Patents by Inventor Shawn M. Lewis

Shawn M. Lewis has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Polishing systems, methods of polishing substrates, and methods of preparing liquids for semiconductor fabrication processes
    Patent number: 6206757
    Abstract: The invention encompasses polishing systems for polishing semiconductive material substrates, and encompasses methods of cleaning polishing slurry from semiconductive substrate surfaces. In one aspect, the invention includes a method of cleaning a polishing slurry from a substrate surface comprising: a) providing a substrate surface having a polishing slurry in contact therewith; b) providing a liquid; c) injecting a gas into the liquid to increase a total dissolved gas concentration in the liquid; and d) after the injecting, providing the liquid against the substrate surface to displace the polishing slurry from the substrate surface.
    Type: Grant
    Filed: April 22, 1999
    Date of Patent: March 27, 2001
    Assignee: Micron Technology, Inc.
    Inventors: Dan G. Custer, Aaron Trent Ward, Shawn M. Lewis
  • Polishing systems, methods of polishing substrates, and methods of preparing liquids for semiconductor fabrication processes
    Patent number: 6200196
    Abstract: The invention encompasses polishing systems for polishing semiconductive material substrates, and encompasses methods of cleaning polishing slurry from semiconductive substrate surfaces. In one aspect, the invention includes a method of cleaning a polishing slurry from a substrate surface comprising: a) providing a substrate surface having a polishing slurry in contact therewith; b) providing a liquid; c) injecting a gas into the liquid to increase a total dissolved gas concentration in the liquid; and d) after the injecting, providing the liquid against the substrate surface to displace the polishing slurry from the substrate surface.
    Type: Grant
    Filed: April 22, 1999
    Date of Patent: March 13, 2001
    Assignee: Micron Technology, Inc.
    Inventors: Dan G. Custer, Aaron Trent Ward, Shawn M. Lewis
  • Polishing systems, methods of polishing substrates, and method of preparing liquids for semiconductor fabrication process
    Patent number: 6007406
    Abstract: The invention encompasses polishing systems for polishing semiconductive material substrates, and encompasses methods of cleaning polishing slurry from semiconductive substrate surfaces. In one aspect, the invention includes a method of cleaning a polishing slurry from a substrate surface comprising: a) providing a substrate surface having a polishing slurry in contact therewith; b) providing a liquid; c) injecting a gas into the liquid to increase a total dissolved gas concentration in the liquid; and d) after the injecting, providing the liquid against the substrate surface to displace the polishing slurry from the substrate surface.
    Type: Grant
    Filed: December 4, 1997
    Date of Patent: December 28, 1999
    Assignee: Micron Technology, Inc.
    Inventors: Dan G. Custer, Aaron Trent Ward, Shawn M. Lewis