Publication number: 20060071329
Abstract: In a chip package (10, 10?, 110, 210), first and second electrical power buses (14, 14?, 16, 16?, 114, 116, 214, 216) are each formed of an electrical conductor having a chip bonding portion (20, 22, 120, 122, 220, 222) and a lead portion (26, 26?, 28, 28?, 126, 128, 226, 228) extending away from the chip bonding portion. The chip bonding portions of the first and second electrical power buses have edges (32, 34, 132, 134, 232, 234) spaced apart from one another to define an extended electrical isolation gap (40, 140, 240). A plurality of chips (42, 44, 46, 142, 143, 144, 145, 146, 147, 148, 242) straddle the extended electrical isolation gap and are electrically connected with the first and second electrical power buses to receive electrical power from the first and second electrical power buses.
Type:
Application
Filed:
September 24, 2004
Publication date:
April 6, 2006
Inventor:
Shawn Du