Abstract: A mandrel assembly secures to a mandrel and drill pipe to start the drill pipe through the RCD. The mandrel assembly attaches to different drill pipe configurations via an attachment finger. The attachment finger secures the mandrel to the drill pipe. The attachment finger inserts into the attachment aperture of the mandrel and the drill pipe to secure the mandrel with the drill pipe. Once attached, the user removes the mandrel by pulling the mandrel away from the drill pipe via removal apertures.

Abstract: A turnover mechanism is configured to receive and flip over parts delivered by an in-feed conveyor to an out-feed conveyor. The turnover mechanism includes a frame and a gripper assembly coupled to the frame. The gripper assembly is configured to secure and move a part having one surface treated from the in-feed conveyor. The turnover mechanism further includes a flipper assembly coupled to the frame, the flipper assembly being configured to rotate and deliver the part to the out-feed conveyor with an opposite surface of the part exposed for treatment.

Abstract: A turnover mechanism is configured to receive and flip over parts delivered by an in-feed conveyor to an out-feed conveyor. The turnover mechanism includes a frame and a gripper assembly coupled to the frame. The gripper assembly is configured to secure and move a part having one surface treated from the in-feed conveyor. The turnover mechanism further includes a flipper assembly coupled to the frame, the flipper assembly being configured to rotate and deliver the part to the out-feed conveyor with an opposite surface of the part exposed for treatment.

Abstract: An integrated circuit die having silicon on insulator (SOI) structure is analyzed in a manner that enhances the ability to detect photoemissions from the die. According to an example embodiment of the present invention, one of two or more lenses having a higher relative photon count is identified and used to analyze a semiconductor die. The die has at least a portion of the insulator of the SOI structure exposed, and photon emissions are detected using each lens via the exposed insulator in response to the die being stimulated. The number of photons detected using each lens is compared, and the lens having a higher photon count rate is identified, optimizing the photon count for the particular type of die preparation used to expose the insulator. The identified lens is then used with the high-speed detector to detect photoemissions from the die, and the detected photoemissions are used to analyze the die.