Abstract: A surgical instrument includes a rotatable electrical coupling assembly having a first part and a second part that electrically couple and rotate relative to each other. The second part is carried by and rotates with a tube collar coupled to a transducer. A portion of the transducer is inserted through an aperture of the second part, but does not contact the second part. The first part of the assembly may electrically couple to the second part via pogo pins, brush contacts, or ball bearings. Alternatively, the first part may comprise conductive channels formed in the casing. The second part may comprise a rotatable drum with a conductive trace. In some versions, one or more components may comprise MID components. In another version, the rotatable electrical coupling assembly comprises a rotatable PC board and brush contact. Further still, a circuit board may be provided with the transducer inside a transducer casing.

Abstract: A method for inspecting semiconductor wafers. Specifically, an arm which is constructed to hold a wafer, is mounted on a rotational device to provide a user with the means of inspecting a wafer in any position without having to physically touch the wafer or move the wafer to another inspection station. The arm provides rotation about an axis parallel to the surface of the wafer, as well as rotation about an axis run which is perpendicular to the surface of the wafer and extends through the axial center of the wafer.

Abstract: A method for fabricating semiconductor wafers. Specifically, an arm which is constructed to hold a wafer, is mounted on a rotational device to provide a user with the means of inspecting a wafer in any position without having to physically touch the wafer or move the wafer to another inspection station. The arm provides rotation about an axis parallel to the surface of the wafer, as well as rotation about an axis run which is perpendicular to the surface of the wafer and extends through the axial center of the wafer.

Abstract: A method and apparatus for inspecting semiconductor wafers. Specifically, an arm which is constructed to hold a wafer, is mounted on a rotational device to provide a user with the means of inspecting a wafer in any position without having to physically touch the wafer or move the wafer to another inspection station. The arm provides rotation about an axis parallel to the surface of the wafer, as well as rotation about an axis run which is perpendicular to the surface of the wafer and extends through the axial center of the wafer.

Abstract: An apparatus and methods for use in spin coating a coating material onto a wafer. The apparatus includes a rotatable chuck capable of supporting the wafer and a bowl having a bottom and a side defining an interior region, the bottom containing an opening through which said rotatable chuck is movable and separable from the bowl. In a preferred embodiment the bottom has a raised cylindrical portion containing the opening and, the rotatable chuck is positioned within the opening so that the wafer is in close proximity to the raised portion of the bowl so as to prevent solvent vapors form escaping the bowl through the opening.

Abstract: An apparatus and methods for use in spin coating a coating material onto a wafer. The apparatus includes a rotatable chuck capable of supporting the wafer and a bowl having a bottom and a side defining an interior region, the bottom containing an opening through which said rotatable chuck is movable and separable from the bowl. In a preferred embodiment the bottom has a raised cylindrical portion containing the opening and, the rotatable chuck is positioned within the opening so that the wafer is in close proximity to the raised portion of the bowl so as to prevent solvent vapors from escaping the bowl through the opening.

Abstract: A method for coating a surface of a substrate material, such as a semiconductor wafer. The method includes providing a host controller, providing a self-controlled treatment module, connecting the self-controlled treatment module to the host controller, issuing treatment instructions from the host controller to the self-controlled treatment module, receiving the treatment instruction from the host controller at the self-controlled treatment module, and controlling the treatment of the material with the self-controlled treatment module to maintain compliance with the treatment instruction.

Abstract: An apparatus and methods for use in spin coating a coating material onto a wafer. The apparatus includes a rotatable chuck capable of supporting the wafer and a bowl having a bottom and a side defining an interior region, the bottom containing an opening through which said rotatable chuck is movable and separable from the bowl. In a preferred embodiment the bottom has a raised cylindrical portion containing the opening and, the rotatable chuck is positioned within the opening so that the wafer is in close proximity to the raised portion of the bowl so as to prevent solvent vapors form escaping the bowl through the opening.

Abstract: An apparatus and methods for use in spin coating a coating material onto a wafer. The apparatus includes a rotatable chuck capable of supporting the wafer and a bowl having a bottom and a side defining an interior region, the bottom containing an opening through which said rotatable chuck is movable and separable from the bowl. In a preferred embodiment the bottom has a raised cylindrical portion containing the opening and, the rotatable chuck is positioned within the opening so that the wafer is in close proximity to the raised portion of the bowl so as to prevent solvent vapors from escaping the bowl through the opening.

