee: Micron Technology, Inc.Inventor: Shawn D. Davis
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Patent number: 6162294Abstract: An apparatus for exhausting coating materials used in the process of spin coating a top surface of a wafer, the wafer having an edge and a bottom surface that is supported and rotated by a rotatable chuck attached by a shaft to a spin motor. The apparatus includes a bowl having an exhausted drain configured to receive excess liquid and vapor from the spin coating and an assembly configured to maintain the drain at a negative pressure differential relative to the bowl. In a preferred embodiment, a baffle is attached to the bottom to limit the flow of the liquid and vapor into the drain to a predetermined direction.Type: GrantFiled: June 22, 1998Date of Patent: December 19, 2000Assignee: Micron Technology, Inc.Inventors: Shawn D. Davis, John S. Molebash, Bruce L. Hayes, John T. Davlin
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Patent number: 6150638Abstract: A method of exhausting vapors emanating from a surface. The method includes enclosing the surface and dividing the enclosed area into a stagnant region adjacent the surface and an interior region in communication with the stagnant region. The method also includes applying a suction to the interior region and admitting air into the interior region.Type: GrantFiled: February 12, 1999Date of Patent: November 21, 2000Assignee: Micron Technology, Inc.Inventors: Timothy A. Strodtbeck, John S. Molebash, Bruce L. Hayes, Rex A. Smith, Shawn D. Davis
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Patent number: 6132802Abstract: Methods for exhausting coating materials used in the process of spin coating a top surface of a wafer, the wafer having an edge and a bottom surface that is supported and rotated by a rotatable chuck attached by a shaft to a spin motor. The apparatus includes a bowl having an exhausted drain configured to receive excess liquid and vapor from the spin coating and an assembly configured to maintain the drain at a negative pressure differential relative to the bowl. In a preferred embodiment, a baffle is attached to the bottom to limit the flow of the liquid and vapor into the drain to a predetermined direction.Type: GrantFiled: June 22, 1998Date of Patent: October 17, 2000Assignee: Micron Technology, Inc.Inventors: Shawn D. Davis, John S. Molebash, Bruce L. Hayes, John T. Davlin
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Patent number: 6113694Abstract: Apparatus for coating a surface of a semiconductor wafer includes at least one treatment module, a handling device that may access each of the treatment modules, and a host controller connected to the handling device and to each of the treatment modules. The treatment modules may include a coating assembly for coating the semiconductor wafer surface and may also include at least one thermal conditioning module. The host controller may control the handling device to move a semiconductor wafer relative to the treatment modules. The treatment modules may be disposed within opposing assemblies and may be removed from the assemblies without disabling the treatment modules remaining within the opposing assemblies.Type: GrantFiled: July 13, 1998Date of Patent: September 5, 2000Assignee: Micron Technology, Inc.Inventor: Shawn D. Davis
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Patent number: 6107609Abstract: A support including a plate having a top surface and a receiving hole, a lift element having a contacting end disposed through the receiving hole, a sensor disposed in a bore in the contacting end of the lift element, and a support member adjacent the top surface.Type: GrantFiled: February 12, 1999Date of Patent: August 22, 2000Assignee: Micron Technology, Inc.Inventors: Timothy A. Strodtbeck, John S. Molebash, Bruce L. Hayes, Rex A. Smith, Shawn D. Davis
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Patent number: 6090209Abstract: A vapor control apparatus including an endless rim, a stagnation plate and a cover having an exhaust port. The endless rim has a first edge engaging the cover, a second edge opposite the first edge, an interior region and an exterior region defined by the rim and the cover, and a flow passage from the interior region to the exterior region adjacent the cover. The exhaust port is in fluid communication with the interior region and the second edge is seatable on a wafer support. A stagnation plate is disposed in the interior region, defining a stagnant region intermediate the stagnation plate and the surface, and defining at least one flow path in fluid communication with the stagnant region and the interior region.Type: GrantFiled: February 12, 1999Date of Patent: July 18, 2000Assignee: Micron Technology, Inc.Inventors: Timothy A. Strodtbeck, John S. Molebash, Bruce L. Hayes, Rex A. Smith, Shawn D. Davis
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Patent number: 6061605Abstract: A method for coating a surface of a substrate material, such as a semiconductor wafer. The method includes providing a host controller, providing a self-controlled treatment module, connecting the self-controlled treatment module to the host controller, issuing treatment instructions from the host controller to the self-controlled treatment module, receiving the treatment instruction from the host controller at the self-controlled treatment module, and controlling the treatment of the material with the self-controlled treatment module to maintain compliance with the treatment instruction.Type: GrantFiled: October 15, 1997Date of Patent: May 9, 2000Assignee: Micron Technology, Inc.Inventor: Shawn D. Davis
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Patent number: 6051074Abstract: A wafer support including a plate having a top surface and a lift element opening extending trough said plate. The support also includes a support member adjacent the top surface having a proximal end, a distal end and a bore from the proximal to the distal end and a vacuum source in communication with the bore. The support furthermore includes a lift element having a contacting end disposed through the lift element opening and a drive coupled to at least one of the plate and the lift element.Type: GrantFiled: February 12, 1999Date of Patent: April 18, 2000Assignee: Micron Technology, Inc.Inventors: Timothy A. Strodtbeck, John S. Molebash, Bruce L. Hayes, Rex A. Smith, Shawn D. Davis