Abstract: A method for attaching a capacitor to the feedthrough assembly of a medical device is provided. The capacitor includes a lower surface, and the feedthrough assembly includes a ferrule having a cavity therethrough for receiving at least one terminal pin. The feedthrough assembly is configured to be coupled to the medical device, and the cavity is configured to receive therein an insulating structure having an upper surface. The method comprises threading a first washer over the terminal pin, and placing a body of epoxy in contact with the first washer. The capacitor is positioned over the terminal pin such that the first washer and the body of epoxy are between the lower surface of the capacitor and the upper surface of the insulating structure. The body of epoxy is cured to couple the capacitor to the insulating structure. During curing, the body of epoxy is substantially confined between the upper surface and the lower surface by the ferrule, the insulating structure, the capacitor, and the first washer.

Abstract: A method for attaching a capacitor to the feedthrough assembly of a medical device having a terminal pin comprises threading a first washer over the terminal pin, and placing a body of epoxy in contact with the first washer. The capacitor is positioned over the terminal pin such that the first washer and the body of epoxy are between the lower surface of the capacitor and a support surface. The body of epoxy is cured to couple the capacitor to the insulating structure. During curing, the body of epoxy is substantially confined between the upper surface and the lower surface by the ferrule, the insulating structure, the capacitor, and the first washer.

Abstract: A filter apparatus for use with an implantable medical device includes a printed circuit board having a first trace connected to ground and adjacent feedthrough conductors extending through the printed circuit board. A chip capacitor is electrically connected between the adjacent feedthrough conductors, and is further electrically connected to the first trace on the printed circuit board.

Abstract: An implantable medical device is provided including a housing, an external circuit element extending outwardly from the housing, an internal circuit enclosed by the housing, a feedthrough array disposed along the housing having at least one filtered feedthrough and at least one unfiltered feedthrough, wherein the unfiltered feedthrough is adapted for connection to the outwardly extending circuit element; and including means for minimizing electromagnetic coupling between the filtered feedthrough and the unfiltered feedthrough.

Abstract: An implantable medical electrode comprising an electrode substrate having an exterior surface, and a zirconium nitride coating disposed over the exterior surface.

Abstract: An electronic module assembly for an implantable medical device includes a non-conductive block having an opening for accepting a feedthrough conductor. The block has opposite first and second ends and opposite first and second sides. A bond pad is located on the first end of the block for electrical connection to a feedthrough conductor, and the bond pad extends to the first side of the block to provide an electrical connection region there.

Abstract: A medical device feedthrough assembly includes a flange plate formed with a plurality of receptacles. A feedthrough subassembly is mounted within each of the receptacles, and a ferrule of each subassembly is coupled to the flange plate.

Abstract: A hermetic implantable medical device (IMD) is provided with a single or multi-pin arrangement including selected glass to metal seals for a feedthrough including a ceramic disk member coupled to the sealing glass surface in potential contact with body fluids. By judicious selection of component materials (ferrule, seal insulator and pin) provides for either compression or match seals for electrical feedthroughs (having a single or multi-pin array) provide corrosion resistance and biocompatibility required in IMDs. The resultant feedthrough configuration accommodates one pin within a single ferrule or at least two pins in a single ferrule having a pin surrounded by insulator material (e.g.

Abstract: According to one aspect of the invention, an improved multi-polar feedthrough array employs a particular metallic ferrule material for improved dimensional stability during initial fabrication and sustained hermetic operation. According to the invention, the IMD enclosure consists of grade 2 titanium and the ferrule material comprises grade 4 titanium or grade 5 titanium. In one form of the invention, the multi-polar feedthrough assembly comprises a filtered feedthrough array (e.g., employing capacitive filters coupled to the electrically conductive pins or serpentine conductors of the array). According to another aspect of the invention, the improved multi-polar feedthrough array incorporates additional pins, thus further increasing the footprint of the array, and the additional pins provide analog electrical communication between operative circuitry inside an IMD and analog components external to the IMD.