Abstract: A composite wafer carrier according to an embodiment of the present invention comprises an operative portion formed of a first thermoplastic material and a support portion formed of a second different thermoplastic material. One of the operative portion and support portion is overmolded onto the other to form a gapless hermitic interface that securely bonds the portions together. The operative portion may be a transparent window, a portion of a latching mechanism or a wafer contact portion. Preferred embodiments of the invention include wafer carriers with said features, process carriers with said features and a process for manufacturing wafer carriers with said features.

Abstract: A manifold for a fuel cell includes at least one floating manifold port disposable in an oversized opening defined in a manifold frame, the manifold port being shiftable in at least one plane relative to the oversized opening for reducing the positional tolerance requirement of the manifold port, thereby effecting enhanced mating of adjacent fuel cell components. A method of forming a manifold for a fuel cell is further included.

Abstract: A wafer container with a door, the door has at least one latching mechanism, wherein the latching mechanism has a spring member that holds the latching mechanism at one or more desired positions that preferably correspond to latch-open and latch-closed conditions. In a preferred embodiment, the spring member has an over-center condition that urges the latching mechanism towards the favored positions, thereby resisting unintended actuation of the latching mechanism. Moreover, in preferred embodiments, the latching mechanism has soft stops at the latch open or latch closed condition that minimizes abrupt snapping into position of the latching mechanism. Preferred embodiments utilize a rotatable member configured as a cammed member with an elongate rigid plastic member having at least one node, forming a plastic spring. The spring is pivotally mounted on the rotatable member and pivotally mounted to the door structure.

Abstract: The present invention relates generally to a system and method for including a thin protective containment thermopolymer film (10), such as PEEK, in the molding process for handlers, transporters, carriers, trays and like devices utilized in the semiconductor processing industry. The thermoplastic film (10) of predetermined size and shape is selectively placed along a shaping surface (26) in a mold cavity (22) for alignment with a desired target surface of a moldable material. The film is permanently adhered to the moldable material. As a result, a compatible polymer film (10) can be selectively bonded only to those target surfaces where performance characteristics such as abrasion resistance, heat resistance, chemical resistance, outgassing containment, rigidity enhancement, hardness, creep reduction, fluid absorption containment, and the like is needed.

Abstract: A composite wafer carrier according to an embodiment of the present invention comprises an operative portion formed of a first thermoplastic material and a support portion formed of a second different thermoplastic material. One of the operative portion and support portion is overmolded onto the other to form a gapless hermitic interface that securely bonds the portions together. The operative portion may be a transparent window, a portion of a latching mechanism or a wafer contact portion. Preferred embodiments of the invention include wafer carriers with said features, process carriers with said features and a process for manufacturing wafer carriers with said features.

Abstract: A fuel cell system has an improved connector assembly to provide for the quick connection of a fuel cartridge and the fuel cell. Two leak resistant connector members with an easy to engage coupling mechanism that stably grips the two connector members to provide for flow between the members. The first connector member is adapted to engage the second connector member to form a unitary structure, which can establish fluid communication between the connector members. Generally, both the first connector member and the second connector member comprise a fluid flow path that can be each sealed/unsealed by a poppet valve or other suitable valve members. In some embodiments, the connector members can be engaged/disengaged by rotating an element of the coupling mechanism. The connector assemblies can be particularly useful for the connection of a fuel cell with a fuel cartridge.

Abstract: A wafer container for supporting semi-conductor wafer disks and for interfacing with processing equipment and methods for constructing the same. Wafer supports are positioned within an enclosure portion, the wafer supports having a plurality of vertically stacked shelves for defining slots. The wafer supports are secured within the enclosure portion rigidly at the bottom margin and resiliently at the top margin. In preferred embodiments resilient plastic spring members extend between the closed top and the wafer supports to substantially constrain lateral or forward-back movement of the wafer supports with respect to the closed top and to permit some vertical movement of the wafer support with respect to the closed top. The spring members may be configured as a leaf spring integral with an extending from the top margin of each wafer support.

Abstract: The present invention relates generally to a system and method for including a thin protective containment polymer film (100), such as Peek in the molding process for fluid processing devices utilized in the semiconductor processing industry. The thermoplastic film of predetermined size and shape is selectively placed along a shaping surface (110) in a mold cavity (106) for alignment with a desired target surface of a molded material. The molding processes causes a surface of the film (100) to bond to a contact surface of the moldable material such that the film (100) is permanently adhered to the moldable material. As a result, a comparable polymer film can be selectively bonded only to those target surfaces where performance characteristics such as abrasion resistance, heat resistance, chemical resistance, outgassing prevention, rigidity enhancement, fluid absorption prevention, ultraviolet resistance, friction reduction and the like is needed.

Abstract: The present invention relates generally to a system and method for including a thin conductive polymer film, such carbon-filled PEEK, in the molding process for handlers, transporters, carriers, trays and like devices utilized in the semiconductor processing industry. The conductive film of predetermined size and shape is selectively placed along a shaping surface in a mold cavity for alignment with a desired target surface of a moldable material. The molding process causes a surface of the film to bond to a contact surface of the moldable material such that the film is permanently adhered to the moldable material. As a result, a compatible conductive polymer can be selectively bonded only to those target surfaces where ESD is needed.

Abstract: Improved batteries, such as rechargeable batteries, comprise an anode, a cathode, a separator between the anode and the cathode and a core pin. In some embodiments, the core pin comprises a flow channel in a direction along a major axis of the core pin. Due to the presence of the flow channel, the improved batteries can have the ability to reduce the build up of undesirable gases within the cell, when combined with appropriate venting. In some embodiments, the flow channel can be provided through the interior of the core pin. In other embodiments, the flow channels can be created along the outer surface of the core pin with a core pin having protrusions that define indentations around the perimeter of the pin. The core pin can be made of a polymer.