Patents by Inventor Shawn D'Gama

Shawn D'Gama has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20250024605
    Abstract: Described herein are methods for forming welded and soldered connections to flexible interconnect circuits and assemblies comprising such connections. An assembly can include a weldable transition unit having a transition pad and a solderable pad. The transition pad may comprise aluminum and can be welded to the aluminum conductive trace of a flexible interconnect circuit. The solderable pad can be soldered to the electrical contact of a device (e.g., a resistor, capacitor). In some examples, the weldable transition unit may comprise a stiffener mechanically connected to the transition pad to provide mechanical support of the transition pad and devices soldered to the transition pad. In some examples, the device soldered to the weldable transition unit may include one or more individual electronic components. In some examples, the device soldered to the weldable transition unit may be a printed circuit board (PCB) having solderable traces.
    Type: Application
    Filed: July 12, 2024
    Publication date: January 16, 2025
    Applicant: CelLink Corporation
    Inventors: Jean-Paul Ortiz, Michael Nguyen, Malcolm Parker Brown, Kevin Michael Coakley, Robin Gorrell, Theodore Matthew Urdea, Shawn D'Gama
  • Publication number: 20240215173
    Abstract: Provided are flexible interconnect circuits comprising signal circuit elements. For example, a signal circuit element can be formed from the same metal sheet as a signal trace, thereby being monolithic with the signal circuit element. This integration of signal circuit elements into a flexible interconnect circuit reduces the number of additional operations and components (e.g., attaching external circuit elements). In some examples, a flexible interconnect circuit is used in a battery pack for interconnecting batteries while providing external terminals on the same side of the pack. Specifically, a flexible interconnect circuit comprises an interconnecting conductive layer (for connecting to batteries) and a return conductive layer, both extending between the first and second circuit edges. Each of these conductive layers comprises a corresponding external terminal at the first edge, while these layers are interconnected at the second edge.
    Type: Application
    Filed: March 5, 2024
    Publication date: June 27, 2024
    Applicant: CelLink Corporation
    Inventors: Jean-Paul Ortiz, Malcolm Parker Brown, Casey Anderson, Will Findlay, Gabrielle Tate, Shawn D'Gama, Arturo Cantu-Chavez
  • Patent number: 11950377
    Abstract: Provided are flexible interconnect circuits comprising signal circuit elements. For example, a signal circuit element can be formed from the same metal sheet as a signal trace, thereby being monolithic with the signal circuit element. This integration of signal circuit elements into a flexible interconnect circuit reduces the number of additional operations and components (e.g., attaching external circuit elements). In some examples, a flexible interconnect circuit is used in a battery pack for interconnecting batteries while providing external terminals on the same side of the pack. Specifically, a flexible interconnect circuit comprises an interconnecting conductive layer (for connecting to batteries) and a return conductive layer, both extending between the first and second circuit edges. Each of these conductive layers comprises a corresponding external terminal at the first edge, while these layers are interconnected at the second edge.
    Type: Grant
    Filed: April 14, 2023
    Date of Patent: April 2, 2024
    Assignee: CelLink Corporation
    Inventors: Jean-Paul Ortiz, Malcom Parker Brown, Casey Anderson, Will Findlay, Gabrielle Tate, Shawn D'Gama, Arturo Cantu-Chavez