Abstract: A flat panel image sensor includes a thin film transistor (TFT) and diode array, a conformal insulating layer on a top surface of the TFT and diode array, a planarized dielectric layer on a top surface of the conformal insulating layer, a first metalized via in the planarized dielectric layer and the conformal insulating layer to contact a metalized portion of the TFT and diode array, a second metalized via in the planarized dielectric layer and the conformal insulation layer to contact a diode portion of the TFT and diode array, and a passivation layer over the first and second vias and an upper surface of the planarized dielectric layer.

Abstract: A multilayer structure for use in a photosensor. The multilayer structure includes a substrate, a thin film transistor comprising a metal oxide semiconductor channel and a photosensing element comprising amorphous silicon. The thin film transistor is electrically connected to the photosensing element, and the thin film transistor and photosensing element are on the substrate and separated by a hydrogen barrier structure.

Abstract: Method for temporarily attaching a substrates to a rigid carrier is described which includes forming a sacrificial layer of a thermally-decomposable polymer, e.g., poly(alkylene carbonate), and bonding the flexible substrate to the rigid carrier with the sacrificial layer positioned therebetween. Electronic components and/or circuits may then be fabricated or other semiconductor processing steps employed (e.g., backgrinding) on the attached substrate. Once fabrication is completed, the substrate may be detached from the rigid carrier by heating the assembly to decompose the sacrificial layer.

Abstract: Some embodiments include a method of preparing a flexible substrate assembly. Other embodiments of related methods and structures are also disclosed.

Abstract: Some embodiments include a method of providing a semiconductor device. The method can include: (a) providing a flexible substrate; (b) depositing at least one layer of material over the flexible substrate, wherein the deposition of the at least one layer of material over the flexible substrate occurs at a temperature of at least 180° C.; and (c) providing a diffusion barrier between a metal layer and an a-Si layer. Other embodiments are disclosed in this application.

Abstract: Methods are described for addressing the bowing and/or warping of flexible substrates, attached to a rigid carrier, which occurs as a result of the thermal challenges of semiconductor processing. In particular, viscoelastic adhesives are provided which can bond a flexible substrate to a rigid carrier and mediate the thermal mismatch which often is present due to the distinctly different materials properties of most flexible substrates, such as plastic films, with respect to rigid carriers, such as silicon wafers. Assemblies are also provided which are produced according to the methods described herein.

Abstract: Some embodiments include a method of preparing a flexible substrate assembly. Other embodiments of related methods and structures are also disclosed.

Abstract: Some embodiments teach a method of preparing a flexible substrate assembly. The method can include: (a) providing a carrier substrate; (b) providing a cross-linking adhesive; (c) providing a plastic substrate; and (d) coupling the carrier substrate to the plastic substrate using the cross-linking adhesive. Other embodiments are disclosed in this application.

Abstract: A flexible, transparent electrode structure and a method of fabrication thereof are provided comprising a transparent electrode which may maintain electrical connectivity across a surface of a flexible substrate so that the substrate may flex without affecting the integrity of an electrical contact. The transparent electrode includes conductive nanowires that are coupled to the substrate through a conducting oxide layer. The conducting oxide layer effectively provides a template onto which the nanowires are deposited and serves to anchor the nanowires to the substrate surface.

Abstract: Some embodiments include a method of providing a semiconductor device. The method can include: (a) providing a flexible substrate; (b) depositing at least one layer of material over the flexible substrate, wherein the deposition of the at least one layer of material over the flexible substrate occurs at a temperature of at least 180° C.; and (c) providing a diffusion barrier between a metal layer and an a-Si layer. Other embodiments are disclosed in this application.

Abstract: Some embodiments teach a method of preparing a flexible substrate assembly. The method can include: (a) providing a carrier substrate; (b) providing a cross-linking adhesive; (c) providing a plastic substrate; and (d) coupling the carrier substrate to the plastic substrate using the cross-linking adhesive. Other embodiments are disclosed in this application.

Abstract: Methods are described for addressing the bowing and/or warping of flexible substrates, attached to a rigid carrier, which occurs as a result of the thermal challenges of semiconductor processing. In particular, viscoelastic adhesives are provided which can bond a flexible substrate to a rigid carrier and mediate the thermal mismatch which often is present due to the distinctly different materials properties of most flexible substrates, such as plastic films, with respect to rigid carriers, such as silicon wafers. Assemblies are also provided which are produced according to the methods described herein.

Abstract: Method for temporarily attaching a substrates to a rigid carrier is described which includes forming a sacrificial layer of a thermally-decomposable polymer, e.g., poly(alkylene carbonate), and bonding the flexible substrate to the rigid carrier with the sacrificial layer positioned therebetween. Electronic components and/or circuits may then be fabricated or other semiconductor processing steps employed (e.g., backgrinding) on the attached substrate. Once fabrication is completed, the substrate may be detached from the rigid carrier by heating the assembly to decompose the sacrificial layer.

Abstract: A flexible, transparent electrode structure and a method of fabrication thereof are provided comprising a transparent electrode which may maintain electrical connectivity across a surface of a flexible substrate so that the substrate may flex without affecting the integrity of an electrical contact. The transparent electrode includes conductive nanowires that are coupled to the substrate through a conducting oxide layer. The conducting oxide layer effectively provides a template onto which the nanowires are deposited and serves to anchor the nanowires to the substrate surface.

Abstract: Circuit boards (1100, 1500, 1600, 1700) and methods for fabricating circuit boards that include heaters for maintaining temperature sensitive components at an operating temperature are provided. Resistive traces (602, 702,704) are included in the circuit boards proximate temperature sensitive apparatus (1004, 1304, 1602, 1712). Thermally conductive patches (802, 902, 904) are interposed between the resistive traces and the temperature sensitive components. The thermally conductive patches establish zones of relatively uniform temperatures. According to a preferred embodiment of the invention the temperature sensitive apparatus comprises a fluid conduit (1004).

Abstract: A phosphor includes about 99 dry weight % cathodoluminescent particles, which have a mean particle diameter equal to about 4 microns, and about 1 dry weight % non-cathodoluminescent inorganic particles, which have a mean particle diameter equal to about 20 microns. A method for fabricating phosphor includes the steps of providing an aqueous polyvinyl alcohol solution having about 7.5 weight % polyvinyl alcohol, adding cathodoluminescent particles to the aqueous polyvinyl alcohol solution to provide a cathodoluminescent particle solution having about 16.5 volume % cathodoluminescent particles, and adding non-cathodoluminescent inorganic particles to the cathodoluminescent particle solution to provide a phosphor paste. Non-cathodoluminescent inorganic particles function as dispersants and suspension-stabilizing agents in the phosphor paste.