Patents by Inventor Shawn O. Powell

Shawn O. Powell has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11626357
    Abstract: 3D electrical integration is provided by connecting several component carriers to a single substrate using contacts at the edges of the component carriers making contact to a 2D contact array (e.g., a ball grid array or the like) on the substrate. The resulting integration of components on the component carriers is 3D, thereby providing much higher integration density than in 2D approaches.
    Type: Grant
    Filed: May 28, 2021
    Date of Patent: April 11, 2023
    Assignee: FormFactor, Inc.
    Inventors: Roy J. Henson, Shawn O. Powell
  • Publication number: 20210375733
    Abstract: 3D electrical integration is provided by connecting several component carriers to a single substrate using contacts at the edges of the component carriers making contact to a 2D contact array (e.g., a ball grid array or the like) on the substrate. The resulting integration of components on the component carriers is 3D, thereby providing much higher integration density than in 2D approaches.
    Type: Application
    Filed: May 28, 2021
    Publication date: December 2, 2021
    Inventors: Roy J. Henson, Shawn O. Powell