Abstract: A support including a plate having a top surface and a receiving hole, a lift element having a contacting end disposed through the receiving hole, a sensor disposed in a bore in the contacting end of the lift element, and a support member adjacent the top surface.

Abstract: An apparatus for exhausting coating materials used in the process of spin coating a top surface of a wafer, the wafer having an edge and a bottom surface that is supported and rotated by a rotatable chuck attached by a shaft to a spin motor. The apparatus includes a bowl having an exhausted drain configured to receive excess liquid and vapor from the spin coating and an assembly configured to maintain the drain at a negative pressure differential relative to the bowl. In a preferred embodiment, a baffle is attached to the bottom to limit the flow of the liquid and vapor into the drain to a predetermined direction.

Abstract: A method of disposing a wafer on a support member protruding from a surface. The method includes supporting the wafer in a first position defined by a lift extending through the surface and manipulating the surface to place the wafer on the support member.

Abstract: An apparatus and methods for use in spin coating a coating material onto a wafer. The apparatus includes a rotatable chuck capable of supporting the wafer and a bowl having a bottom and a side defining an interior region, the bottom containing an opening through which said rotatable chuck is movable and separable from the bowl. In a preferred embodiment the bottom has a raised cylindrical portion containing the opening and, the rotatable chuck is positioned within the opening so that the wafer is in close proximity to the raised portion of the bowl so as to prevent solvent vapors from escaping the bowl through the opening.

Abstract: An apparatus for exhausting coating materials used in the process of spin coating a top surface of a wafer, the wafer having an edge and a bottom surface that is supported and rotated by a rotatable chuck attached by a shaft to a spin motor. The apparatus includes a bowl having an exhausted drain configured to receive excess liquid and vapor from the spin coating and an assembly configured to maintain the drain at a negative pressure differential relative to the bowl. In a preferred embodiment, a baffle is attached to the bottom to limit the flow of the liquid and vapor into the drain to a predetermined direction.

Abstract: A method of exhausting vapors emanating from a surface. The method includes enclosing the surface and dividing the enclosed area into a stagnant region adjacent the surface and an interior region in communication with the stagnant region. The method also includes applying a suction to the interior region and admitting air into the interior region.

Abstract: Methods for exhausting coating materials used in the process of spin coating a top surface of a wafer, the wafer having an edge and a bottom surface that is supported and rotated by a rotatable chuck attached by a shaft to a spin motor. The apparatus includes a bowl having an exhausted drain configured to receive excess liquid and vapor from the spin coating and an assembly configured to maintain the drain at a negative pressure differential relative to the bowl. In a preferred embodiment, a baffle is attached to the bottom to limit the flow of the liquid and vapor into the drain to a predetermined direction.

Abstract: Apparatus for coating a surface of a semiconductor wafer includes at least one treatment module, a handling device that may access each of the treatment modules, and a host controller connected to the handling device and to each of the treatment modules. The treatment modules may include a coating assembly for coating the semiconductor wafer surface and may also include at least one thermal conditioning module. The host controller may control the handling device to move a semiconductor wafer relative to the treatment modules. The treatment modules may be disposed within opposing assemblies and may be removed from the assemblies without disabling the treatment modules remaining within the opposing assemblies.

Abstract: A support including a plate having a top surface and a receiving hole, a lift element having a contacting end disposed through the receiving hole, a sensor disposed in a bore in the contacting end of the lift element, and a support member adjacent the top surface.

Abstract: A vapor control apparatus including an endless rim, a stagnation plate and a cover having an exhaust port. The endless rim has a first edge engaging the cover, a second edge opposite the first edge, an interior region and an exterior region defined by the rim and the cover, and a flow passage from the interior region to the exterior region adjacent the cover. The exhaust port is in fluid communication with the interior region and the second edge is seatable on a wafer support. A stagnation plate is disposed in the interior region, defining a stagnant region intermediate the stagnation plate and the surface, and defining at least one flow path in fluid communication with the stagnant region and the interior region.

Abstract: A method for coating a surface of a substrate material, such as a semiconductor wafer. The method includes providing a host controller, providing a self-controlled treatment module, connecting the self-controlled treatment module to the host controller, issuing treatment instructions from the host controller to the self-controlled treatment module, receiving the treatment instruction from the host controller at the self-controlled treatment module, and controlling the treatment of the material with the self-controlled treatment module to maintain compliance with the treatment instruction.