Abstract: A cooling system includes a chassis defining a housing and including a wall having an outer surface. A computing device is located in the housing. A heat transfer device located in the housing engages the computing device and the wall, providing for heat transfer from the computing device, through the heat transfer device, and through the wall to the outer surface to produce supplemental passive cooling of the computing device via the outer surface. A heat dissipation aperture is defined by the chassis, and a heat dissipation device located in the housing adjacent the heat dissipation aperture engages the heat transfer device, which provides for heat transfer from the heat transfer device to the heat dissipation device. A forced convection device located in the housing generates an airflow past the heat dissipation structure and through the heat dissipation aperture to enable primary active cooling of the computing device.

Abstract: An external chassis wall liquid cooling system includes a chassis defining a chassis housing. A chassis wall is located on the chassis and includes a first surface that is located adjacent the chassis housing and a second surface that is located opposite the chassis wall from the first surface and that provides an outer surface of the chassis. A liquid cooling channel is defined by the chassis wall and extends through the chassis wall between the first surface and the second surface. A liquid is located in the liquid cooling channel, and a pump is coupled to the liquid cooling channel and configured to move the liquid through the liquid cooling channel. A fan system in the chassis housing may move air past heat producing components to transfer heat produced by those heat producing components, and the liquid may further dissipate that heat out of the chassis.

Abstract: An external chassis wall liquid cooling system includes a chassis defining a chassis housing. A chassis wall is located on the chassis and includes a first surface that is located adjacent the chassis housing and a second surface that is located opposite the chassis wall from the first surface and that provides an outer surface of the chassis. A liquid cooling channel is defined by the chassis wall and extends through the chassis wall between the first surface and the second surface. A liquid is located in the liquid cooling channel, and a pump is coupled to the liquid cooling channel and configured to move the liquid through the liquid cooling channel. A fan system in the chassis housing may move air past heat producing components to transfer heat produced by those heat producing components, and the liquid may further dissipate that heat out of the chassis.

Abstract: An external chassis wall liquid cooling system includes a chassis defining a chassis housing. A chassis wall is located on the chassis and includes a first surface that is located adjacent the chassis housing and a second surface that is located opposite the chassis wall from the first surface and that provides an outer surface of the chassis. A liquid cooling channel is defined by the chassis wall and extends through the chassis wall between the first surface and the second surface. A liquid is located in the liquid cooling channel, and a pump is coupled to the liquid cooling channel and configured to move the liquid through the liquid cooling channel. A fan system in the chassis housing may move air past heat producing components to transfer heat produced by those heat producing components, and the liquid may further dissipate that heat out of the chassis.

Abstract: An information handling system (IHS) cooling system includes an IHS chassis defining an IHS chassis air inlet. A cooling chassis supports the IHS chassis on a support base. An air supply duct extends from the cooling chassis such that an air supply duct outlet on the air supply duct is immediately adjacent the IHS chassis air inlet. An air cooling subsystem is located in the cooling chassis and is operable to cool air that is drawn into the cooling chassis and supply the cooled air to the IHS chassis air inlet through the air supply duct. The IHS chassis may be a conventional IHS chassis that is designed for sub-35 degree Celsius ambient temperatures, and the cooling chassis may be provided for the conventional IHS chassis when used in extreme environments with high ambient temperatures above 35 degrees Celsius.

Abstract: An information handling system (IHS) cooling system includes an IHS chassis defining an IHS chassis air inlet. A cooling chassis supports the IHS chassis on a support base. An air supply duct extends from the cooling chassis such that an air supply duct outlet on the air supply duct is immediately adjacent the IHS chassis air inlet. An air cooling subsystem is located in the cooling chassis and is operable to cool air that is drawn into the cooling chassis and supply the cooled air to the IHS chassis air inlet through the air supply duct. The IHS chassis may be a conventional IHS chassis that is designed for sub-35 degree Celsius ambient temperatures, and the cooling chassis may be provided for the conventional IHS chassis when used in extreme environments with high ambient temperatures above 35 degrees Celsius.

Abstract: An interposer module may be used between a unified architecture blade compute module and a mid-plane of a present technology blade compute module system. The interposer module may contain input-output controllers for desired input-output fabrics. The mid-plane couples these input-output controllers to associated input-output fabric switches. The same unified architecture blade compute module may also be used without the interposer module in a new technology blade compute module system having multi-context fabric input-output controllers. The multi-context fabric input-output controllers may be coupled to the unified architecture blade compute modules of the information handling system by a switch such as a PCI Express (PCIe) switch.

Abstract: In an embodiment, a heat conduction apparatus includes a heat sink. A coupling member is located on the heat sink. The coupling member is operable to releaseably and interchangeably couple one of a selected blank member and a cold plate to the heat sink in response to a cooling requirement of the heat sink. In an embodiment, a method of cooling an information handling system includes providing cooling by coupling a heat sink to a heat generating component. The method further provides selectably coupling a blank member to the heat sink providing cooling by a first fluid coolant. The method further provides selectably coupling a cold plate to the heat sink providing cooling by a first fluid coolant and a second fluid coolant.

Abstract: In an embodiment, a heat conduction apparatus includes a heat sink. A coupling member is located on the heat sink. The coupling member is operable to releaseably and interchangeably couple one of a selected blank member and a cold plate to the heat sink in response to a cooling requirement of the heat sink. In an embodiment, a method of cooling an information handling system includes providing cooling by coupling a heat sink to a heat generating component. The method further provides selectably coupling a blank member to the heat sink providing cooling by a first fluid coolant. The method further provides selectably coupling a cold plate to the heat sink providing cooling by a first fluid coolant and a second fluid coolant.