Abstract: In accordance with embodiments of the present disclosure, a backplane for electrically coupling modular information handling resources to one or more other information handling resources, may include a printed circuit board, a first plurality of slots, and a second plurality of slots. The printed circuit board may have a first surface and a second surface opposite the first surface. The first plurality of slots may be mounted to the first surface and the second plurality of slots may be mounted to the second surface, such that each of the second plurality of slots are offset from an adjacent slot of the first plurality of slots in a direction parallel to a plane defined by the first surface and each of the second plurality of slots are rotated approximately 180 degrees from an adjacent slot of the first plurality of slots.

Abstract: In accordance with embodiments of the present disclosure, a backplane for electrically coupling modular information handling resources to one or more other information handling resources, may include a printed circuit board, a first plurality of slots, and a second plurality of slots. The printed circuit board may have a first surface and a second surface opposite the first surface. The first plurality of slots may be mounted to the first surface and the second plurality of slots may be mounted to the second surface, such that each of the second plurality of slots are offset from an adjacent slot of the first plurality of slots in a direction parallel to a plane defined by the first surface and each of the second plurality of slots are rotated approximately 180 degrees from an adjacent slot of the first plurality of slots.

Abstract: In accordance with embodiments of the present disclosure, a backplane for electrically coupling modular information handling resources to one or more other information handling resources, may include a printed circuit board, a first plurality of slots, and a second plurality of slots. The printed circuit board may have a first surface and a second surface opposite the first surface. The first plurality of slots may be mounted to the first surface and the second plurality of slots may be mounted to the second surface, such that each of the second plurality of slots are offset from an adjacent slot of the first plurality of slots in a direction parallel to a plane defined by the first surface and each of the second plurality of slots are rotated approximately 180 degrees from an adjacent slot of the first plurality of slots.

Abstract: In accordance with embodiments of the present disclosure, a backplane for electrically coupling modular information handling resources to one or more other information handling resources, may include a printed circuit board, a first plurality of slots, and a second plurality of slots. The printed circuit board may have a first surface and a second surface opposite the first surface. The first plurality of slots may be mounted to the first surface and the second plurality of slots may be mounted to the second surface, such that each of the second plurality of slots are offset from an adjacent slot of the first plurality of slots in a direction parallel to a plane defined by the first surface and each of the second plurality of slots are rotated approximately 180 degrees from an adjacent slot of the first plurality of slots.

Abstract: A storage assembly, system, and method provide a common platform that supports storage devices of different transverse dimensions. The storage assembly comprises a first storage device compactly disposed in a first storage carrier. The first storage device has a transverse dimension (e.g., a width) that is larger than that of second storage devices specifically designed to be compactly coupled to the common platform via an array of connectors. The storage device further comprises an interposer assembly coupled to a data interface of the first storage device. When the first storage carrier is placed for coupling the first storage device to an opposing connector of the array of connectors, the interposer assembly is disposed between the first storage device and the opposing connector to cause the first storage device to be displaced laterally away from an adjacent connector while coupling the first storage device to the opposing connector.

Abstract: External airflow rates from floor vents that provide chilled air to information handling systems are measured with a disposable tool to ensure compatibility of the information handling systems' external air cooling constraints with the cooling capacity of the floor vents. For instance, an information handling system manufacturer sends a disposable tool formed from a cardboard box to a user location. The tool has an open bottom to fit over a floor vent and a slat cut in a side surface to move in response to airflow that enters at the bottom. Pre-calibrated markings associated with expected airflow rates for information handling system cooling floor vents measure airflow rates by the degree of slat movement so that the user location and manufacturer may confer to confirm the compatibility of the user location cooling capacity with selected information handling systems.

Abstract: A grid array socket pin field is protected during manufacture of an information handling system with a dust cap having first and second attachment devices. The first attachment device secures the cap to the socket during assembly of the socket in the computer. The second attachment device secures the cap to a load mechanism assemble proximate the socket. Engagement of the second attachment device to the cap automatically releases the cap from the socket to allow removal of the cap from the socket by actuation of the load mechanism to an open position. The second attachment device secures the cap to the load mechanism until a processor is placed in the socket.

Abstract: A grid array socket pin field is protected during manufacture of an information handling system with a dust cap having first and second attachment devices. The first attachment device secures the cap to the socket during assembly of the socket in the computer. The second attachment device secures the cap to a load mechanism assemble proximate the socket. Engagement of the second attachment device to the cap automatically releases the cap from the socket to allow removal of the cap from the socket by actuation of the load mechanism to an open position. The second attachment device secures the cap to the load mechanism until a processor is placed in the socket.

Abstract: A grid array socket pin field is protected during manufacture of an information handling system with a dust cap having first and second attachment devices. The first attachment device secures the cap to the socket during assembly of the socket in the computer. The second attachment device secures the cap to a load mechanism assemble proximate the socket. Engagement of the second attachment device to the cap automatically releases the cap from the socket to allow removal of the cap from the socket by actuation of the load mechanism to an open position. The second attachment device secures the cap to the load mechanism until a processor is placed in the socket.

Abstract: An interposer module may be used between a unified architecture blade compute module and a mid-plane of a present technology blade compute module system. The interposer module may contain input-output controllers for desired input-output fabrics. The mid-plane couples these input-output controllers to associated input-output fabric switches. The same unified architecture blade compute module may also be used without the interposer module in a new technology blade compute module system having multi-context fabric input-output controllers.

Abstract: External airflow rates from floor vents that provide chilled air to information handling systems are measured with a disposable tool to ensure compatibility of the information handling systems' external air cooling constraints with the cooling capacity of the floor vents. For instance, an information handling system manufacturer sends a disposable tool formed from a cardboard box to a user location. The tool has an open bottom to fit over a floor vent and a slat cut in a side surface to move in response to airflow that enters at the bottom. Pre-calibrated markings associated with expected airflow rates for information handling system cooling floor vents measure airflow rates by the degree of slat movement so that the user location and manufacturer may confer to confirm the compatibility of the user location cooling capacity with selected information handling systems.

Abstract: An interlocking heat sink is shaped such that it geometrically mates with an adjacent heat sink such that a linear gap for air flow is not formed between adjacent heat sinks. In multiple processor systems, an interlocking heat sink is associated with each processor.